[특허]Adhesive attachment with electrical ground

Physical Systems, Inc.

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특허 상세정보

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Adhesive attachment with electrical ground

특허상세정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	H01R-004/66
미국특허분류(USC)	428/139; 428/099; 428/922; 428/343; 439/108; 439/103; 174/005.SG; 174/005.R; 029/857; 029/854
출원번호	US-0149120 (2005-06-08)
등록번호	US-7413790 (2008-08-19)
발명자 / 주소	Hutter, III,Charles G.
출원인 / 주소	Physical Systems, Inc.
대리인 / 주소	Kelly Lowry & Kelley, LLP
인용정보	피인용 횟수 : 7 인용 특허 : 13

초록
▼

An adhesive attachment is provided for securely mounting an attachment component such as a threaded stud or the like on the surface of a selected substrate, wherein the adhesive attachment provides an electrically conductive ground path for grounding the attachment component and/or a selected structure mounted thereto to the substrate. In one preferred form, the attachment component is a threaded element such as a stud or nut. Upon mounting of the attachment component on the substrate and subsequent connection of the threaded element to a mating threaded member, e.g., of the selected structure to be mounted onto the attachment component, a conductive ground pin is pressed into electrical contact with the substrate for grounding the attachment component and/or the selected structure mounted thereto.

대표
청구항
▼

What is claimed is: 1. An adhesive attachment, comprising: at least one component defining a surface for adhesive bonded attachment to a substrate; said at least one component including an attachment component for mounting a selected structure relative to said substrate; and a conductive pin for electrically coupling at least one of said attachment component and the selected structure mounted thereto to the substrate, upon mounting of the selected structure to said attachment component; said attachment component clamping said conductive pin between the substrate and one of said attachment component and the selected structure for pressing said conductive pin into conductive engagement with the substrate, upon mounting of the selected structure relative to said substrate. 2. The adhesive attachment of claim 1 wherein said at least one component comprises said attachment component. 3. The adhesive attachment of claim 2 wherein said attachment component defines a base surface for adhesive attachment to the substrate. 4. The adhesive attachment of claim 2 wherein said attachment component has an aperture formed therein, said conductive pin being slidably carried within said aperture. 5. The adhesive attachment of claim 4 further including means for initially retaining said conductive pin in a position retracted at least slightly from the substrate, upon adhesive attachment of said attachment component to the substrate, said conductive pin being advanced into conductive engagement with the substrate upon mounting of the selected structure thereto. 6. The adhesive attachment of claim 2 further including a conductive collar carried by said attachment component and having a counterbore formed therein opening in a direction toward the substrate, said conductive pin being carried within said counterbore, said collar being clamped between the selected structure and the substrate upon mounting of the selected structure onto said attachment component for advancing said conductive pin into conductive engagement with the substrate. 7. The adhesive attachment of claim 1 wherein said at least one component comprises a support fixture, said attachment component being carried by said support fixture. 8. The adhesive attachment of claim 7 further including means for initially retaining said conductive pin in a position retracted at least slightly from the substrate, upon adhesive attachment of said support fixture to the substrate, said conductive pin being advanced into conductive engagement with the substrate upon mounting of the selected structure to said attachment component. 9. The adhesive attachment of claim 1 wherein said conductive pin comprises a rolled steel pin. 10. The adhesive attachment of claim 1 wherein said conductive pin has at least one relatively sharp prong for engaging the substrate. 11. The adhesive attachment of claim 1 wherein said conductive pin has at least one relatively sharp prong at each of opposite ends thereof. 12. The adhesive attachment of claim 1 wherein said attachment component comprises a threaded element. 13. An adhesive attachment, comprising: an attachment component defining a base surface; an adhesive bonding agent for securely bonding said base surface of said attachment component to a conductive substrate; said attachment component including means for mounting a selected conductive structure relative to the substrate; and a conductive pin for electrically coupling the selected structure mounted to said attachment component to the substrate, upon mounting of the selected structure to said attachment component; said mounting means of said attachment component clamping said conductive pin between the substrate and one of said attachment component and the selected structure for pressing said conductive pin into conductive engagement with the substrate, upon mounting of the selected structure to said attachment component. 14. The adhesive attachment of claim 13 wherein said attachment component has an aperture formed therein, said conductive pin being slidably carried within said aperture. 15. The adhesive attachment of claim 14 further including means for initially retaining said conductive pin in a position retracted at least slightly from the substrate, upon adhesive attachment of said attachment component to the substrate, said conductive pin being advanced into conductive engagement with the substrate upon mounting of the selected structure thereto. 16. The adhesive attachment of claim 13 further including a conductive collar carried by said attachment component and having a counterbore formed therein opening in a direction toward the substrate, said conductive pin being carried within said counterbore, said collar being clamped between the selected structure and the substrate upon mounting of the selected structure onto said attachment component for advancing said conductive pin into conductive engagement with the substrate. 17. An adhesive attachment, comprising: an attachment component; a support fixture carrying said attachment component and defining a base surface; an adhesive bonding agent for securely bonding said base surface of said support fixture to a conductive substrate; said attachment component including means for mounting a conductive structure relative to the substrate; and a conductive pin for electrically coupling the structure mounted to said attachment component to the substrate, upon mounting of the selected structure to said attachment component; said mounting means of said attachment component clamping said conductive pin between the substrate and one of said attachment component and the selected structure for pressing said conductive pin into conductive engagement with the substrate, upon mounting of the selected structure to said attachment component. 18. The adhesive attachment of claim 17 further including means for initially retaining said conductive pin in a position retracted at least slightly from the substrate, upon adhesive attachment of said support fixture to the substrate, said conductive pin being advanced into conductive engagement with the substrate upon mounting of the selected structure to said attachment component. 19. A method of mounting a conductive structure relative to a conductive substrate in electrically coupled relation therewith, comprising the steps of: forming an adhesive attachment defining a base surface and including means for mounting the conductive structure thereto; mounting a conductive pin on the adhesive attachment in an initial position retracted at least slightly from the base surface; adhesively bonding the base surface to the conductive substrate; and thereafter mounting the conductive structure to the adhesive attachment, said conductive structure mounting step pressing the conductive pin into electrically coupled relation with the conductive substrate. 20. The method of claim 19 wherein said means for mounting the conductive structure to the adhesive attachment comprises a threaded element. 21. An adhesive attachment, comprising: at least one component defining a surface for adhesive bonded attachment to a substrate; said at least one component including an attachment component for mounting a selected structure relative to said substrate; and an elongated conductive sleeve for electrically coupling at least one of said attachment component and the selected structure mounted thereto to the substrate, upon mounting of the selected structure to said attachment component; said attachment component pressing said conductive sleeve mechanically into conductive engagement with the substrate, upon mounting of the selected structure relative to said substrate.

이 특허에 인용된 특허 (13)

이 특허를 인용한 특허 피인용횟수: 7

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특허 상세정보

Adhesive attachment with electrical ground

초록
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대표
청구항
▼

이 특허에 인용된 특허 (13)

이 특허를 인용한 특허 피인용횟수: 7

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특허 상세정보

Adhesive attachment with electrical ground

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대표청구항 ▼

이 특허에 인용된 특허 (13)

이 특허를 인용한 특허 피인용횟수: 7

IPC 상위 출원인

과제정보

상세정보조회

원문조회

IPC 상세정보(version : 201201)

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