Method and apparatus for providing thermal management in an electronic device
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
H05K-007/20
H05K-005/00
출원번호
US-0583385
(2006-10-19)
등록번호
US-7394654
(2008-07-01)
발명자
/ 주소
Zieman,Christopher E.
Mason,Todd
출원인 / 주소
Cisco Technology, Inc.
대리인 / 주소
Bainwood Huang
인용정보
피인용 횟수 :
15인용 특허 :
15
초록▼
An electronic system includes a chassis, an air flow distribution assembly having a first set of baffles disposed within an intake volume of the chassis and a second set of baffles disposed in proximity to an air outlet of the chassis. The first set of baffles is configured to turn the flow of an ai
An electronic system includes a chassis, an air flow distribution assembly having a first set of baffles disposed within an intake volume of the chassis and a second set of baffles disposed in proximity to an air outlet of the chassis. The first set of baffles is configured to turn the flow of an air stream approximately 90 degrees, relative to an inlet flow direction of the air stream, toward circuit boards disposed within the chassis. The second set of baffles is configured as a flow splitter that receives the air stream from the circuit boards and partitions the air stream into separate portions prior to the air stream exiting via the air outlet. The use of both the first and second set of baffles redirects and distributes the air stream, flowing into the air inlet, in a substantially even manner across the circuit board component mounting surfaces of the circuit boards disposed within the system.
대표청구항▼
What is claimed is: 1. A chassis configured to receive a circuit board, comprising: a first wall defining an air inlet in proximity to a chassis base and an opposing second wall defining an air outlet in proximity to a chassis cover, the chassis cover opposing the chassis base; a first set of baffl
What is claimed is: 1. A chassis configured to receive a circuit board, comprising: a first wall defining an air inlet in proximity to a chassis base and an opposing second wall defining an air outlet in proximity to a chassis cover, the chassis cover opposing the chassis base; a first set of baffles disposed within the chassis between the first wall and the second wall, each baffle of the first set of baffles configured to direct at least a portion of an air stream flowing through the air inlet from a first direction to a second direction toward the circuit board such that the air stream flows substantially parallel to a planar surface of the circuit board, the first direction being substantially orthogonal to each baffle of the first set of baffles and the second direction being substantially orthogonal to the first direction; and a second set of baffles disposed in proximity to the air outlet, the second set of baffles configured to divide the air stream flowing substantially parallel to the planar surface of the circuit board into a plurality of air streams; wherein the second set of baffles are configured to divide the air stream flowing substantially parallel to the planar surface of the circuit board into the plurality of air streams, the air stream flowing substantially parallel to the planar surface of the circuit board along the second direction, the second direction being substantially orthogonal to each baffle element of the second set of baffles and direct the plurality of air streams along a third direction toward a fan assembly, the third direction being substantially orthogonal to the second direction. 2. The chassis of claim 1, wherein the first set of baffles are disposed in a stepwise configuration relative to the air inlet such that each baffle element of the first set of baffles is configured to direct a distinct portion of the air stream flowing through the air inlet from the first direction to the second direction. 3. The chassis of claim 1, wherein each baffle element of the first set of baffles comprises a first edge opposing the chassis cover and a second edge opposing the chassis base, the first edge of a first baffle element of the first set of baffles extending a first distance above the first edge of an adjacently positioned second baffle element and the second edge of the first baffle element of the first set of baffles extending a second distance above the second edge of the adjacently positioned second baffle element and wherein a height of the first baffle element of the first set of baffles is substantially equal to a height of the second baffle element of the first set of baffles. 4. The chassis of claim 3, wherein a segment defined between the second edge of the first baffle element of the set of baffles and the first edge of the second baffle element of the set of baffles defines an angle relative to the chassis base, the angle being in the range of about 23 degrees to about 28 degrees. 5. The chassis of claim 1, wherein the second set of baffles comprises: a first baffle element disposed between the first wall and the second wall; a second baffle element disposed between the first wall and the first baffle element of the second set of baffles; and a third baffle element disposed between the first baffle element of the second set of baffles and the second wall. 6. The chassis of claim 5, wherein: the first baffle element is disposed at a location that is substantially one-half of a distance between the first wall and a midplane of the chassis; the second baffle element is disposed at a location that is substantially one-half of a distance between the first wall and the first baffle element; and the third baffle element is disposed at a location that is substantially one-half of a distance between the first baffle element and the midplane of the chassis. 7. The chassis of claim 1, wherein each baffle element of the second set of baffles comprises a first member and a second member coupled to the first member, the first member extending toward the circuit board and the second member extending toward the air outlet. 8. The chassis of claim 1, further comprising a fan assembly disposed in proximity to the air outlet, the fan assembly configured to direct the plurality of air streams though the air outlet along a direction that is substantially orthogonal to the second direction of flow of the air stream. 