초록 ▼

In a first aspect, a first method of drying a substrate is provided. The first method includes the steps of (1) lifting a substrate through an air/fluid interface at a first rate; (2) directing a drying vapor at the air/fluid interface during lifting of the substrate; and (3) while a portion of the

In a first aspect, a first method of drying a substrate is provided. The first method includes the steps of (1) lifting a substrate through an air/fluid interface at a first rate; (2) directing a drying vapor at the air/fluid interface during lifting of the substrate; and (3) while a portion of the substrate remains in the air/fluid interface, reducing a rate at which a remainder of the substrate is lifted through the air/fluid interface to a second rate. The drying vapor may form an angle of about 23° with the air/fluid interface and/or the second rate may be about 2.5 mm/sec.

대표청구항 ▼

The invention claimed is: 1. A method of drying a substrate comprising: lifting a substrate through an air/fluid interface at a first rate; directing a drying vapor at the air/fluid interface during lifting of the substrate; and while a portion of the substrate remains in the air/fluid interface, r

The invention claimed is: 1. A method of drying a substrate comprising: lifting a substrate through an air/fluid interface at a first rate; directing a drying vapor at the air/fluid interface during lifting of the substrate; and while a portion of the substrate remains in the air/fluid interface, reducing a rate at which a remainder of the substrate is lifted through the air/fluid interface to a second rate; wherein at least one of: the drying vapor forms an angle of about 23° with the air/fluid interface; and the second rate is about 2.5 mm/sec. 2. The method of claim 1 wherein the first rate is about 10 mm/sec and the second rate is about 2.5 mm/sec. 3. The method of claim 1 wherein the first rate is achieved by applying an acceleration to the substrate. 4. The method of claim 3 wherein the acceleration is about 293 mm/sec2. 5. The method of claim 1 wherein the second rate is achieved by applying a deceleration to the substrate. 6. The method of claim 5 wherein the deceleration is about 293 mm/sec2. 7. The method of claim 1 further comprising: after the substrate is completely lifted through the air/fluid interface, increasing a rate at which the substrate is lifted above the air/fluid interface. 8. The method of claim 7 wherein the increased rate at which the substrate is lifted above the air/fluid interface is greater than about 10 mm/sec. 9. The method of claim 8 wherein the increased rate at which the substrate is lifted above the air/fluid interface is about 70-90 mm/sec. 10. The method of claim 7 wherein the increased rate is achieved by applying an acceleration to the substrate. 11. The method of claim 10 wherein the acceleration is about 733 mm/sec2. 12. The method of claim 1 further comprising delivering both isopropyl alcohol (IPA) and nitrogen to a vaporizer using a liquid mass flow controller. 13. The method of claim 1 further comprising delivering an isopropyl alcohol (IPA) concentration of about 1.5% to a vaporizer using a liquid mass flow controller.