A cooling-fan-free system module includes a housing unit, a circuit module, and a heat radiating unit. The housing unit includes a front and a rear case assembled together to define a receiving space therebetween, and the rear case is made of a highly heat conducting metal material. The circuit modu
A cooling-fan-free system module includes a housing unit, a circuit module, and a heat radiating unit. The housing unit includes a front and a rear case assembled together to define a receiving space therebetween, and the rear case is made of a highly heat conducting metal material. The circuit module is received in the receiving space of the housing unit, and includes a circuit board, and at least one heat-producing element mounted on and electrically connected to the circuit board. The heat radiating unit includes at least one insulating heat conductor bonded to an inner side of the rear case corresponding to the heat-producing element for transferring the heat produced by the heat-producing element to the rear case, and at least one heat radiating member integrally formed on a back side of the rear case and consisting of a plurality of radiating fins.
대표청구항▼
What is claimed is: 1. A cooling-fan-free system module, comprising: a housing unit including a front case and a rear case assembled together to define a receiving space therebetween, said rear case being made of a highly heat conducting metal material and having an inner side facing toward said re
What is claimed is: 1. A cooling-fan-free system module, comprising: a housing unit including a front case and a rear case assembled together to define a receiving space therebetween, said rear case being made of a highly heat conducting metal material and having an inner side facing toward said receiving space and a back side facing away from said receiving space; a circuit module received in said receiving space, said circuit module including a circuit board, and at least one heat-producing element mounted on and electrically connected to one side of said circuit board facing toward said inner side of said rear case; and a heat radiating unit including at least one insulating heat conductor bonded to said inner side of said rear case at a position corresponding to said at least one heat-producing element, so as to transfer heat produced by said at least one heat-producing element to said rear case, and at least one heat radiating member integrally formed on said back side of said rear case and consisting of a plurality of radiating fins, wherein said rear case is further provided at a rear lower edge and a rear upper edge with a first and a second cutaway portion, respectively, to communicate said receiving space with an outer side of said housing unit; and wherein said circuit module further includes at least one signal transmission element mounted on and electrically connected to said circuit board, and at least one bracket assembled to an inner lower side of said housing unit: said bracket being provided with at least one opening corresponding to said at least one signal transmission element, and at least one aperture communicating with said first and said second cutaway portion. 2. The cooling-fan-free system module as claimed in claim 1, wherein said second cutaway portion consists of a row of densely spaced vents. 3. The cooling-fan-free system module as claimed in claim 1, wherein said at least one insulating heat conductor is made of a flexible material. 4. The cooling-fan-free system module as claimed in claim 1, wherein said at least one heat-producing element is selected from the group consisting of a CPU, a hard disk, a memory, and an IC. 5. The cooling-fan-free system module as claimed in claim 1, wherein said rear case includes a first cover that is assembled to said front case and has a third cutaway portion, and a second cover that is detachably connected to and openably closes said third cutaway portion of said first cover. 6. The cooling-fan-free system module as claimed in claim 5, wherein said first cover further includes at least one locating mortise formed at an inner lateral edge of said third cutaway portion, and said second cover further includes at least one locating tenon corresponding to and adapted to engage with said at least one locating mortise. 7. The cooling-fan-free system module as claimed in claim 1, wherein said inner side of said rear case is provided with at least one holding-down plate corresponding to said at least one heat-producing element, and said at least one insulating heat conductor is bonded to said at least one holding-down plate of said inner side of said rear case, said at least one holding-down plate being raised from said inner side of said rear case, so as to press against said at least one insulating heat conductor for the same to more tightly contact with said at least one heat-producing element. 8. The cooling-fan-free system module as claimed in claim 7, wherein said at least one holding-down plate is separately produced and then assembled to said inner side of said rear case to become raised therefrom. 9. The cooling-fan-free system module as claimed in claim 1, further comprising at least one separately produced holding-down plate assembled to and raised from said at least one insulating heat conductor to be in direct contact with said at least one heat-producing element. 10. The cooling-fan-free system module as claimed in claim 1, wherein said rear case is provided along a periphery thereof at predetermined positions with a plurality of ventilating holes. 11. The cooling-fan-free system module as claimed in claim 1, further comprising a display module. 12. A cooling-fan-free system module, comprising: a housing unit including a front case and a rear case assembled together to define a receiving space therebetween, said rear case being made of a highly heat conducting metal material and having an inner side facing toward said receiving space and a back side facing away from said receiving space; a circuit module received in said receiving space, said circuit module including a circuit board, and at least one heat-producing element mounted on and electrically connected to one side of said circuit board facing toward said inner side of said rear case; and a heat radiating unit including at least one insulating heat conductor bonded to said inner side of said rear case at a position corresponding to said at least one heat-producing element, so as to transfer heat produced by said at least one heat-producing element to said rear case, and at least one heat radiating member integrally formed on said back side of said rear case and consisting of a plurality of radiating fins, wherein said rear case includes a first cover that is assembled to said front case and has a third cutaway portion, and a second cover that is detachably connected to and openably closes said third cutaway portion of said first cover. 13. The cooling-fan-free system module as claimed in claim 12, wherein said first cover further includes at least one locating mortise formed at an inner lateral edge of said third cutaway portion, and said second cover further includes at least one locating tenon corresponding to and adapted to engage with said at least one locating mortise. 14. The cooling-fan-free system module as claimed in claim 12, wherein said inner side of said rear case is provided on with at least one holding-down plate corresponding to said at least one heat-producing element, and said at least one insulating heat conductor is bonded to said at least one holding-down plate of said inner side of said rear case, said at least one holding-down plate being raised from said inner side of said rear case, so as to press against said at least one insulating heat conductor for the same to more tightly contact with said at least one heat-producing element. 15. The cooling-fan-free system module as claimed in claim 14, wherein said at least one holding-down plate is separately produced and then assembled to said inner side of said rear case to become raised therefrom. 16. The cooling-fan-free system module as claimed in claim 12, further comprising at least one separately produced holding-down plate assembled to and raised from said at least one insulating heat conductor to be in direct contact with said at least one heat-producing element. 17. The cooling-fan-free system module as claimed in claim 12, wherein said rear case is provided along a periphery thereof at predetermined positions with a plurality of ventilating holes. 18. The cooling-fan-free system module as claimed in claim 12, further comprising a display module. 19. The cooling-fan-free system module as claimed in claim 12, wherein said at least one insulating heat conductor is made of a flexible material. 20. The cooling-fan-free system module as claimed in claim 12, wherein said at least one heat-producing element is selected from the group consisting of a CPU, a hard disk, a memory, and an IC.
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이 특허에 인용된 특허 (13)
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