|국가/구분||United States(US) Patent 등록|
|미국특허분류(USC)||438/108; 438/120; 438/613; 257/E23.021|
|발명자 / 주소|
|출원인 / 주소|
|대리인 / 주소||
|인용정보||피인용 횟수 : 0 인용 특허 : 2|
A method of bonding and a bonding apparatus for a semiconductor chip that apply ultrasonic vibration to the semiconductor chip to bond the semiconductor chip to a substrate carry out leveling effectively at low cost and in a short time and can improve the bonding between the semiconductor chip and the substrate. In a positioning step, bumps of the semiconductor chip and pads of the substrate are positioned and placed in contact. In a leveling step, ultrasonic vibration of a first predetermined frequency is applied to the semiconductor chip to make the bu...
What is claimed is: 1. A method of bonding a semiconductor chip, comprising: positioning and placing in contact bumps or pads formed on one side of a semiconductor chip and pads or bumps formed on a mounting surface of a substrate, which correspond to the bumps or pads of the semiconductor chip; contacting a contact body, which is connected to a first ultrasonic vibrator capable of vibrating at a first predetermined frequency and a second ultrasonic vibrator capable of vibrating at a second predetermined frequency, to the semiconductor chip; applying ul...