9. A chassis configured to receive a circuit board, comprising: a first wall defining an air inlet in proximity to a chassis base and an opposing second wall defining an air outlet in proximity to a chassis cover, the chassis cover opposing the chassis base; a first set of baffles disposed within the chassis between the first wall and the second wall, each baffle of the first set of baffles configured to direct at least a portion of an air stream flowing through the air inlet from a first direction to a second direction toward the circuit board such that the air stream flows substantially parallel to a planar surface of the circuit board, the first direction being substantially orthogonal to each baffle of the first set of baffles and the second direction being substantially orthogonal to the first direction; and a second set of baffles disposed in proximity to the air outlet, the second set of baffles configured to divide the air stream flowing substantially parallel to the planar surface of the circuit board into a plurality of air streams; wherein each baffle element of the first set of baffles comprises a first edge opposing the chassis cover and a second edge opposing the chassis base, the first edge of a first baffle element of the first set of baffles extending a first distance above the first edge of an adjacently positioned second baffle element and the second edge of the first baffle element of the first set of baffles extending a second distance above the second edge of the adjacently positioned second baffle element and wherein a height of the first baffle element of the first set of baffles is substantially equal to a height of the second baffle element of the first set of baffles. 10. The chassis of claim 9, wherein a segment defined between the second edge of the first baffle element of the set of baffles and the first edge of the second baffle element of the set of baffles defines an angle relative to the chassis base, the angle being in the range of about 23 degrees to about 28 degrees. 11. The chassis of claim 9, wherein the second set of baffles comprises: a first baffle element disposed between the first wall and the second wall; a second baffle element disposed between the first wall and the first baffle element of the second set of baffles; and a third baffle element disposed between the first baffle element of the second set of baffles and the second wall. 12. The chassis of claim 11, wherein: the first baffle element is disposed at a location that is substantially one-half of a distance between the first wall and a midplane of the chassis; the second baffle element is disposed at a location that is substantially one-half of a distance between the first wall and the first baffle element; and the third baffle element is disposed at a location that is substantially one-half of a distance between the first baffle element and the midplane of the chassis. 13. The chassis of claim 9, wherein each baffle element of the second set of baffles comprises a first member and a second member coupled to the first member, the first member extending toward the circuit board and the second member extending toward the air outlet. 14. The chassis of claim 9, wherein the second set of baffles are configured to divide the air stream flowing substantially parallel to the planar surface of the circuit board into the plurality of air streams, the air stream flowing substantially parallel to the planar surface of the circuit board along the second direction, the second direction being substantially orthogonal to each baffle element of the second set of baffles and direct the plurality of air streams along a third direction toward a fan assembly, the third direction being substantially orthogonal to the second direction. 15. A chassis configured to receive a circuit board, comprising: a first wall defining an air inlet in proximity to a chassis base and an opposing second wall defining an air outlet in proximity to a chassis cover, the chassis cover opposing the chassis base; and a first set of baffles disposed within the chassis between the first wall and the second wall, each baffle of the first set of baffles configured to direct at least a portion of an air stream flowing through the air inlet from a first direction to a second direction toward the circuit board such that the air stream flows substantially parallel to a planar surface of the circuit board, the first direction being substantially orthogonal to each baffle of the first set of baffles and the second direction being substantially orthogonal to the first direction; each baffle element of the first set of baffles comprising a first edge opposing the chassis cover and a second edge opposing the chassis base, the first edge of a first baffle element of the first set of baffles extending a first distance above the first edge of an adjacently positioned second baffle element and the second edge of the first baffle element of the first set of baffles extending a second distance above the second edge of the adjacently positioned second baffle element and wherein a height of the first baffle element of the first set of baffles is substantially equal to a height of the second baffle element of the first set of baffles. 16. The chassis of claim 15, wherein a segment defined between the second edge of the first baffle of the set of baffles and the first edge of the second baffle element of the set of baffles defines an angle relative to the chassis base, the angle being in the range of about 23 degrees to about 28 degrees. 17. The chassis of claim 15, further comprising a second set of baffles disposed in proximity to the air outlet, the second set of baffles configured to divide the air stream flowing substantially parallel to the planar surface of the circuit board into a plurality of air streams. 18. The chassis of claim 17, wherein the second set of baffles comprises: a first baffle element disposed between the first wall and the second wall; a second baffle element disposed between the first wall and the first baffle element of the second set of baffles; and a third baffle element disposed between the first baffle element of the second set of baffles and the second wall. 19. The chassis of claim 18, wherein: the first baffle element is disposed at a location that is substantially one-half of a distance between the first wall and a midplane of the chassis; the second baffle element is disposed at a location that is substantially one-half of a distance between the first wall and the first baffle element; and the third baffle element is disposed at a location that is substantially one-half of a distance between the first baffle element and the midplane of the electronic device. 20. The chassis of claim 17, wherein each baffle element of the second set of baffles comprises a first member and a second member coupled to the first member, the first member extending toward the circuit board and the second member extending toward the air outlet.
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이 특허에 인용된 특허 (15)
Malone, Christopher G.; Simon, Glenn C., Air baffle for managing cooling air re-circulation in an electronic system.
Faneuf, Barrett M.; Berry, William E.; Holalkere, Ven R.; De Lorenzo, David S., High capacity air-cooling systems for electronic apparatus and associated methods.
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