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An electronic device includes a substrate, an electrical element on the substrate, a nonconductive adhesive material on the substrate, and a conductive adhesive material on the electrical element and extending onto the nonconductive adhesive material. Methods of forming a packaged LED include provid

An electronic device includes a substrate, an electrical element on the substrate, a nonconductive adhesive material on the substrate, and a conductive adhesive material on the electrical element and extending onto the nonconductive adhesive material. Methods of forming a packaged LED include providing a substrate having an electrical element thereon, and dispensing a nonconductive adhesive material on the substrate. The nonconductive adhesive material is at least partially cured, and a conductive adhesive material is dispensed on the electrical element and on the at least partially cured nonconductive material. The conductive adhesive material is at least partially cured. The conductive adhesive material may provide an electrical connection between the electrical element and a second electrical element on the substrate or on another substrate.

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What is claimed is: 1. A method of forming a packaged electronic device, comprising: dispensing a liquid nonconductive adhesive material on a substrate having thereon an electrical element; at least partially curing the liquid nonconductive adhesive material; dispensing a liquid conductive adhesive

What is claimed is: 1. A method of forming a packaged electronic device, comprising: dispensing a liquid nonconductive adhesive material on a substrate having thereon an electrical element; at least partially curing the liquid nonconductive adhesive material; dispensing a liquid conductive adhesive material on the electrical element and on the at least partially cured nonconductive material; and at least partially curing the liquid conductive adhesive material. 2. A method of forming a packaged electronic device, comprising: dispensing a nonconductive adhesive material on a substrate having thereon an electrical element; at least partially curing the nonconductive adhesive material; dispensing a conductive adhesive material on the electrical element and on the at least partially cured nonconductive material; at least partially curing the conductive adhesive material; and providing a second electrical element on the substrate; wherein dispensing the conductive adhesive material comprises dispensing the conductive adhesive material on the second electrical element; and wherein the conductive adhesive material provides an electrical connection between the electrical element and the second electrical element. 3. The method of claim 2, further comprising: providing a third electrical element on the substrate; wherein dispensing the nonconductive adhesive material comprises dispensing the nonconductive adhesive material at least partially on the third electrical element. 4. A method of forming a packaged electronic device, comprising: dispensing a nonconductive adhesive material on a substrate having thereon an electrical element; at least partially curing the nonconductive adhesive material; dispensing a conductive adhesive material on the electrical element and on the at least partially cured nonconductive material; at least partially curing the conductive adhesive material; and providing a second substrate adjacent the first substrate, the second substrate having thereon a second electrical element; wherein dispensing the nonconductive adhesive material comprises dispensing the nonconductive adhesive material on an interface between the first substrate and the second substrate; wherein dispensing the conductive adhesive material comprises dispensing the conductive adhesive material on the second electrical element; and wherein the conductive adhesive material provides an electrical connection between the electrical element and the second electrical element. 5. A method of forming a packaged electronic device, comprising: forming a bond pad on a substrate; forming an electrical trace on the substrate, the electrical trace being electrically coupled to the bond pad; forming a nonconductive adhesive material on the electrical trace; at least partially curing the nonconductive adhesive material; dispensing a conductive adhesive material at least partially on the nonconductive adhesive material; positioning a conductive reflector cup on the conductive adhesive material, the reflector cup defining an optical cavity above the bond pad; and curing the conductive adhesive material. 6. The method of claim 5, further comprising: mounting an LED chip on the bond pad; and forming an electrical connection between the LED chip and the conductive reflector cup. 7. The method of claim 6, further comprising: forming a second electrical trace on the substrate; wherein dispensing the conductive adhesive material comprises dispensing the conductive adhesive material at least partially on the second electrical trace; and wherein the conductive adhesive material provides an electrical connection between the conductive reflector cup and the second electrical trace. 8. The method of claim 5, wherein positioning a reflector cup comprises dispensing the conductive adhesive material in an annular pattern on the substrate to thereby form a dispensed reflector cup.