Insulating film-forming composition, insulating film and production method thereof
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
E04B-001/62
E04B-001/74
C08G-077/48
C08G-077/00
C08L-083/14
C08L-083/00
C09D-001/00
C09D-005/25
C09D-183/14
출원번호
US-0502389
(2006-08-11)
등록번호
US-7497965
(2009-03-03)
우선권정보
JP-P2005-233294(2005-08-11)
발명자
/ 주소
Wariishi,Koji
Watanabe,Katsuyuki
Takahashi,Kazutaka
출원인 / 주소
FUJIFILM Corporation
대리인 / 주소
Sughrue Mion, PLLC
인용정보
피인용 횟수 :
12인용 특허 :
0
초록▼
An insulating film-forming composition comprising: at least one of a compound represented by formula (1) as defined in the specification, a hydrolysate and a condensate thereof; and at least one solvent, wherein the at least one solvent contains an organic solvent(s) having a boiling point of 85 to
An insulating film-forming composition comprising: at least one of a compound represented by formula (1) as defined in the specification, a hydrolysate and a condensate thereof; and at least one solvent, wherein the at least one solvent contains an organic solvent(s) having a boiling point of 85 to 250�� C. in an amount of 25 mass % or more; a method for producing an insulating film by using the composition; and the insulating film.
대표청구항▼
What is claimed is: 1. An insulating film-forming composition comprising: at least one of a compound represented by formula (1), a hydrolysate of the compound represented by formula (1) and a condensate of the compound represented by formula (1); and at least one solvent, wherein the at least one s
What is claimed is: 1. An insulating film-forming composition comprising: at least one of a compound represented by formula (1), a hydrolysate of the compound represented by formula (1) and a condensate of the compound represented by formula (1); and at least one solvent, wherein the at least one solvent contains an organic solvent(s) having a boiling point of 85 to 250�� C. in an amount of 25 mass % or more: wherein R1, R2, R3 and R4 each independently represents a hydrogen atom or a substituent, provided that at least one of R1 and R2 represents a hydrolyzable group; and the substituent represented by R1 to R4 is a halogen atom, a linear, branched or cyclic alkyl group having a carbon number of 1 to 10, an alkenyl group having a carbon number of 2 to 10, an alkynyl group having a carbon number of 2 to 10, an aryl group having a carbon number of 6 to 20, an acyl group having a carbon number of 2 to 10, an alkoxy group having a carbon number of 1 to 10, a silyloxy group having a carbon number of 3 to 10, an aryloxy group having a carbon number of 6 to 20, an acyloxy group having a carbon number of 2 to 10, or a hydroxyl group; X1 represents a carbon atom or a silicon atom; L1 represents a divalent linking group; m represents 0 or 1; and n represents an integer of 3 to 5 when m is 0, and represents an integer of 2 to 3 when m is 1. 2. The insulating film-forming composition according to claim 1, wherein X1 is a carbon atom, and L1 is an alkylene group. 3. The insulating film-forming composition according to claim 1, wherein m is 0. 4. The insulating film-forming composition according to claim 1, which further comprises an organic silicon compound represented by formula (A) or a polymer of the organic silicon compound represented by formula (A): description="In-line Formulae" end="lead"(Ra)q--Si--(ORb)4-q (A)description="In-line Formulae" end="tail" wherein Ra represents an alkyl group, an aryl group or a heterocyclic group; Rb represents a hydrogen atom, an alkyl group, an aryl group or a silyl group, and Ra and Rb each may further has a substituent; and q represents an integer of 0 to 3, and when q or 4-q is 2 or more, Ra's or Rb's may be the same or different. 5. The insulating film-forming composition according to claim 4, wherein q is an integer of 0 to 2, and Rb is an alkyl group. 6. The insulating film-forming composition according to claim 1, wherein the organic solvent(s) has at least one of an ether group, an ester group and a carbonyl group. 7. The insulating film-forming composition according to claim 1, which further comprises an inorganic protonic acid or an organic protonic acid. 8. The insulating film-forming composition according to claim 1, which further comprises water. 9. The insulating film-forming composition according to claim 1, which further comprises a surfactant. 10. An insulating film formed from an insulating film-forming composition according to claim 1. 11. A method for producing an insulating film, comprising: coating a composition according to claim 1 on a substrate; and subjecting the coated composition to a heat treatment.
연구과제 타임라인
LOADING...
LOADING...
LOADING...
LOADING...
LOADING...
이 특허를 인용한 특허 (12)
Podsiadlo, Paul; Wu, Jianxin; Benitez, Kiara M.; Li, Quanchang; Calabro, David Charles, Adsorbent for heteroatom species removal and uses thereof.
Podsiadlo, Paul; Li, Quanchang; Calabro, David Charles; Beeckman, Jean Willem Lodewijk; Zhang, Lei; Benitez, Kiara M.; Ide, Matthew Scott; McCarthy, Stephen John; Afeworki, Mobae; Weston, Simon Christopher; Kamakoti, Preeti; Shah, Matu J.; Lai, Wenyih Frank; Nines, Meghan; Griffin, David A.; Johnson, Ivy D., Aromatic hydrogenation catalysts and uses thereof.
Podsiadlo, Paul; Li, Quanchang; Calabro, David C.; Benitez, Kiara M.; Mertens, Machteld M. W.; Weigel, Scott J.; Levin, Doron; Partridge, Randall D., Catalysts and methods of making the same.
Weigel, Scott J.; Zhang, Lei; Li, Quanchang; Lacy, Darryl Donald; Podsiadlo, Paul; Calabro, David Charles; Kaul, Bal; Gleeson, James William, Methods of separating aromatic compounds from lube base stocks.
Holtcamp, Matthew W.; Bedoya, Matthew S.; Harlan, Charles J.; Li, Quanchang; Mertens, Machteld M. W., Olefin polymerization catalyst system comprising mesoporous organosilica support.
Holtcamp, Matthew W.; Harlan, Charles J.; Li, Quanchang; Mertens, Machteld M. W., Olefin polymerization catalyst system comprising mesoporous organosilica support.
Li, Quanchang; Kamakoti, Preeti; Calabro, David Charles; Lee, Mary Kathryn; Cundy, Stephen M.; Mao, Kanmi; Shah, Matu J.; Peiffer, Dennis George; Leta, Daniel P., Organosilica materials and uses thereof.
Falkowski, Joseph M.; Afeworki, Mobae; Calabro, David C.; Griffin, David A.; Weston, Simon C., Sulfur terminated organosilica materials and uses thereof.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.