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Card cage with parallel flow paths having substantially similar lengths 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
  • F28F-007/00
출원번호 US-0469713 (2006-09-01)
등록번호 US-7450384 (2008-11-11)
발명자 / 주소
  • Tavassoli,Kamran
  • Porreca,Paul J.
  • Sullivan,Robert C.
출원인 / 주소
  • Hybricon Corporation
대리인 / 주소
    Mills & Onello LLP
인용정보 피인용 횟수 : 19  인용 특허 : 63

초록

A card cage configured to hold a set of electronics cards comprises a set of walls having an input and an output and a set of flow paths formed in the set of walls to enable a fluid to flow therein. The set of flow paths includes a first flow path formed between the input and the output and in first

대표청구항

What is claimed is: 1. A card cage configured to hold a set of electronics cards, the card cage comprising: a set of walls, the set of walls having an input configured to receive a fluid and an output configured as a fluid exit; a set of flow paths formed in the set of walls to enable a fluid to fl

이 특허에 인용된 특허 (63)

  1. Davidson Howard L. (San Carlos CA), Apparatus for cooling compact arrays of electronic circuitry.
  2. Ashiwake Noriyuki (Tsuchiura JPX) Nakajima Tadakatsu (Ibaraki JPX) Sasaki Shigeyuki (Ibaraki JPX) Ohsone Yasuo (Tsuchiura JPX) Hatada Toshio (Tsuchiura JPX) Iino Toshiki (Ibaraki JPX) Kasai Kenichi (, Apparatus for cooling semiconductor device and computer having the same.
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  7. Smith William A. (Laguna Hills CA), Circuit card assembly conduction converter.
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  15. Mueller, Marcus, Cooler for electrical and/ or electronic components, linked to present cooling needs.
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  17. August Melvin C. (Chippewa Falls WI) Neumann Eugene F. (Chippewa Falls WI) Bowen Stephen A. (Chippewa Falls WI) Williams John T. (Chippewa Falls WI), Cooling plate with interboard connector apertures for circuit board assemblies.
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  19. Roush ; Maurice Dean, Cooling system for electronic assembly.
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  22. Galyon George T. (Fishkill NY) Jordhamo George M. (Wappingers Falls NY) Moran Kevin P. (Wappingers Falls NY) Zumbrunnen Michael L. (Poughkeepsie NY), Cross-hatch flow distribution and applications thereof.
  23. Wolgemuth James H. (Rochester Hills MI) Madak Joseph (Madison Heights MI), Device for cooling power electronics.
  24. Goodwin, Jonathan; Amaral, Jr., Donald P., Electrical and fluid interconnect.
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  26. Morrison Robert A. (Granada Hills CA) Frink Attila (Northridge CA), Electronic packaging module utilizing phase-change conductive cooling.
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  29. Chu Richard C. ; Chrysler Gregory M., Evaporator for use in an extended air cooling system for electronic components.
  30. Chu Richard C. ; Chrysler Gregory M., Extended air cooling with heat loop for dense or compact configurations of electronic components.
  31. Porter, George K.; Wolf, Seth B.; Albrecht, Charles W., Flow controller.
  32. Whyatt,Greg A.; Davis,James M., Fluid processing device and method.
  33. Capriz, Cesare; Rossi, Luca, Fluid-cooled heat sink for electronic components.
  34. Wilson,Michael J.; Wert,Kevin L.; Wattelet,Jonathan; DeKeuster,Richard; Lightner,Donald, Forced fluid heat sink.
  35. Lazarek Gerald M. (Schenectady NY) Staub Fred W. (Schenectady NY), Forced vaporization heat sink for semiconductor devices.
  36. Wenke Gerhard (Los Angeles CA), Heat conducting interface for electronic module.
  37. Hsien, Cho-Chang, Heat dissipation device by liquid cooling.
  38. Batchelor, Andrew W.; Banney, Ben; McDonald, David; Chandratilleke, Tilak T., Heat exchanger for an electronic heat pump.
  39. Koizumi Hisao (Zushi JPX), Heat transfer apparatus.
  40. Hsiao Chieh-Jen,TWX, Heat-dissipating apparatus for an integrated circuit device.
  41. Giannatto Carl J. ; Cornish Kevin C., Housing for diverse cooling configuration printed circuit cards.
  42. Bartilson Bradley W., Large area, multi-device heat pipe for stacked MCM-based systems.
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  46. Weber,Richard M., Method and apparatus for cooling with coolant at a subambient pressure.
  47. Wyatt, William Gerald; Weber, Richard M., Method and apparatus for extracting non-condensable gases in a cooling system.
  48. Prasher, Ravi; Mahajan, Ravi, Micro-channel heat exchangers and spreaders.
  49. Wong,Shwin Chung, Microchannel heat pipe with parallel grooves for recycling coolant.
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  51. Vafai, Kambiz; Zhu, Lu, Multi-layered micro-channel heat sink, devices and systems incorporating same.
  52. Hamilton Robin E. ; Kennedy Paul G. ; Vale Christopher R., Non-mechanical magnetic pump for liquid cooling.
  53. Thayer,John G.; Wert,Kevin L.; North,Mark T.; Schaeffer,C. Scott, Porous media cold plate.
  54. Welsh, James W., Retention and cooling of plug-in electronic modules in a high shock and vibration environment.
  55. Schierz ; Winfried, Semiconductor rectifier device with improved cooling arrangement.
  56. Bear, Daniel B., Single or dual buss thermal transfer system.
  57. Janko Steven P., Small volume heat sink/electronic assembly.
  58. Tilton Donald E. ; Seaney Kevin D. ; Baddeley Ryan J ; Tilton Charles L, Spray cooled circuit card cage.
  59. Khrustalev, Dmitry; Zuo, Jon, Thermal bus for cabinets housing high power electronics equipment.
  60. Bash, Cullen E.; Patel, Chandrakant D.; Simon, Glenn C., Thermal connector for cooling electronics.
  61. Iversen Arthur H. (15315 Sobey Rd. Saratoga CA 95070), Thermal management of power conditioning systems.
  62. Bartholomew Wesley E. (Palos Verdes CA), Thermally controlled electronic system package.
  63. Prasher, Ravi; Mahajan, Ravi, Two-phase cooling utilizing microchannel heat exchangers and channeled heat sink.

