[특허]Cantilever microprobes for contacting electronic components and methods for making such probes

[미국특허] Cantilever microprobes for contacting electronic components and methods for making such probes 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	G01R-031/02
출원번호	US-0695577 (2007-04-02)
등록번호	US-7511523 (2009-03-31)
발명자 / 주소	Chen,Richard T. Kruglick,Ezekiel J. J. Bang,Christopher A. Smalley,Dennis R. Lembrikov,Pavel B.
출원인 / 주소	Microfabrica Inc.
대리인 / 주소	Smalley,Dennis R.
인용정보	피인용 횟수 : 24 인용 특허 : 50

초록 ▼

Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like.

대표청구항 ▼

We claim: 1. An elongated cantilever probe for making contact with an electronic circuit element, comprising: at least one elongated base element which is bonded to a pad on a surface of a substrate via a meltable bonding material; a support element which extends from a portion of the base element such that a portion of the elongated base element is not covered by the support element; an elongated cantilever portion which extends in a substantially horizontal direction and which has a proximal end and a distal end, wherein the proximal end contacts the support element, and wherein a footprint of the at least one elongated base element underlies at least a portion of the cantilever portion but does not extend beyond the distal end of the cantilever portion; and a tip portion which is located at or near the distal end of the cantilever portion which is used to make electrical contact with a pad on the electronic circuit element. 2. The cantilever probe of claim 1 wherein the portion of the cantilever portion comprises at least 25% of the cantilever portion. 3. The cantilever probe of claim 2 wherein the at least 25% comprises at least 50%. 4. The cantilever probe of claim 2 wherein the at least 25% comprises at least 75%. 5. The cantilever probe of claim 1 wherein the cantilever portion comprising a plurality of beam elements spaced from one another along a vertical axis. 6. The cantilever probe of claim 1 wherein the cantilever portion narrows with distance from the support element along at least part of the length of the elongated cantilever portion. 7. The cantilever probe of claim 1 wherein the cantilever portion is a first cantilever portion and wherein the tip portion comprises pedestal on which a second cantilever portion extents and on which a contact portion is located, wherein the second cantilever portion has width which is narrower than a width of the first cantilever portion. 8. The cantilever probe of claim 1 wherein the elongated base element, the support element, the cantilever element, and the tip portion are formed by a plurality of deposition operations and are connected to on another upon formation and thereafter the bonding of the base element to the substrate via the bonding material occurs. 9. The cantilever probe of claim 1 wherein the elongated base element contacts is bonded to the substrate via at least two separated regions of bonding material.

