[미국특허]
Rack-mount equipment bay cooling heat exchanger
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
H05K-007/20
H01L-023/36
H01L-023/34
출원번호
US-0501657
(2006-08-09)
등록번호
US-7447022
(2008-11-04)
발명자
/ 주소
Murakami,Vance
Belady,Christian L.
출원인 / 주소
Hewlett Packard Development Company, L.P.
인용정보
피인용 횟수 :
12인용 특허 :
21
초록▼
An apparatus in one example comprises at least one heat exchanger mounted within a rack-mount equipment bay and at least one duct coupled with the at least one heat exchanger that is configured to form a semi-closed cooling loop with at least one electronic device mounted within the rack-mount equip
An apparatus in one example comprises at least one heat exchanger mounted within a rack-mount equipment bay and at least one duct coupled with the at least one heat exchanger that is configured to form a semi-closed cooling loop with at least one electronic device mounted within the rack-mount equipment bay. The at least one duct directs an airflow between the at least one heat exchanger and the at least one electronic device for cooling of the at least one electronic device.
대표청구항▼
What is claimed is: 1. An apparatus, comprising: at least one heat exchanger mounted within a rack-mount equipment bay; and at least one duct coupled with the at least one heat exchanger that is configured to form a semi-closed cooling loop with at least one electronic device mounted within the rac
What is claimed is: 1. An apparatus, comprising: at least one heat exchanger mounted within a rack-mount equipment bay; and at least one duct coupled with the at least one heat exchanger that is configured to form a semi-closed cooling loop with at least one electronic device mounted within the rack-mount equipment bay, the at least one duct comprising an intake duct that directs an intake airflow from the at least one heat exchanger to an intake face of the at least one electronic device; wherein the intake duct comprises a primary delivery duct and at least one vertical duct coupled with the primary delivery duct; wherein the primary delivery duct directs the intake airflow substantially horizontally toward the at least one electronic device; wherein the at least one vertical duct directs the intake airflow substantially vertically from the primary delivery duct to the at least one electronic device; and wherein the primary delivery duct and the at least one vertical duct provide a cold air curtain to an intake face of the at least one electronic device; wherein the at least one duct directs an airflow between the at least one heat exchanger and the at least one electronic device for cooling of the at least one electronic device; wherein the rack-mount equipment bay comprises a plurality of rack locations, wherein the cooling rack is installable in each of the rack locations and wherein the equipment rack is installable in each of the rack locations, the cooling rack thereby being interchangeable with the equipment rack. 2. The apparatus of claim 1, further comprising a dedicated cooling rack within the rack-mount equipment bay; wherein the dedicated cooling rack comprises the at least one heat exchanger; wherein the at least one electronic device comprises a plurality of electronic devices mounted within a plurality of equipment racks of the rack-mount equipment bay; wherein the dedicated cooling rack cools the plurality of electronic devices. 3. The apparatus of claim 1, wherein the at least one duct is external to the at least one heat exchanger and the at least one electronic device. 4. The apparatus of claim 1, wherein the at least one duct comprises an exhaust duct that directs an exhaust airflow from an exhaust face of the at least one electronic device to the at least one heat exchanger. 5. The apparatus of claim 1, wherein the at least one duct comprises at least one damper that directs the airflow through the at least one duct. 6. The apparatus of claim 5 wherein the at least one damper comprises any of a static damper, a manually adjustable damper, and an automatically adjustable damper. 7. The apparatus of claim 1, wherein the at least one duct comprises at least one fan that directs airflow through the at least one duct. 8. The apparatus of claim 7, wherein the at least one fan comprises an adjustable fan. 9. The apparatus of claim 1, further comprising: a control component that monitors and controls cooling of the at least one electronic device. 10. The apparatus of claim 1, wherein the at least one duct comprises an intake duct and an exhaust duct; wherein the intake duct is coupled with the at least one best exchanger and an intake face of the at least one electronic device; wherein the exhaust duct is coupled with the at least one heat exchanger and an exhaust face of the at least one electronic device; wherein the at least one heat exchanger, the intake duct, the at least one electronic device, and the exhaust duct form a closed cooling loop. 11. The apparatus of claim 1, wherein the at least one beat exchanger comprises a refrigerant heat exchanger mounted within the rack-mount equipment bay. 12. An apparatus, comprising: a heat exchanger mounted within a rack-mount equipment bay that cools at least one electronic device mounted within the rack-mount equipment bay, an intake duct that directs an intake airflow from the heal exchanger to the at least one electronic device for cooling the at least one electronic device; an exhaust duct that directs an exhaust airflow from the at least one electronic device to the heat exchanger, a control component that monitors and adjusts the heat exchanger, the intake duct, and/or the exhaust duct through employment of at least one sensor for cooling of the at least one electronic device; wherein the heat exchanger cools the exhaust airflow and circulates the exhaust airflow back to the intake airflow; wherein the intake duct, the heat exchanger, and the exhaust duct form a substantially semi-closed cooling loop; wherein the intake duct comprises a primary delivery duct and at least one vertical duct coupled with the primary delivery duct, wherein the primary delivery duct directs the intake airflow substantially horizontally toward the at least one electronic device; wherein the at least one vertical duct directs the intake airflow substantially vertically from the primary delivery duct to the at least one electronic