이 특허를 인용한 특허 (19)

  1. Roering, Sebastian, Aircraft signal computer system having a plurality of modular signal computer units.
  2. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Apparatus and method for facilitating pumped immersion-cooling of an electronic subsystem.
  3. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Apparatus and method for immersion-cooling of an electronic system utilizing coolant jet impingement and coolant wash flow.
  4. Anderl, William James; Colgan, Evan George; Gerken, James Dorance; Marroquin, Christopher Michael; Tian, Shurong, Cooling system for electronic components.
  5. Anderl, William James; Colgan, Evan George; Gerken, James Dorance; Marroquin, Christopher Michael; Tian, Shurong, Cooling system for electronic components.
  6. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Immersion-cooling apparatus and method for an electronic subsystem of an electronics rack.
  7. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Interleaved, immersion-cooling apparatus and method for an electronic subsystem of an electronics rack.
  8. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Interleaved, immersion-cooling apparatuses and methods for cooling electronic subsystems.
  9. Garrett, Gerald Bruce, Liquid storage and cooling computer case.
  10. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Liquid-cooled electronics rack with immersion-cooled electronic subsystems.
  11. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Liquid-cooled electronics rack with immersion-cooled electronic subsystems and vertically-mounted, vapor-condensing unit.
  12. Meijer, Gerhard I.; Schmidt, Derek I.; Steinke, Mark E.; Womble, James S., Liquid-cooled memory system having one cooling pipe per pair of DIMMs.
  13. Cipolla, Thomas M.; Tian, Shurong; Colgan, Evan George; Coteus, Paul W.; Hall, Shawn Anthony, Method and apparatus of water cooling several parallel circuit cards each containing several chip packages.
  14. Mulcahy, Gary; Icoz, Tunc, Modular scalable liquid cooled power system.
  15. Tilton, Charles L; Tilton, Donald E.; Palmer, Randall T.; Beasley, William J.; Miller, Douglas W.; Alder, Norman O., Narrow gap spray cooling in a globally cooled enclosure.
  16. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Open flow cold plate for immersion-cooled electronic packages.
  17. Kehret, William E.; Smith, Dennis Henry, Printed circuit board module enclosure and apparatus using same.
  18. Icoz, Tunc; Santini, John; Mulcahy, Gary; Feely, James, Sealed enclosure for power electronics incorporating a heat exchanger.
  19. Gauthier, David Thomas; Helsel, Michael Rees; Keehn, Nicholas Andrew, Server cooling fluid inlet and pickup placement in submerged cooling enclosures.
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