이 특허에 인용된 특허 (50) 인용/피인용 타임라인 분석

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Liang, Sheng-Hui; Lou, Chine-Gie, Automatically adjustable wafer probe card.
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Chen,Richard T.; Kruglick,Ezekiel J. J.; Bang,Christopher A.; Smalley,Dennis R.; Lembrikov,Pavel B., Cantilever microprobes for contacting electronic components and methods for making such probes.
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Chang Sung Chul ; Khandros Igor Y. ; Smith William D., Chip-scale carrier for semiconductor devices including mounted spring contacts.
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Thomas H. Di Stefano, Compliant probe apparatus.
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Khandros Igor Y. ; Eldridge Benjamin N. ; Mathieu Gaetan L. ; Dozier Thomas H. ; Smith William D., Contact carriers (tiles) for populating larger substrates with spring contacts.
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Zhou, Yu; Yu, David; Aldaz, Robert Edward; Khoury, Theodore A., Contact structure and production method thereof and probe contact assembly using same.
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Junichi Hagihara JP; Shinji Iino JP, Contactor and production method for contractor.
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Eldridge Benjamin N. ; Khandros Igor Y. ; Mathieu Gaetan L. ; Pedersen David V., Electronic components with terminals and spring contact elements extending from areas which are remote from the terminals.
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Khandros Igor Y. ; Eldridge Benjamin N. ; Mathieu Gaetan L., Fabricating interconnects and tips using sacrificial substrates.
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Miller Charles A., Filter structures for integrated circuit interfaces.
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Khandros Igor Y. ; Mathieu Gaetan L., Flexible contact structure with an electrically conductive shell.
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Guckel Henry (Madison WI), Formation of microstructures by multiple level deep X-ray lithography with sacrificial metal layers.
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Miller Charles A., High bandwidth passive integrated circuit tester probe card assembly.
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Beaman Brian Samuel ; Fogel Keith Edward ; Lauro Paul Alfred ; Norcott Maurice Heathcote ; Shih Da-Yaun, High density cantilevered probe for electronic devices.
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Khandros, Igor Y; Pedersen, David V.; Whitten, Ralph G., Large contactor with multiple, aligned contactor units.
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Cohen Adam L., Method for electrochemical fabrication.
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Ondricek, Douglas S.; Pedersen, David V., Method for mounting an electronic component.
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Miller, Charles A.; Long, John M., Method of designing, fabricating, testing and interconnecting an IC to external circuit nodes.
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Benjamin N. Eldridge ; Gary W. Grube ; Igor Y. Khandros ; Gaetan L. Mathieu, Method of fabricating an interconnection element.
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Mathieu Gaetan L. ; Eldridge Benjamin N. ; Grube Gary W., Method of making and using lithographic contact springs.
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Eldridge Benjamin N. ; Khandros Igor Y. ; Mathieu Gaetan L. ; Pedersen David V., Method of making microelectronic spring contact elements.
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Grube, Gary W.; Khandros, Igor Y.; Eldridge, Benjamin N.; Mathieu, Gaetan L., Method of manufacturing a probe card.
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Khandros Igor Y. (Peekskil NY), Method of manufacturing electrical contacts, using a sacrificial member.
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Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Method of mounting resilient contact structures to semiconductor devices.
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Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Method of planarizing tips of probe elements of a probe card assembly.
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Gaetan L. Mathieu ; Benjamin N. Eldridge ; Gary W. Grube, Methods for making spring interconnect structures.
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Grube, Gary W.; Mathieu, Gaetan L.; Madsen, Alec, Microelectronic contact structure.
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Eldridge, Benjamin N.; Grube, Gary W.; Khandros, Igor Y.; Mathieu, Gaetan L., Microelectronic contact structures, and methods of making same.
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Benjamin N. Eldridge ; Gary W. Grube ; Igor Y. Khandros ; Gaetan L. Mathieu, Microelectronic spring contact element and electronic component having a plurality of spring contact elements.
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Grube, Gary W., Microelectronic spring with additional protruding member.
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Mathieu, Gaetan L.; Eldridge, Benjamin N.; Grube, Gary W., Planarizer for a semiconductor contactor.
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Mori, Chikaomi; Satou, Katsuhiko, Probe card and contactor of the same.
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Khandros, Jr., Igor Y.; Sporck, Jr., A. Nicholas; Eldridge, Jr., Benjamin N., Probe card assembly.
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Benjamin N. Eldridge ; Gary W. Grube ; Gaetan L. Mathieu, Probe card for probing wafers with raised contact elements.
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Eslamy, Mohammad; Pedersen, David V; Cobb, Harry D., Segmented contactor.
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Di Stefano, Thomas H., Single-sided compliant probe apparatus.
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Dozier ; II Thomas H. ; Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Sockets for electronic components and methods of connecting to electronic components.
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Dozier ; II Thomas H. ; Khandros Igor Y., Solder preforms.
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Benjamin N. Eldridge ; Igor Y. Khandros ; David V. Pedersen ; Ralph G. Whitten, Special contact points for accessing internal circuitry of an integrated circuit.
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Mathieu, Gaetan L.; Eldridge, Benjamin N.; Grube, Gary W.; Larder, Richard A., Spring interconnect structures.
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Tokumo, Yasushi; Maekawa, Shigeki; Kashiba, Yoshihiro; Takada, Shigeru, Test socket, method of manufacturing the test socket, test method using the test socket, and member to be tested.
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Mori Yoichi,JPX ; Aoki Yoshihiro,JPX, Testing IC socket.
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Khandros Igor Y. ; Pedersen David V., Wafer-level burn-in and test.
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[미국특허] Cantilever microprobes for contacting electronic components and methods for making such probes 원문보기