IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
UP-0556535
(2005-03-15)
|
등록번호 |
US-7517724
(2009-07-01)
|
우선권정보 |
JP-2004-072528(2004-03-15) |
국제출원번호 |
PCT/JP05/004513
(2005-03-15)
|
§371/§102 date |
20051114
(20051114)
|
국제공개번호 |
WO05/088700
(2005-09-22)
|
발명자
/ 주소 |
- Hatakeyama, Keiichi
- Uruno, Michio
- Matsuzaki, Takayuki
- Morishima, Yasumasa
- Kita, Kenji
- Ishiwata, Shinichi
|
출원인 / 주소 |
- Hitachi Chemical Company, Ltd.
- Furukawa Electric Co., Ltd.
|
대리인 / 주소 |
Antonelli, Terry, Stout & Kraus, LLP.
|
인용정보 |
피인용 횟수 :
11 인용 특허 :
2 |
초록
▼
The present invention provides a dicing/die bonding sheet which can be used as a dicing tape during dicing, enables ready separation of the semiconductor element and the adhesive layer from the pressure-sensitive adhesive layer during pickup, and in which the adhesive layer has satisfactory adhesive
The present invention provides a dicing/die bonding sheet which can be used as a dicing tape during dicing, enables ready separation of the semiconductor element and the adhesive layer from the pressure-sensitive adhesive layer during pickup, and in which the adhesive layer has satisfactory adhesiveness as a die bonding material. A dicing/die bonding sheet in which the pressure-sensitive adhesive layer comprises a compound (A), containing intramolecular, radiation curable carbon-carbon double bonds with an iodine value of 0.5 to 20, and at least one compound (B) selected from a group consisting of polyisocyanates, melamine-formaldehyde resins, and epoxy resins, and the adhesive layer comprises an epoxy resin (a), a phenolic resin (b) with a hydroxyl equivalent of at least 150 g/eq., an epoxy group-containing acrylic copolymer (c), comprising from 0.5 to 6% by weight of glycidyl acrylate or glycidyl methacrylate, and with a weight average molecular weight of at least 100,000, a filler (d), and a curing accelerator (e).
대표청구항
▼
The invention claimed is: 1. A dicing/die bonding sheet comprising a pressure-sensitive adhesive layer and an adhesive layer formed, in that order, on a base film, wherein said pressure-sensitive adhesive layer comprises a compound (A), containing at least one intramolecular, radiation curable carb
The invention claimed is: 1. A dicing/die bonding sheet comprising a pressure-sensitive adhesive layer and an adhesive layer formed, in that order, on a base film, wherein said pressure-sensitive adhesive layer comprises a compound (A), containing at least one intramolecular, radiation curable carbon-carbon double bond with an iodine value of 0.5 to 20, and at least one compound (B) selected from a group consisting of polyisocyanates, melamine-formaldehyde resins, and epoxy resins, and said adhesive layer comprises an epoxy resin (a), a phenolic resin (b) with a hydroxyl equivalent of at least 150 g/eq., an epoxy group-containing acrylic copolymer (c), comprising from 0.5 to 6% by weight of glycidyl acrylate or glycidyl methacrylate, and with a weight average molecular weight of at least 100,000, a filler (d), and a curing accelerator (e). 2. The dicing/die bonding sheet according to claim 1, wherein a glass transition temperature of said compound (A) is within a range from-70° C. to 0° C. 3. The dicing/die bonding sheet according to claim 1, wherein a hydroxyl value of said compound (A) is within a range from 5 to 100. 4. The dicing/die bonding sheet according to claim 1, wherein an acid value of said compound (A) is within a range from 0.5 to 30. 5. The dicing/die bonding sheet according to claim 1, wherein a hydroxyl value of said compound (A) is within a range from 5 to 100, and an acid value is within a range from 0.5 to 30. 6. The dicing/die bonding sheet according to claim 1, wherein when a combined weight of said epoxy resin (a) and said phenolic resin (b) is termed X, and a weight of said epoxy group-containing acrylic copolymer (c) is termed Y, then a ratio X/Y is within a range from 0.24 to 1. 7. The dicing/die bonding sheet according to claim 1, wherein said phenolic resin (b) is represented by a general formula (l): (wherein, groups R1are either identical or different, and each represents a hydrogen atom, a straight chain or branched alkyl group of 1to 10 carbon atoms, a cyclic alkyl group, an aralkyl group, an alkenyl group, a hydroxyl group, an aryl group, or a halogen atom, n represents an integer from 1 to 3, and m represents an integer from 0 to 50). 8. The dicing/die bonding sheet according to claim 1, wherein an average particle diameter of said filler (d) is within a range from 0.005 μm to 0.1 μm. 9. The dicing/die bonding sheet according to claim 1, wherein said filler (d) is a silica filler. 10. The dicing/die bonding sheet according to claim 1, wherein said curing accelerator (e) is an imidazole. 11. The dicing/die bonding sheet according to claim 1, wherein said epoxy resin (a) has an epoxy equivalent of 100 to 2,000 g/eq. 12. The dicing/die bonding sheet according to claim 1, wherein said hydroxyl equivalent of the phenolic resin (b) is 150 to 400 g/eq. 13. The dicing/die bonding sheet according to claim 1, wherein said hydroxyl equivalent of the phenolic resin (b) is 180 to 300 g/eq. 14. The dicing/die bonding sheet according to claim 1, wherein said hydroxyl equivalent of the phenolic resin (b) is 180 to 250 g/eq. 15. The dicing/die bonding sheet according to claim 1, wherein after curing, components of said adhesive layer separate to form an islands-in-sea structure.
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