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Electrical energy-generating system and devices and methods related thereto 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-041/08
출원번호 US-0880989 (2004-06-30)
등록번호 US-7411337 (2008-08-12)
발명자 / 주소
  • Tadayon,Pooya
  • Zaerpoor,Koorosh
출원인 / 주소
  • Intel Corporation
대리인 / 주소
    Schwegman, Lundberg & Woessner, P.A.
인용정보 피인용 횟수 : 8  인용 특허 : 72

초록

An electrical energy-generating heat sink system provides a convenient and economical method for continuously recharging an energy storage device in electronic devices.

대표청구항

What is claimed is: 1. An electrical energy-generating system comprising: a heat transfer device responsive to heat generated by a microprocessor; a vapor-pressurizing device thermally coupled to the heat transfer device; and an electricity-generating device thermally coupled to the vapor-pressuriz

이 특허에 인용된 특허 (72)

  1. Lucas, Timothy S., Acoustic resonator having mode-alignment-canceled harmonics.
  2. Lucas Timothy S. (Richmond VA), Acoustic resonator having mode-alignment-cancelled harmonics.
  3. Lawrenson Christopher C. ; Van Doren Thomas W. ; Keith F. Joseph ; Lucas Timothy S., Acoustic resonator power delivery.
  4. McCausland Robert (Laval CAX), Air treating device having a bellows compressor actuable by memory-shaped metal alloy elements.
  5. Hindman George W., Apparatus and method for a mobile computer architecture and input/output management system.
  6. Broder Damon ; Hood ; III Charles D., Apparatus for cooling a heat generating component in a computer.
  7. Hilbrink Johan O. (Cincinnati OH), Apparatus for cooling electronic devices.
  8. Gonsalves Daniel D. ; Antonuccio Robert S. ; Carney James M. ; Montagna Joseph J., Apparatus for dissipating heat from a circuit board having a multilevel surface.
  9. Griffith James L. (Holden MA), Circuit chip package employing low melting point solder for heat transfer.
  10. Cheng Kan, Clip-on IC retaining apparatus.
  11. Villani Angelo (Shrewsbury MA), Clip-on heat sink.
  12. Lucas Timothy S. (Glen Allen VA), Compression-evaporation cooling system having standing wave compressor.
  13. Webb Matthew L., Computer having a heat sink structure incorporated therein.
  14. Remsburg Ralph ; Scholder Erica, Computer system with heat sink having an integrated grounding tab.
  15. Brownell Michael ; Turturro Gregory ; McCutchan Dan, Controlled bondline thickness attachment mechanism.
  16. Tanaka Hiroshi,JPX ; Kobayashi Kazuo,JPX ; Terao Tadayoshi,JPX ; Kawaguchi Kiyoshi,JPX ; Matsumoto Tatsuhito,JPX, Cooling apparatus by boiling and cooling refrigerant.
  17. Yamamoto Masaaki,JPX ; Niekawa Jun,JPX ; Ueki Tatuhiko,JPX ; Ikeda Masami,JPX ; Sasaki Ken,JPX, Cooling device with heat pipe.
  18. Nelson Daryl J. ; Stark Michael ; Rutigliano Michael ; Topic Lee ; Chung Yoke ; Thurston Mark,JPX, Dual spring clip attachment mechanism for controlled pressure interface thermal solution on processor cartridges.
  19. Bright Edward J. (Middletown PA) Maltais Jay F. (Harrisburg PA) Taylor Attalee S. (Palmyra PA), EMI shield, and assembly using same.
  20. Sokolovsky Paul J. (Sunnyvale CA) Hunter John (San Jose CA) Hayward James L. (Sunnyvale CA), Electrical connections via unidirectional conductive elastomer for pin carrier outside lead bond.
