초록 ▼

An apparatus and system are disclosed for cooling of heat producing components. The apparatus may include a mounting plate rigidly connected with a top surface of a circuit board, the mounting plate positioned above a heat producing circuit board component, and a heat sink having first and second en

An apparatus and system are disclosed for cooling of heat producing components. The apparatus may include a mounting plate rigidly connected with a top surface of a circuit board, the mounting plate positioned above a heat producing circuit board component, and a heat sink having first and second ends. The heat sink is configured to interface with the mounting plate in order to provide a downward force on the heat producing circuit board component. The apparatus also includes at least one bellows device coupling a heat transfer tip with the first end of the heat sink, wherein the bellows device is configured to transfer the downward force from the mounting plate to a top surface of the heat producing component and maintain the heat transfer tip in compliance with the plane of the top surface of the heat producing component. The system includes a circuit board, a plurality of heat producing circuit board components, and the described apparatus.

대표청구항 ▼

What is claimed is: 1. An apparatus to cool a heat producing component, the apparatus comprising: a mounting plate rigidly connected with a top surface of a circuit board, the mounting plate positioned above a heat producing component mounted on the circuit board; a heat sink having first and secon

What is claimed is: 1. An apparatus to cool a heat producing component, the apparatus comprising: a mounting plate rigidly connected with a top surface of a circuit board, the mounting plate positioned above a heat producing component mounted on the circuit board; a heat sink having first and second ends, the heat sink configured to interface with the mounting plate in order to provide a downward force on the heat producing component; and a bellows device coupling a heat transfer tip with the first end of the heat sink, the bellows device configured to transfer the downward force from the mounting plate to a top surface of the heat producing component and maintain the heat transfer tip in compliance with the plane of the top surface of the heat producing component. 2. The apparatus of claim 1, wherein the heat sink comprises a heat pipe configured with a heat chamber, the heat chamber having a vaporizable liquid and configured to transfer heat away from the heat producing component. 3. The apparatus of claim 2, wherein the heat chamber further comprises a cylinder configured to slidably engage an interior surface of the heat pipe and maintain a constant heat chamber volume. 4. The apparatus of claim 2, further comprising a second bellows device coupled with the second end of the heat sink and configured to extend and retract in order to allow the heat chamber to maintain constant heat chamber volume. 5. The apparatus of claim 1, further comprising a plurality of heat fins extending outwardly from the heat sink and configured to increase the surface area of the heat sink in order to dissipate heat from the heat sink. 6. The apparatus of claim 1, further comprising a wick structure coupled to an interior surface of the heat sink and configured to transport a fluid. 7. The apparatus of claim 1, wherein the bellows device and the heat transfer tip are formed substantially of a heat conductive metal. 8. The apparatus of claim 7, wherein the heat conductive metal is selected from the group consisting of aluminum, copper, aluminum-copper alloy, silver, gold, tungsten, and beryllium. 9. The apparatus of claim 1, wherein a plurality of heat producing components are mounted on the circuit board and further comprising a plurality of bellows devices and heat transfer tips, each bellows device coupling a heat transfer tip to the heat sink and each bellows device configured to transfer the downward force from the mounting plate to a top surface of a corresponding heat producing component and maintain the heat transfer tip in compliance with the plane of the top surface of the corresponding heat producing component, the heat sink configured to cool the heat producing components coupled to the heat sink through the heat transfer tips. 10. A system to cool a heat producing component, the system comprising: a circuit board; a plurality of heat producing components mounted on the circuit board; a mounting plate rigidly connected with a top surface of the circuit board, the mounting plate positioned above at least one of the heat producing components; a heat sink having first and second ends, the heat sink configured to interface with the mounting plate in order to provide a downward force on a heat producing component; and a bellows device coupling a heat transfer tip with the first end of the heat sink, the bellows device configured to transfer the downward force from the mounting plate to a top surface of the heat producing component and to maintain the heat transfer tip in compliance with the plane of the top surface of the heat producing component. 11. The system of claim 10, wherein the heat sink comprises a heat pipe configured with a heat chamber, the heat chamber having a vaporizable liquid and configured to transfer heat away from the heat producing component. 12. The system of claim 11, wherein the heat chamber further comprises a cylinder configured to slidably engage an interior surface of the heat pipe and maintain a constant heat chamber volume. 13. The system of claim 11, further comprising a second bellows device coupled with the second end of the heat sink and configured to extend and retract in order to allow the heat chamber to maintain constant heat chamber volume. 14. The system of claim 10, further comprising a plurality of heat fins extending outwardly from the heat sink and configured to increase the surface area of the heat sink in order to dissipate heat from the heat sink. 15. The system of claim 10, further comprising a wick structure coupled to an interior surface of the heat sink and configured to transport a fluid. 16. The system of claim 10, wherein the bellows device and the heat transfer tip are formed substantially of a heat conductive metal. 17. The system of claim 16, wherein the heat conductive metal is selected from the group consisting of aluminum, copper, aluminum-copper alloy, silver, gold, tungsten, and beryllium. 18. The system of claim 10, further comprising a plurality of bellows devices and heat transfer tips, each bellows device coupling a heat transfer tip to the heat sink and each bellows device configured to transfer the downward force from the mounting plate to a top surface of a corresponding heat producing component and maintain the heat transfer tip in compliance with the plane of the top surface of the corresponding heat producing component, the heat sink configured to cool the heat producing components coupled to the heat sink through the heat transfer tips. 19. An apparatus to cool a heat producing component, the apparatus comprising: a mounting plate rigidly connected with a top surface of a circuit board, the mounting plate positioned above a heat producing component mounted on the circuit board; a heat sink having first and second ends, the heat sink configured to interface with the mounting plate in order to provide a downward force on the heat producing component; a first bellows device coupling a heat transfer tip with the first end of the heat sink, the bellows device configured to transfer the downward force from the mounting plate to a top surface of the heat producing component and maintain the heat transfer tip in compliance with the plane of the top surface of the heat producing component; and a second bellows device coupled with the second end of the heat sink and configured to extend and retract in order to allow a heat chamber to maintain constant heat chamber volume. 20. An apparatus to cool heat producing components, the apparatus comprising: a mounting plate rigidly connected with a top surface of a circuit board, the mounting plate positioned above a plurality of heat producing components mounted to the circuit board; a heat sink having first and second ends, the heat sink configured to interface with the mounting plate in order to provide a downward force on each of the heat producing components, the heat sink configured to cool the plurality of heat producing components; and a plurality of bellows devices, each bellows device coupling a heat transfer tip with the heat sink, each bellows device configured to transfer the downward force from the mounting plate to a top surface of a corresponding heat producing component and maintain the heat transfer tip in compliance with the plane of the top surface of the corresponding heat producing component.