$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

System for simultaneous projections of multiple phase-shifted patterns for the three-dimensional inspection of an object 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G06K-009/00
  • G05K-009/36
출원번호 US-0426577 (2006-06-26)
등록번호 US-7403650 (2008-07-22)
우선권정보 CA-2301822(2000-03-24)
발명자 / 주소
  • Coulombe,Alain
  • Cantin,Michel
  • Nikitine,Alexandre
출원인 / 주소
  • SolVision Inc.
대리인 / 주소
    Berskin and Parr
인용정보 피인용 횟수 : 1  인용 특허 : 37

초록

A three-dimensional image grabber allowing for the simultaneous projection of multiple phase-shifted patterns onto an object, and the simultaneous acquisition of multiple images of these phase-shifted patterns is described herein. The grabber comprises a pattern projecting assembly and an image acqu

대표청구항

What is claimed is: 1. A three-dimensional image grabber comprising: a pattern projecting assembly for simultaneously projecting at least two phase-shifted patterns onto an object; each of said projected patterns being characterized by a predetermined bandwidth; said pattern projection assembly inc

이 특허에 인용된 특허 (37)

  1. Ciszek Theodoer F. (31843 Miwok Trail ; P.O. Box 1453 Evergreen CO 80439), Apparatus and method for measuring the thickness of a semiconductor wafer.
  2. Halioua Maurice (Sea Cliff NY), Apparatus and method for obtaining three dimensional surface contours.
  3. Comstock Robert L. (Santa Clara CA) Hansen Michael R. (Santa Clara CA) Tong Edrick H. (Sunnyvale CA), Apparatus and method for testing coplanarity of semiconductor components.
  4. Sorin Wayne V. (Mountain View CA), Apparatus for measuring the thickness of a moving film utilizing an adjustable numerical aperture lens.
  5. Kato Kinya (Yokohama JPX) Takaoka Kazuhiro (Yokohama JPX), Apparatus for measuring thickness of plate-shaped article.
  6. Uesugi Mitsuaki (Kanagawa JPX) Inomata Masaichi (Kanagawa JPX), Apparatus for measuring three-dimensional curved surface shapes.
  7. Eikmeyer Peter (Bielefeld DEX), Apparatus for the inspection of continuous sheets of material.
  8. Moser Christophe ; Barbastathis George ; Psaltis Demetri, Conoscopic system for real-time corneal topography.
  9. Bodlaj ; Viktor, Contact-free thickness measuring method and device.
  10. Bodlaj Viktor (Munich DEX), Device for contact-free thickness measurement.
  11. Fitts John M. (528 Euclid St. Santa Monica CA 90402), Hidden change distribution grating and use in 3D moire measurement sensors and CMM applications.
  12. Fitts John M. (Santa Monica CA), High-speed 3-D surface measurement surface inspection and reverse-CAD system.
  13. Bredberg Robert E. (Markham CAX) Torres Cristian (Downsview CAX), Laser thickness gauge.
  14. Yokota Akira (Hachiouji JPX), Measuring endoscope.
  15. Norita Toshio (Mishima-Gun JPX) Yagi Fumiya (Ibaraki JPX) Hirose Satoru (Tondahayashi JPX), Measuring system with improved method of reading image data of an object.
  16. Womack Kenneth H. (Rochester NY) Kwarta Brian J. (Pittsford NY) Outterson David H. (Victor NY) Reda James R. (Rochester NY), Method and apparatus for digital morie profilometry calibrated for accurate conversion of phase information into distanc.
  17. Hsel Fritz (Mnchengladbach DEX), Method and apparatus for obtaining measuring values representing the thickness of a coherent fiber mass.
  18. Cline Harvey E. (Schenectady NY) Holik Andrew S. (Schenectady NY) Lorensen William E. (Ballston Lake NY), Method and apparatus for reconstruction of three-dimensional surfaces from interference fringes.
  19. Huang, Peisen; Hu, Qingying; Chiang, Fu-Pen, Method and apparatus for three dimensional surface contouring and ranging using a digital video projection system.
  20. Hof Albrecht (Aalen DEX) Hanssen Adalbert (Konigsbronn DEX), Method and apparatus for three-dimensional optical measurement of object surfaces.
  21. Svetkoff Donald J. (Ann Arbor MI) Doss Brian (Ann Arbor MI) Smith David N. (South Lyons MI), Method and system for high-speed, 3-D imaging of an object at a vision station.
  22. Bilodeau Steve (Setauket NY) Jacovino Frank (Plainview NY) Cameron Joanne (Oakdale NY) Cain James (Calverton NY), Method for coplanarity inspection of package or substrate warpage for ball grid arrays, column arrays, and similar struc.
  23. Kondo Noriyuki (Kyoto JPX), Method of and apparatus for measuring film thickness.
  24. Schwaiger Max (Ostermiething ATX) Rieder Heinz (St. Pantaleon ATX), Non-contacting measuring apparatus for measuring a displacement in dependence on the incidence of a laser beam on a lase.
  25. Gabura A. James (Toronto CAX) MacHattie Ross K. (Bolton CAX) McNelles Larry A. (Thornhill CAX), On line electromagnetic web thickness measuring apparatus incorporating a servomechanism with optical distance measuring.
  26. Durland Sven O. (Lake Oswego OR), Optical scanning method and apparatus useful for determining the configuration of an object.
  27. Hori Kenji (Tokyo JPX), Optical three-dimensional shape measuring apparatus.
  28. Stauber Hans-Ulrich (Grut CHX) Gruninger Baptist (Russikon CHX), Process and device for measuring the thickness of printed products on moving supports.
  29. Schumann Frank (Machern DDX) Richter Hans-Jrgen (Leipzig DDX) Stiefel Werner (Rckmarsdorf DDX) Fritzsche Klaus (Leipzig DDX), Process for the determination of thickness of adhesive layers of inner book block backings.
  30. Cohen Donald K. (Tucson AZ) Caber Paul J. (Tucson AZ) Brophy Chris P. (White Bear Township ; Ramsey County MN), Rough surface profiler and method.
  31. Sjdin Bo (Jonkping SEX), Scanning of workpieces such as lumber cants.
  32. Ozawa Kenji (Kanagawa JPX), Surface configuration inspection apparatus with moving grating.
  33. Ramsey ; Jr. Stevens David (Palo Alto CA), Surface deformation gauging system by moire interferometry.
  34. Landman Marc M. (Burlington MA) Whitman Steven M. (Danville NH) Duncan Robert J. (Magnolia MA), Surface mount machine with lead coplanarity verifier.
  35. Suzuki Masane (Omiya JA), System for measuring and recording three dimensional configuration of object.
  36. McFarlane Ian Duncan (Beaconsfield EN), Thickness measurement.
  37. Berger Christa (Freiburg DEX) Hofler Heinrich (Teningen DEX) Fichter Otmar (March DEX), Topographical camera operable by applying a grid-generated Moire image onto a CCD image sensor.

이 특허를 인용한 특허 (1)

  1. Lubin, Dara N.; Buzzelli, John T.; Dufort, Ron E.; St. Martin, Kevin; Montfort, David B., System for adjusting operation of a printer during three-dimensional object printing to compensate for errors in object formation.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로