[특허]Electrochemically fabricated microprobes

[미국특허] Electrochemically fabricated microprobes 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	G01R-031/02
출원번호	US-0244817 (2005-10-06)
등록번호	US-7504840 (2009-03-17)
발명자 / 주소	Arat,Vacit Cohen,Adam L. Smalley,Dennis R. Kruglick,Ezekiel J. J. Chen,Richard T. Kim,Kieun
출원인 / 주소	Microfabrica Inc.
대리인 / 주소	Smalley,Dennis R.
인용정보	피인용 횟수 : 1 인용 특허 : 57

초록 ▼

Multilayer test probe structures are electrochemically fabricated via depositions of one or more materials in a plurality of overlaying and adhered layers. In some embodiments each probe structure may include a plurality of contact arms or contact tips that are used for contacting a specific pad or plurality of pads wherein the arms and/or tips are configured in such away so as to provide a scrubbing motion (e.g. a motion perpendicular to a primary relative movement motion between a probe carrier and the IC) as the probe element or array is made to contact an IC, or the like, and particularly when the motion between the probe or probes and the IC occurs primarily in a direction that is perpendicular to a plane of a surface of the IC. In some embodiments arrays of multiple probes are provided and even formed in desired relative position simultaneously.

대표청구항 ▼

We claim: 1. A probe device for testing integrated circuits, comprising: a conductive bridging element; a plurality of conductive contact arms, each having a first end and a second end, where the second end of each connects to the bridging element and the first end of each is configured to contact a common pad of an integrated circuit and wherein the arms are configured to cause at least one of the first ends to scrub a surface of the pad relative to at least another one of the first ends as contact between the first ends and the pad is made; and at least one pushing element that causes the arms to separate as each of the first ends is mated to a pad. 2. The probe of claim 1 wherein a relative movement between the bridging element of the probe device and the pad of the integrated circuit is substantially perpendicular to a plane of the pad. 3. The probe of claim 1 wherein the plurality of the contact arms have an outward taper. 4. The probe of claim 1 wherein the plurality of the contact arms have an inward taper. 5. The probe of claim 1 wherein the second end of each arm comprises a compliant member. 6. The probe of claim 5 wherein the compliant member provides compliance in a direction parallel to a direction of relative movement between the pad and the bridging element. 7. The probe of claim 1 wherein the bridging element comprises a compliant member. 8. The probe of claim 7 wherein the compliant member provides compliance in a direction parallel to a direction of relative movement between the pad and the bridging element. 9. The probe of claim 7 wherein the compliant member is located adjacent the plurality of arms. 10. The probe of claim 7 wherein the compliant member is located away from a location where the second end of the arms contact the bridging element. 11. The probe of claim 1 wherein the pushing element operates as a result of a contact between the first end and the pad as the pad and the first end are brought into contact. 12. The probe of claim 1 wherein the pushing element is controlled to operate independently of a movement of the contact arms and the pad. 13. A probe device for testing integrated circuits, comprising: a conductive bridging element; a plurality of conductive contact arms, each having a first end and a second end, where the second end of each connects to the bridging element and the first end of each is configured to contact a common pad of an integrated circuit and wherein the arms are configured to cause at least one of the first ends to scrub a surface of the pad relative to a least another one of the first ends as contact between the first ends and the pad is made; and. at least one pulling element that causes the arms to come together as each of the first ends is mated to the pad. 14. The probe of claim 1 wherein the plurality of contact arms are formed from a plurality of adhered layers of deposited material. 15. The probe of claim 7 wherein the compliant member is formed from a plurality of adhered layers of material. 16. A probe device for testing integrated circuits, comprising: a conductive bridging element; a plurality of conductive contact arms, each having a first end and a second end, where the second end of each connects to the bridging element and the first end of each is configured to contact a common pad of an integrated circuit and wherein multiple arms of the plurality of arms are configured to provide compliance between the probe device and the pad as contact between the plurality of contact arms and the pad is made; and at least one pushing element that causes the arms to separate as each of the first ends is mated to the pad. 17. The probe of claim 16 wherein a relative movement between the bridging element of the probe device and the pad of the integrated circuit is substantially perpendicular to a plane of the pad. 18. The probe of claim 16 wherein the plurality of the contact arms have an outward taper. 19. The probe of claim 16 wherein the plurality of the contact arms have an inward taper. 20. The probe of claim 16 additionally wherein the second end of each arm comprises a compliant member. 21. The probe of claim 20 wherein the compliant member provides compliance in a direction parallel to a direction of relative movement between the pad and the bridging element. 22. The probe of claim 16 wherein the bridging element comprises a compliant member. 23. The probe of claim 22 wherein the compliant member provides compliance in a direction parallel to a direction of relative movement between the pad and the bridging element. 24. The probe of claim 22 wherein the compliant member is located adjacent the plurality of arms. 25. The probe of claim 22 wherein the compliant member is located away from a location where the second end of the arms contact the bridging element. 26. The probe of claim 16 wherein the pushing element operates as a result of a contact between the first end and the pad as the pad and the first end are brought into contact. 27. The probe of claim 16 wherein the pushing element is controlled to operate independently of a movement of the contact arms and the pad. 28. A probe device for testing integrated circuits, comprising: a conductive bridging element; a plurality of conductive contact arms, each having a first end and a second end, where the second end of each connects to the bridging element and the first end of each is configured to contact a common pad of an integrated circuit and wherein multiple arms of the plurality of arms are configured to provide compliance between the probe device and the pad as contact between the plurality of contact arms and the pad is made; and at least one pulling element that causes the arms to come together as each of the first ends is mated to the pad. 29. The probe of claim 16 wherein the plurality of contact arms are formed from a plurality of adhered layers of deposited material. 30. The probe device of claim 1 incorporated into an array of probe devices with a plurality of probe devices each comprising a conductive bridging element and a plurality of conductive arms where each of the plurality of probe devices is adhered to a substrate. 31. The probe device of claim 16 incorporated into an array of probe devices with a plurality of probe devices each comprising a conductive bridging element and a plurality of conductive arms where each of the plurality of probe devices is adhered to a substrate.

이 특허에 인용된 특허 (57) 인용/피인용 타임라인 분석

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[미국특허] Electrochemically fabricated microprobes 원문보기

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[미국특허] Electrochemically fabricated microprobes 원문보기

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