A fixing structure of heat conduction pad is used to uniformly press two heat conduction pads on the two heat generating electronic components on a circuit board respectively. The fixing structure includes a fixing member and an elastic member. The two ends of the elastic member are a fastening port
A fixing structure of heat conduction pad is used to uniformly press two heat conduction pads on the two heat generating electronic components on a circuit board respectively. The fixing structure includes a fixing member and an elastic member. The two ends of the elastic member are a fastening portion and a fixing portion respectively. The middle part of the elastic member is a pressing portion. In addition, a suspension arm is extended from the fixing portion. When the fastening portion is to be fasten on the circuit board and the fixing portion is to be fixed on the circuit board by the fixing member, the pressing portion presses one of the heat conduction pad on one of the heat generating electronic component, and the suspension arm presses the other heat conduction pad on the other heat generating electronic component.
대표청구항▼
What is claimed is: 1. A heat sink fixing assembly, applied to a first heat conduction pad to press the first heat conduction pad onto a first heat generating electronic component, wherein the first heat generating electronic component is disposed on a circuit board, the heat sink fixing assembly c
What is claimed is: 1. A heat sink fixing assembly, applied to a first heat conduction pad to press the first heat conduction pad onto a first heat generating electronic component, wherein the first heat generating electronic component is disposed on a circuit board, the heat sink fixing assembly comprising a fixing member; and an elastic member, including a fastening portion located at one end of the elastic member, and a fixing portion located at an opposite end of the elastic member, the fastening portion including two legs, each extending from the fixing portion and being symmetrical to the first heat generating electronic component, each leg having a pressing portion at a middle part thereof, wherein when the fastening portion is fastened on the circuit board and the fixing portion is fixed on the circuit board by the fixing member, the pressing portions press the first heat conduction pad toward the first heat generating electronic component. 2. The heat sink fixing assembly as claimed in claim 1, wherein the pressing portions are symmetrical to the first heat generating electronic component functioning as a center and symmetrically pressed on the first heat conduction pad. 3. The heat sink fixing assembly as claimed in claim 1, wherein the circuit board has a screw post located at a position corresponding to the fixing portion, the fixing member being a screw, and a position on the fixing portion corresponding to the screw has a screw hole, the fixing member passing through the screw hole and being fixed to the screw post. 4. The heat sink fixing assembly as claimed in claim 1, wherein the circuit board has a joint pin located at a position corresponding to the fastening portion, and the fastening portion has a U-shaped opening used to hook the joint pin. 5. A heat sink fixing assembly, applied to a first heat conduction pad and a second heat conduction pad to press the first heat conduction pad and the second heat conduction pad onto a first heat generating electronic component and a second heat generating electronic component respectively, wherein the first heat generating electronic component and the second heat generating electronic component are disposed on a circuit board and the first heat generating electronic component is adjacent to the second heat generating electronic component, the heat sink fixing assembly comprising a fixing member; and an elastic member, including a fixing portion, a fastening portion, a pressing portion and a suspension arm extending from the fixing portion, the fastening portion being located at one end of the elastic member, the fixing portion being located at an opposite end of the elastic member, the pressing portion being located between the fixing portion and the fastening portion, wherein when the fastening portion is fastened on the circuit board and the fixing portion is fixed on the circuit board by the fixing member, the pressing portion presses the first heat conduction pad towards the first heat generating electronic component, and the suspension arm is used to press the second heat conduction pad on the second heat generating electronic component. 6. The heat sink fixing assembly as claimed in claim 5, wherein the suspension arm has a pressing plate, and the pressing plate is used to press the second heat conduction pad by means of surface contact. 7. The heat sink fixing assembly as claimed in claim 6, wherein the pressing plate is symmetrical to the second heat generating electronic component and symmetrically pressed on the second heat conduction pad. 8. The heat sink fixing assembly as claimed in claim 5, wherein the pressing portion is symmetrical to the first heat generating electronic component functioning as a center and symmetrically pressed on the first heat conduction pad. 9. The heat sink fixing assembly as claimed in claim 5, wherein the circuit board has a screw post located at a position corresponding to the fixing portion, the fixing member being a screw, and a position on the fixing portion corresponding to the screw has a screw hole, the fixing member passing through the screw hole and being fixed to the screw post. 10. The heat sink fixing assembly as claimed in claim 5, wherein the circuit board has a joint pin located at a position corresponding to the fastening portion, and the fastening portion has a U-shaped opening used to hook the joint pin. 11. A heat sink fixing assembly, applied to a first heat conduction pad and a second heat conduction pad to press the first heat conduction pad and the second heat conduction pad onto a first heat generating electronic component and a second heat generating electronic component respectively, wherein the first heat generating electronic component and the second heat generating electronic component are disposed on a circuit board and the first heat generating electronic component is adjacent to the second heat generating electronic component, the heat sink fixing assembly comprising a fixing member; an elastic member, including a fastening portion, a fixing portion, and a suspension arm, the fastening portion being located at one end of the elastic member and including two legs, each leg extending from the fixing portion and being symmetrical to the first heat generating electronic component, each leg having a pressing portion at a middle part thereof, the fixing portion being located at an opposite end of the elastic member, the suspension arm being extended from the fixing portion of the elastic member, wherein when the fastening portion is fastened on the circuit board and the fixing portion is fixed on the circuit board by the fixing member, the pressing portions press the first heat conduction pad toward the first heat generating electronic component, and the suspension arm is used to press the second heat conduction pad on the second heat generating electronic component. 12. The heat sink fixing assembly as claimed in claim 11, wherein the pressing portions are symmetrical to the first heat generating electronic component functioning as a center and symmetrically pressed on the first heat conduction pad. 13. The heat sink fixing assembly as claimed in claim 11, wherein the circuit board has a screw post at a position corresponding to the fixing portion, the fixing member being a screw, and a position on the fixing portion corresponding to the screw has a screw hole, the fixing member passing through the screw hole and being fixed to the screw post. 14. The heat sink fixing assembly as claimed in claim 11, wherein the circuit board has a joint pin at a position corresponding to the fastening portion, and the fastening portion is a U-shaped opening used to hook the joint pin.
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이 특허에 인용된 특허 (10)
Bell, James Stephen; Mendelow, Matthew Bruce, Apparatus and method for detecting a mechanical component on a computer system substrate.
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