[미국특허]
Method and system for an interchangeable headset module resistant to moisture infiltration
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
H04M-009/00
H04M-001/00
H04R-025/00
출원번호
US-0874972
(2004-06-23)
등록번호
US-7391863
(2008-06-24)
발명자
/ 주소
Viduya,Andres
Zatezalo,Douglas Mark
출원인 / 주소
Vocollect, Inc.
대리인 / 주소
Wood, Herron & Evans, LLP
인용정보
피인용 횟수 :
27인용 특허 :
25
초록▼
A headset assembly includes a moisture-proof and temperature resistant headset module. The headset module is sealed against moisture and is constructed from materials that are durable and can withstand constant use, physical abuse, and rapid swings in temperature and other environmental conditions.
A headset assembly includes a moisture-proof and temperature resistant headset module. The headset module is sealed against moisture and is constructed from materials that are durable and can withstand constant use, physical abuse, and rapid swings in temperature and other environmental conditions. Furthermore, the headset module is interchangeable with a variety of headset frames so as to provide comfort during prolonged use and in high ambient noise environments.
대표청구항▼
The invention claimed is: 1. A headset module comprising: a microphone assembly sealed against moisture and including a circular cavity; an electronic enclosure containing a speaker element and sealed against moisture, the enclosure having a circular end configured to fit within the circular cavity
The invention claimed is: 1. A headset module comprising: a microphone assembly sealed against moisture and including a circular cavity; an electronic enclosure containing a speaker element and sealed against moisture, the enclosure having a circular end configured to fit within the circular cavity of the microphone assembly; a sealing element located within the circular cavity to engage the circular end so the electronic enclosure is coupled with the microphone assembly via a first moisture-proof seal; the circular cavity including sides that friction fit against the circular end for rotation of the microphone assembly with respect to the electronic enclosure. 2. The headset module of claim 1, wherein the microphone assembly includes: a microphone sealed against moisture; a flexible gooseneck coupled with the microphone; one or more wires extending through the flexible gooseneck; and a housing coupled to the flexible gooseneck via a second moisture-proof seal. 3. The headset module of claim 2, wherein the flexible gooseneck and the housing are sonically welded together. 4. The headset module of claim 2, wherein the second moisture proof seal includes: a strain relief cover; a surface on the housing configured to receive the strain relief cover; and a sonic weld between the strain relief cover and the surface. 5. The headset module of claim 4, wherein the housing and the strain relief cover are constructed from polycarbonate/ABS plastic. 6. The headset module of claim 1, wherein: the sides include a plurality of first surfaces; and the circular end includes a plurality of second surfaces each shaped to engages the first surfaces, whereby the circular end may be releasably positioned in one of multiple positions in which one of the first surface engages one of the second surfaces. 7. The headset module of claim 1, wherein: the electronic enclosure includes a first half and a second half that couple together and are sonically welded together along a substantial portion of a mating surface where the two halves are adjacent. 8. The headset module of claim 1, further comprising: a cable assembly that extends through an opening of the electronic disclosure. 9. The headset module of claim 8, wherein the cable assembly includes a surface that engages the opening of the electronic assembly to create a second moisture-proof seal. 10. The headset module of claim 8, wherein: the cable assembly includes a plurality of splines; the electronic enclosure includes a opening with a groove, wherein the groove is shaped to sealingly engage at least one of the splines. 11. The headset module of claim 1, wherein the speaker element is sandwiched between two gaskets. 12. The headset module of claim 1, further comprising a electronic assembly comprising: a printed circuit board coupled with a cable assembly; a circuit board holder configured on a first side to accept the printed circuit board; a first gasket sealingly engaging a second side of the circuit board holder; the speaker element having a third side adjacent the first gasket; a second gasket sealingly engaging a fourth side of the speaker element; a mylar coating across the second gasket. 13. The headset module of claim 1, wherein: the electronic enclosure includes a first half and a second half that seal together; and the electronic assembly is enclosed within the sealed first and second halves. 14. The headset module of claim 1 ,wherein the headset module satisfies the requirements for electronic enclosures specified by IP-67. 15. The headset module of claim 1, further comprising: a first surface configured to engage a complimentary surface on a headset frame such that the headset module and the headset frame are releasably coupled. 16. The headset module of claim 15, wherein the first surface includes one or more tabs. 17. A headset assembly comprising: a headset module with a microphone and speaker, the headset module being resistant to moisture infiltration and including a first surface that has at least one of a detent or resilient member; an earpiece including an ear pad and a housing coupled with the ear pad; the earpiece including a second surface that is configured to engage the first surface, the second surface including at least one of a detent or resilient member wherein when the first and second surfaces are engaged, the detent and resilient member engage and the headset module and the earpiece are releasably coupled together; and a headset frame configured to couple with the earpiece. 18. The headset assembly of claim 17 wherein: the headset frame and the earpiece are configured for a high ambient noise environment. 19. The headset assembly of claim 17, wherein the headset frame and the earpiece are configured for a lightweight environment. 20. The headset assembly of claim 17, wherein the headset frame includes: a yoke constructed from polycarbonate/ABS plastic; a band arrangement coupled at a first end with a yoke, the band arrangement; and a bumper coupled with a second end of the band arrangement. 21. The headset assembly of claim 20, wherein the band arrangement is constructed from one of stainless steel and nickel-plated steel. 22. The headset assembly of claim 17, wherein the earpiece comprises: a locking mechanism coupled with the ear pad; and the housing coupled with the locking mechanism, wherein the second surface is located on the housing. 23. The headset assembly of claim 22, wherein the locking mechanism and the housing couple together without separate fasteners. 24. A headset frame comprising: a band arrangement; a bumper coupled with one end of the band arrangement; and an ear piece coupled with another end of the band arrangement, the ear piece including an enclosure configured to receive a headset module, the headset module including: a speaker and a microphone; wherein the earpiece is configured with a surface to releasably engage a corresponding surface of the headset module when the headset module is received within the enclosure of the ear piece; so that a single headset module might be selectively utilized with various different headset frames and earpieces. 25. The headset frame of claim 24, wherein the frame is one of a high ambient noise model and a lightweight model. 26. The headset frame of claim 24, wherein the band arrangement is constructed from one of stainless steel and nickel plated steel. 27. The headset frame of claim 24, wherein the headset module is resistant to water infiltration.
Lucey Robert E. (Sudbury MA) Ela John (Atkinson NH) Lada Christopher O. (Palo Alto CA) Shubert Lawrence G. (Palo Alto CA) Loew Christopher (San Francisco CA), Adjustable telephone headset.
Derhaag Robert L. (1364 Calle Crucero San Marcos CA 92069) Rose David B. (1827 Drescher St. San Diego CA 92111), Headset construction and method of making same.
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