  21. Tadayon, Pooya; Monzon, Franklin G.; Dujari, Prateek, Electrical energy-generating heat sink system and method of using same to recharge an energy storage device.
  22. Spivak Victor (Haifa ILX), Electroacoustic energy converter for transformation between thermal and electrical energy.
  23. Gates William George,GBX, Electronic apparatus.
  24. Gates William George,GBX, Electronic apparatus.
  25. Hileman Vince P., Electronic card with blind mate heat pipes.
  26. Johnson Philip A. (Exeter NH) McCarthy Alfred F. (Belmount NH), Electronic chip-carrier heat sinks.
  27. Ouchi Katsunori (Hitachi JPX) Morihara Atsushi (Katsuta JPX) Naganuma Yoshio (Hitachi JPX) Sato Koji (Hitachi JPX) Kaji Ryuichi (Kitaibaraki JPX), Electronic equipment and computer with heat pipe.
  28. Brownell Michael P. ; Vodrahalli Nagesh K. ; Maveery James G. ; Ramirez Richard M., Emulative lid/heatspreader for processor die attached to an organic substrate.
  29. Kim, Kwang Ho; Lee, Yoon Pyo; Jeon, Jae Hak; Song, Gui Eun, Generator for use in a microelectromechanical system.
  30. Xie Hong, Heat pipe lid for electronic packages.
  31. Kolman Frank (Phoenix AZ) Brownell Michael (Chandler AZ) Xie Hong (Chandler AZ), Heat pipe to baseplate attachment method.
  32. Kolman Frank ; Brownell Michael ; Xie Hong, Heat pipe to baseplate attachment method.
  33. Liao Chen Yen,TWX, Heat radiating device capable of reducing electromagnetic interference.
  34. Hood ; III Charles D. ; Liu Peter, Heat sink assembly with rotating heat pipe.
  35. Neville ; Jr. Robert J. ; Hodgkins Daniel, Heatsink assembly.
  36. Terrill Richard S. (Sunnyvale CA) Faria Donald F. (San Jose CA), High-density programmable logic device in a multi-chip module package with improved interconnect scheme.
  37. Dauksis William P. (91 Jennifer Cir. Ponce Inlet FL 32127), Hybrid internal combustion engine/electrical motor ground vehicle propulsion system.
  38. Augustine Scott D. ; Iaizzo Paul Anthony, Inflatable thermal blanket for convectively and evaporatively cooling a body.
  39. Meyer ; IV George A. (Conestoga PA) Toth Jerome E. (Hatboro PA) Longsderff Richard W. (Lancaster PA), Integrated circuit cooling apparatus.
  40. Bhatia Ram D. (Waltham MA), Integrated circuit device carrier.
  41. Brian A. Scott, Integrated circuit refrigeration device.
  42. Bookhardt Gary L. ; McEuen Shawn S., Integrated heat dissipation apparatus.
  43. Patel Janak G., Integrated heatsink and heatpipe.
  44. Prasher, Ravi; Watwe, Abhay A.; Chrysler, Gregory M.; Frutschy, Kristopher; Ofman, Leo; Sathe, Ajit V., Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachment.
  45. Prasher, Ravi; Watwe, Abhay A.; Chrysler, Gregory M.; Frutschy, Kristopher; Ofman, Leo; Sathe, Ajit V., Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachment.
  46. Bitterly Jack G. (Woodland Hills CA), Localized cooling apparatus.
  47. Dawson ; deceased Peter F. (late of Portola Valley CA by Shirley B. Dawson ; executrix ) Leibovitz Jacques (San Jose CA) Nagesh Voddarahalli K. (Cupertino CA), Low cost, high thermal performance package for flip chips with low mechanical stress on chip.
  48. David J. Koenen, Method and apparatus for tooless mating of liquid cooled cold plate with tapered interposer heat sink.
  49. Eylman Leonid (P.O. Box 591013 San Francisco CA 94159-1013), Method for converting micromotions into macromotions and apparatus for carrying out the method.
