IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0007806
(2004-12-08)
|
등록번호 |
US-7397665
(2008-07-08)
|
발명자
/ 주소 |
|
출원인 / 주소 |
- OPTHERM Thermal Solutions Ltd.
|
대리인 / 주소 |
Pearl Cohen Zedek Latzer, LLP
|
인용정보 |
피인용 횟수 :
6 인용 특허 :
9 |
초록
▼
A system of at least one integrated electronic board device with integral cooling system. The device comprises an integrated electronic board, with a plurality of heat-dissipating electronic components distributed over it, with heat-exchanging devices coupled to the heat-dissipating electronic compo
A system of at least one integrated electronic board device with integral cooling system. The device comprises an integrated electronic board, with a plurality of heat-dissipating electronic components distributed over it, with heat-exchanging devices coupled to the heat-dissipating electronic components, and a plurality of slots provided adjacent each of the plurality of heat-dissipating electronic components. Each slot fluidically communicates with a heat-exchanging device. An adjoining cover defining, with the integrated electronic board, a cavity for providing an integral reservoir between the slots and at least one port that may be connected to a flow generator for generating a flow of a fluidic coolant through said at least one of a plurality of heat-exchanging devices.
대표청구항
▼
The invention claimed is: 1. An integrated electronic board system with integral cooling facility, the system comprising: at least one integrated electronic board, with a plurality of heat-dissipating electronic components distributed over it, each of the heat dissipating components coupled to a re
The invention claimed is: 1. An integrated electronic board system with integral cooling facility, the system comprising: at least one integrated electronic board, with a plurality of heat-dissipating electronic components distributed over it, each of the heat dissipating components coupled to a respective one of a plurality of heat-exchanging devices, and one or more slots provided adjacent each of said plurality of heat-dissipating electronic components, each of said one or more slots fluidically communicating with at least one respective heat-exchanging device of said plurality of heat-exchanging devices; and an adjoining cover defining, with said at least one integrated electronic board, a cavity for providing an integral reservoir between said one or more slots and at least one port for connecting to a flow generator for generating a flow of a fluidic coolant through the heat-exchanging device that is coupled to each of said one or more heat dissipating devices. 2. The system of claim 1, wherein the flow generator is a vacuum source that maintains in the cavity pressure that is lower than ambient pressure. 3. The system of claim 1, wherein the flow generator is a pressurized air source that maintains in the cavity pressure above ambient pressure. 4. The system of claim 1, wherein the adjoining cover is an integrated electronic board. 5. The system of claim 1, wherein said at least one integrated electronic board comprises more than one integrated electronic board, and wherein the flow generator is connected to port of each cavity of a plurality of cavities respective to said more than one integrated electronic board. 6. The system of claim 5, wherein the port of each cavity is connected via a shared manifold to the flow generator. 7. The system of claim 1, wherein the heat-exchanging device comprises a heat-conductive body provided with conduits through the body, fluidically communicating with at least one of said one or more slots. 8. The system of claim 7, wherein the conduits are communicating through a manifold with said at least one of said one or more slots. 9. The system of claim 1, wherein at least some of the heat-dissipating electronic components are coupled to the same heat exchanging device. 10. The system of claim 1, wherein at least some of the heat-dissipating electronic components share a single slot of said one or more slots. 11. The system of claim 1, wherein said at least one port is provided on a side wall. 12. The system of claim 1, wherein said at least one port is provided perpendicular to said at least one integrated electronic board. 13. The system of claim 1, wherein more than one of said one or more slots are provided adjacent each of the heat-dissipating electronic components, said more than one slot communicating with the heat-exchanging device coupled to the respective heat-dissipating electronic component. 14. The system of claim 13, wherein more than one of said one or more slots are provided on more than one side of each of the heat-dissipating electronic components. 15. A method of cooling heat-dissipating electronic devices, the method comprising: providing a system comprising at least one integrated electronic board, with a plurality of heat-dissipating electronic components distributed over it, each of the heat dissipating components coupled to a respective one of a plurality of heat-exchanging devices, and one or more slots provided adjacent each of said plurality of heat-dissipating electronic components, each of said one or more slots fluidically communicating with at least one respective heat-exchanging device of said plurality of heat-exchanging devices; providing an adjoining cover defining, with said at least one integrated electronic board, a cavity for providing an integral reservoir between said one or more slots and at least one port for connecting to a flow generator for generating a flow of a fluidic coolant through the heat-exchanging device that is coupled to each of said one or more heat dissipating devices; and using the flow generator to drive a fluidic coolant through the heat-exchanging device that is coupled to each of said one or more heat dissipating devices. 16. The method of claim 15, wherein the flow generator is a vacuum source that maintains in the cavity pressure that is lower than ambient pressure. 17. The method of claim 15, wherein the fluidic coolant is air. 18. The method of claim 15, wherein the adjoining cover is an integrated electronic board. 19. The method of claim 15, wherein said at least one integrated electronic board comprises more than one integrated electronic board, and wherein the flow generator is connected to the port of each cavity of a plurality of cavities respective to said more than one integrated electronic board. 20. The method of claim 19, wherein the port of each cavity is connected via a shared manifold to the flow generator. 21. The method of claim 15, wherein the heat-exchanging device comprises a heat-conductive body provided with conduits through the body, fluidically communicating with at least one of said one or more slots. 22. The method of claim 21, wherein the conduits are communicating through a manifold with said at least one of said one or more slots. 23. The method of claim 15, wherein at least some of the heat-dissipating electronic components are coupled to the same heat exchanging device. 24. The method of claim 15, wherein at least some of the heat-dissipating electronic components share a single slot of said one or more slots. 25. The method of claim 15, wherein said at least one port is provided on a side wall. 26. The method of claim 15, wherein said at least one port is provided perpendicular to said at least one integrated electronic board. 27. The method of claim 15, wherein more than one slot are provided adjacent a heat-dissipating electronic component of said heat-dissipating electronic components, all of which are communicating with the heat-exchanging device coupled to the respective heat-dissipating electronic component. 28. The method of claim 27, wherein said more than one of said one or more slots are provided on more than one side of the heat-dissipating electronic component.
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