device; and wherein the primary delivery duct and the at least one vertical duct provide a cold air curtain to an intake face of the at least one electronic device; wherein the rack-mount equipment bay comprises a plurality of rack locations, wherein the cooling rack is installable in each of the rack locations and wherein the equipment rack is installable in each of the rack locations, the cooling rack thereby being interchangeable with the equipment rack. 13. The apparatus of claim 12, wherein the intake duct is coupled with the heat exchanger and the at least one electronic device; wherein the exhaust duct is coupled with the heat exchanger and the at least one electronic device; wherein the heat exchanger, the intake duct, the at least one electronic device, and the exhaust duct form a substantially closed cooling loop. 14. The apparatus of claim 12, wherein the at least one electronic device comprises a plurality of electronic devices mounted within a plurality of equipment shelves of the rack-mount equipment bay; wherein the intake duct directs the intake airflow to the plurality of equipment shelves; wherein the control component adjusts the intake airflow to the plurality of equipment shelves based on current cooling needs of the plurality of electronic devices. 15. The apparatus of claim 12, wherein the intake duct and the exhaust duct comprise one or more of an adjustable damper and an adjustable fan; wherein the control component adjusts the airflow through the intake duct and the exhaust duct through employment of the adjustable damper and the adjustable fan. 16. The apparatus of claim 12, wherein the at least one sensor comprises any of a temperature sensor, airflow sensor, humidity sensor, or differential air pressure sensor. 17. A method, comprising the steps of: positioning at least one heat exchanger within rack row spacing of a rack-mount equipment bay; coupling at least one duct with the at least one heat exchanger to form a semi-closed cooling loop with at least one electronic device mounted within the rack-mount equipment bay, the at least one duct comprising an intake duct that directs an intake airflow from the at least one heat exchanger to an intake face of the at least one electronic device wherein the intake duct comprises a primary delivery duct and at least one vertical duct coupled with the primary delivery duct; directing by the primary delivery duct the intake airflow substantially horizontally toward the at least one electronic device; directing by the at least one vertical duct the intake airflow substantially vertically from the primary delivery duct to the at least one electronic device; and cooling the at least one electronic device through employment of the substantially vertical and substantially horizontal airflow to the at least one electronic device; wherein the rack-mount equipment bay comprises a plurality of rack locations, wherein the cooling rack is installable in each of the rack locations and wherein the equipment rack is installable in each of the rack locations, the cooling rack thereby being interchangeable with the equipment rack. 18. The method of claim 17, wherein the step of coupling the at least one duct with the at least one heat exchanger comprises the step of: coupling an exhaust duct with the at least one heat exchanger and the at least one electronic device; wherein the step of directing the airflow between the at least one heat exchanger and the at least one electronic device comprises the step of: receiving exhaust airflow from the at least one electronic device through the exhaust duct; wherein the step of cooling the at least one electronic device through employment of the beat exchanger and the at least one duct comprises the step of: cooling the exhaust airflow through employment of the heat exchanger. 19. The method of claim 17, wherein the step of coupling the at least one duct with the at least one heat exchanger comprises the step of: coupling an intake duct with the at least one heat exchanger and the at least one electronic device; wherein the step of directing the airflow between the at least one heat exchanger and the at least one electronic device comprises the step of: directing the intake airflow to the at least one electronic device through the intake duct to cool the at least one electronic device. 20. The method of claim 19, wherein the step of coupling the at least one duct with the at least one heat exchanger comprises the step of; coupling an exhaust duct with the at least one heat exchanger and the at least one electronic device; wherein the step of directing the airflow between the at least one heat exchanger and the at least one electronic device comprises the steps of: receiving exhaust airflow from the at least one electronic device through the exhaust duct; and circulating the exhaust airflow to intake airflow. 21. The method of claim 20, wherein the rack-mount equipment bay comprises a first equipment shelf and a second equipment shelf, wherein the at least one electronic device comprises a first electronic device mounted within the first equipment shelf and a second electronic device mounted within the second equipment shelf, the method further comprising the steps of: determining a first amount of the intake airflow for the first equipment shelf based on current cooling needs of the first electronic device; determining a second amount of the intake airflow for the second equipment shelf based on current cooling needs of the second electronic device, wherein the second amount is greater than the first amount; diverting the first amount of the intake airflow to the first equipment shelf through employment of at least one of an adjustable damper and an adjustable fan; diverting the second amount of the intake airflow to the second equipment shelf through employment of at least one of the adjustable damper and the adjustable fan. 22. The method of claim 17, further comprising the steps of: monitoring the cooling of the at least one electronic device through employment of a control component and at least one sensor adjusting the cooling of the at least one electronic device, through employment of at least one of an adjustable damper and an adjustable fan, based on current cooling needs of the at least one electronic device.
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