초록 ▼

A method (10) of forming an electrically conducting feedthrough. The method (10) comprises a first step (11) of forming an electrically conductive structure (21) comprising a sacrificial component and a non-sacrificial component. At least a portion of the non-sacrificial component can then be coated

A method (10) of forming an electrically conducting feedthrough. The method (10) comprises a first step (11) of forming an electrically conductive structure (21) comprising a sacrificial component and a non-sacrificial component. At least a portion of the non-sacrificial component can then be coated with a relatively electrically insulating material (35) prior to removal of at least a portion of the sacrificial component from the electrically conductive structure. The structure of the feedthrough provides electrical connection through the wall of a housing of an implantable component while preventing unwanted transfer of materials between the interior of the component and the surrounding environment.

대표청구항 ▼

The invention claimed is: 1. A method of forming an electrically conducting feedthrough for implantable medical device comprising: forming an electrically conductive structure comprising a sacrificial component and a non-sacrificial component comprising at least one electrically conductive elongate

The invention claimed is: 1. A method of forming an electrically conducting feedthrough for implantable medical device comprising: forming an electrically conductive structure comprising a sacrificial component and a non-sacrificial component comprising at least one electrically conductive elongate member; coating at least a portion of the non-sacrificial component with an electrically insulating material such that each said at least one electrically conductive elongate member is contiguous and circumferentially covered by said electrically insulating material hermetically sealing said at least one electrically conductive elongate member; and removing at least a portion of the sacrificial component from the electrically conductive structure to expose opposing ends of said at least one electrically conductive elongate member; and electrically coupling at least one opposing end of said at least one hermetically sealed and electrically conductive elongate member to the implantable medical device. 2. The method of forming an electrically conducting feedthrough of claim 1 wherein the electrically insulating material is a ceramic material. 3. The method of forming an electrically conducting feedthrough of claim 1 wherein the electrically insulating material is coated on the non-sacrificial component and not coated on to any portion of the sacrificial component of the conductive structure. 4. The method of forming an electrically conducting feedthrough of claim 1 wherein the electrically conductive structure is selected from the group comprising a metal, a metal alloy, an electrically conductive ceramic, an electrically conductive composite, and an intrinsically or extrinsically electrically conductive polymer. 5. The method of forming an electrically conducting feedthrough of claim 1 wherein the shape of the electrically conductive structure is formed in step (i) by punching the shape from a film of electrically conductive material. 6. The method of forming an electrically conducting feedthrough of claim 1 wherein the shape of the electrically conductive structure is formed in step (i) by using electrical discharge machining (EDM) to remove unwanted portions of the film. 7. The method of forming an electrically conducting feedthrough of claim 1 wherein step (i) comprises a step of forming a film of platinum having a plurality of integrally attached substantially elongate members extending outwardly from at least a portion of the periphery thereof. 8. The method of forming an electrically conducting feedthrough of claim 1 wherein step (ii) comprises a step of using powder injection moulding (PIM) to mould the insulating material around said portion of the conductive structure. 9. The method of forming an electrically conducting feedthrough of claim 1 further comprising a step of mounting the feedthrough in an orifice in the wall of a unit adapted to receive the feedthrough. 10. A feedthrough comprised of one or more electrically conductive structures extending through and embedded within a electrically insulating body when formed using the method of claim 1. 11. The method of forming an electrically conducting feedthrough of claim 1 wherein step (ii) comprises a step of mounting or clamping the electrically conductive structure in a mould and then moulding a coating of the insulating material around the conductive structure. 12. The method of forming an electrically conducting feedthrough of claim 4 wherein the electrically conductive structure is formed from a film or shim of platinum. 13. The method of forming an electrically conducting feedthrough of claim 12 wherein the film or shim has a shape comprising two or more conductive elements extending between respective transverse support members. 14. The method of forming an electrically conducting feedthrough of claim 13 wherein at least one of the conductive elements is linear. 15. The method of forming an electrically conducting feedthrough of claim 13 wherein the electrically insulating material is moulded around at least a portion of the conductive elements of the conductive structure. 16. The method of forming an electrically conducting feedthrough of claim 7 wherein the insulating material is moulded to both sides of the film and elongate members, thereby encapsulating at least a portion of the members in the insulating material.