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An electrical assembly, comprising a heat producing semiconductor device supported on a first major surface of a direct bond metal substrate that has a set of heat sink protrusions supported by its second major surface. In one preferred embodiment the heat sink protrusions are made of the same metal

An electrical assembly, comprising a heat producing semiconductor device supported on a first major surface of a direct bond metal substrate that has a set of heat sink protrusions supported by its second major surface. In one preferred embodiment the heat sink protrusions are made of the same metal as is used in the direct bond copper.

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The invention claimed is: 1. An electrical assembly, comprising: (a) a heat producing semiconductor device; (b) a direct bond metal substrate having a ceramic core and first and second metal coated major surfaces and supporting said heat producing semiconductor device on said first major surface; a

The invention claimed is: 1. An electrical assembly, comprising: (a) a heat producing semiconductor device; (b) a direct bond metal substrate having a ceramic core and first and second metal coated major surfaces and supporting said heat producing semiconductor device on said first major surface; and (c) a set of protrusions each supported directly by said second major surface each being made of thermally conductive material so as to act as a heat sink. 2. The electrical device of claim 1 wherein said protrusions are made of metal. 3. The electrical device of claim 2 wherein said protrusion are made of metal of like type to said metal of said direct bond metal layer of said second major surface. 4. The electrical device of claim 1 wherein said direct bond metal is copper. 5. The electrical device of claim 1 wherein each said protrusion is attached to said direct bond metal over an area of less than 0.1 cm2. 6. The electrical device of claim 1 wherein each said protrusion is attached to said direct bond metal over an area of less than 0.01 cm2. 7. The electrical device of claim 1 wherein each said protrusion is attached to said direct bond metal over an area of less than 0.001 cm2. 8. The electrical device of claim 1 wherein each said protrusion is attached to said direct bond metal over an area of less than 0.0001 cm2. 9. The electrical device of claim 1 wherein each said protrusion is attached to said direct bond metal over an area of less than 0.00001 cm2.