  50. Lin Liken,TWX, Method for manufacturing the heat pipe integrated into the heat sink.
  51. Raskas Eric J., Micro sensor device.
  52. Christopher Gary L. ; Rochowicz William R., Molded housing with integral heatsink.
  53. Kinion Michael (Hillsboro OR), No handle zip socket.
  54. Ueki Tatsuhiko,JPX ; Yamamoto Masaaki,JPX ; Ikeda Masami,JPX, Plate type heat pipe and a cooling system using same.
  55. Ikeda Masami,JPX ; Yamamoto Masaaki,JPX ; Sho Hitoshi,JPX ; Ueki Tatsuhiko,JPX, Plate type heat pipe and cooling structure using it.
  56. Kim Dong-Hwan,KRX, Portable computer being powered by either a battery pack or an AC adapter.
  57. McCutchan Dan R. ; Samaras William A. ; Ayers David J., Power pod/power delivery system.
  58. Lucas Timothy S., RMS energy conversion.
  59. Kim Jong-Youb (Suwon KRX), Refrigeration cycle having an evaporator for evaporating residual liquid refrigerant.
  60. Lucas Timothy S. (Richmond VA) Van Doren Thomas W. (Fredericksburg VA), Resonant macrosonic synthesis.
  61. Ewer Peter R. (Hurst Green GB2) Ellard Jeffrey R. (Burgess Hill GB2), Semi-conductor modules.
  62. Belady Christian L., Semiconductor package lid with internal heat pipe.
  63. Menzies L. William ; Menzies Stephen W. ; Mackey Dale S., Signal adaptor board for a pin grid array.
  64. Beck ; Jr. Hoy S. (Lexington NC), Surface mount LCC socket.
  65. Chiu Chia-Pin ; Yusuf Imran ; Koushik Banerjee ; Young Todd ; Solbrekken Gary, Thermal bus bar design for an electronic cartridge.
  66. O'Connor Michael ; Haley Kevin J., Thermal connector for joining mobile electronic devices to docking stations.
  67. Hopfer Albert N. (Park Ridge IL), Thermal transfer plate and integrated circuit chip or other electrical component assemblies including such plate.
  68. Hamburgen William R. (Palo Alto CA) Fitch John S. (Newark CA) Jouppi Norman P. (Palo Alto CA), Thermosiphon for cooling a high power die.
  69. Welle Richard P., Ultrasonic data communication system.
  70. Milling ; Robert W., Waste heat converter for an internal combustion engine.
  71. Fedorowicz Richard J. (Chicago IL) Cegles William P. (Chicago IL), Watch module.
  72. Austin Thomas A. ; Meeker Matthew K. ; Greer Stephen S. ; Green Dwayne C., Weatherproof design for remote transceiver.

이 특허를 인용한 특허 (8)

  1. Ollier, Emmanuel; Monfray, Stephane; Skotnicki, Thomas; Soupremanien, Ulrich, Device for recovering and converting heat energy into electrical energy.
  2. Diaz, Kevin Mark, Green energy mine defeat system.
  3. Jang, Yung-Li; Huang, Chia-Feng; Kao, Ming-Chi; Chen, Ming-Chih, Heat pipe capable of transforming dynamic energy into electric energy and related heat-dissipating module.
  4. North, Travis Christian; Ingalls, Andrew Olen; Sendelbach, Eric Neil; Tamhankar, Manasi; Kadathur, Srinivasan R., Power regeneration for an information handling system.
  5. Gettings, Nathan D.; Gettings, Adam M.; Penn, Taylor J.; Siler, III, Edward John; Stevens, Andrew G.; Schneider, Michael; Appleby, Jon; Gawlowski, Matthew, Robotic system and methods of use.
  6. Brooks, Kenneth C., System and method for generating mechanical movement.
  7. Irvin, David; Fryer, Todd Andrew; Nicas, Nicholas A., Task-lit cabinet.
  8. Irvin, David; Fryer, Todd Andrew; Nicas, Nicholas A., Task-lit cabinet.
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