IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0983601
(2007-11-09)
|
등록번호 |
US-7466732
(2008-12-16)
|
발명자
/ 주소 |
- Stephens, IV,Edward Franklin
|
출원인 / 주소 |
- Northrop Grumman Corporation
|
대리인 / 주소 |
|
인용정보 |
피인용 횟수 :
4 인용 특허 :
91 |
초록
▼
A laser diode assembly has a laser diode. The laser diode has an emitting surface and a reflective surface opposing the emitting surface. The laser diode has first and second side surfaces between the emitting and reflective surfaces. A first electrically-insulating heat sink is attached to the firs
A laser diode assembly has a laser diode. The laser diode has an emitting surface and a reflective surface opposing the emitting surface. The laser diode has first and second side surfaces between the emitting and reflective surfaces. A first electrically-insulating heat sink is attached to the first side surface of the laser diode via a first solder bond, and the first heat sink has a first cooling channel. A second electrically-insulating heat sink is attached to the second side surface of the laser diode via a second solder bond, and the second electrically-insulating heat sink has a second cooling channel. A substrate has a top side and a bottom side, and the top side being in communication with a first bottom side of the first electrically-insulating heat sink and a second bottom side of the second electrically-insulating heat sink. The substrate has a flow channel system for passing a coolant to the first cooling channel and the second cooling channel. A metallization layer is attached to the first electrically-insulating heat sink and the second electrically-insulating heat sink. The metallization layer is electrically coupled to the laser diode and conducts electrical current to the laser diode. The metallization layer is isolated from the coolant.
대표청구항
▼
What is claimed is: 1. A laser diode assembly, comprising: a laser diode having an emitting surface and a reflective surface opposing the emitting surface, the laser diode having first and second side surfaces between the emitting and reflective surfaces; a first electrically insulating heat sink a
What is claimed is: 1. A laser diode assembly, comprising: a laser diode having an emitting surface and a reflective surface opposing the emitting surface, the laser diode having first and second side surfaces between the emitting and reflective surfaces; a first electrically insulating heat sink attached to the first side surface of the laser diode via a first solder bond, the first heat sink having a first cooling channel; a second electrically insulating heat sink attached to the second side surface of the laser diode via a second solder bond, the second electrically insulating heat sink having a second cooling channel; a substrate having a top side, the top side being in communication with a first bottom side of the first electrically insulating heat sink and a second bottom side of the second electrically insulating heat sink, the substrate having a flow channel system for passing a coolant to the first cooling channel and the second cooling channel; and a metallization layer attached to the first electrically insulating heat sink and the second electrically insulating heat sink, the metallization layer being electrically coupled to the laser diode and conducting electrical current to the laser diode, the metallization layer being isolated from the coolant. 2. The laser diode assembly of claim 1, wherein the flow channel system provides the coolant to the first heat sink and the second heat sink in a parallel flow path. 3. The laser diode assembly of claim 1, wherein the first electrically insulating heat sink and the second electrically insulating heat sink are formed of bonded layers of silicon. 4. The laser diode assembly of claim 1, wherein the flow channel system has an inlet, an outlet, and a bypass region, the inlet providing the coolant to the first electrically insulating heat sink, the bypass region passing the coolant from the first electrically insulating heat sink to the second electrically insulating heat sink, and the outlet receiving the coolant from the second electrically insulating heat sink. 5. The laser diode assembly of claim 1, wherein the substrate is made of a plurality of layers that are fused together to create the bypass region. 6. The laser diode assembly of claim 1, wherein at least one of the first and second electrically insulating heat sinks includes an impingement region causing the coolant to impinge against a wall that is near one of the first and second side surfaces of the laser diode. 7. The laser diode assembly of claim 6, wherein the impingement region provides a plurality of streams of the coolant against the wall, the impingement region being made of a structure encased in the electrically insulating heat sinks. 8. The laser diode assembly of claim 1, wherein the first and second electrically insulating heat sinks include metallization regions for receiving the first and second solder bonds. 9. The laser diode assembly of claim 1, wherein the metallization layer is located on an exterior surface of the first and second electrically insulating heat sinks. 10. A laser diode assembly, comprising: a laser diode having an emitting surface and a reflective surface opposing the emitting surface, the laser diode having first and second side surfaces between the emitting and reflective surfaces; a first heat sink attached to the first side surface of the laser diode, the first heat sink being comprised of a first set of metallic layers that are attached together to create a first cooling channel; a second heat sink attached to the second side surface of the laser diode, the second heat sink being comprised of a second set of metallic layers that are attached together to create a second cooling channel; at least one substrate being in communication with the first heat sink and the second heat sink, wherein the at least one substrate has a flow channel system for passing a coolant to the first cooling channel and the second cooling channel; and a metallic path being electrically coupled to the laser diode and conducting electrical current to the laser diode, the metallic path including the first and second set of metallic layers of the first and second heats sinks. 11. The laser diode assembly according to claim 10, wherein the at least one substrate includes one substrate, and the flow channel system includes a bypass region, an inlet, and an outlet, the inlet providing the coolant to the first heat sink, the bypass region passing the coolant from the first heat sink to the second heat sink, the outlet receiving the coolant from the second heat sink. 12. The laser diode assembly according to claim 10, wherein the first sets of metallic layers and the second set of metallic layers are copper sheets. 13. The laser diode assembly according to claim 10, wherein the substrate is located below the first and second heat sinks, the substrate including inlets on a top surface for providing the coolant to the first heat sink and the second heat sink. 14. A laser diode assembly, comprising: a laser diode having an emitting surface and a reflective surface opposing the emitting surface, the laser diode having first and second side surfaces between the emitting and reflective surfaces; a first heat sink having a first attachment region attached to the first side surface of the laser diode, the first heat sink being comprised of an electrically insulating material and including a first cooling channel that moves a coolant adjacent to the first attachment region; a second heat sink having a second attachment region attached to the second side surface of the laser diode, the second heat sink being comprised of electrically insulating layer material and including a second cooling channel that moves a coolant adjacent to the second attachment region; a substrate being in communication with the first heat sink and the second heat sink, the substrate has a flow channel system for distributing the coolant to the first cooling channel and the second cooling channel; and a metallic path being electrically coupled to the laser diode and conducting electrical current to the laser diode. 15. The laser diode assembly according to claim 14, wherein the metallic path includes a metallization layer on the first and second heat sinks and solder layers attaching the first and second heat sinks to the laser diode. 16. The laser diode assembly according to claim 14, wherein the first heat sink is created by bonding a first set of the electrically insulating layers, and the second heat sink is created by bonding a second set of the electrically insulating layers. 17. The laser diode assembly according to claim 14, wherein at least the first heat sink includes an impingement region causing the coolant to impinge against the first attachment region near the first side surface of the laser diode. 18. The laser diode assembly according to claim 14, wherein the electrically insulating layers are silicon. 19. The laser diode assembly according to claim 14, wherein the electrically insulating layers are PEEK. 20. The laser diode assembly according to claim 14, wherein the electrically insulating layers are diamond.
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