IPC분류정보
| 국가/구분 |
United States(US) Patent
등록
|
| 국제특허분류(IPC7판) |
|
| 출원번호 |
UP-0551621
(2006-10-20)
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| 등록번호 |
US-7524194
(2009-07-01)
|
|
발명자
/ 주소 |
- Eldridge, Benjamin N.
- Wenzel, Stuart W.
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| 출원인 / 주소 |
|
| 대리인 / 주소 |
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| 인용정보 |
피인용 횟수 :
6 인용 특허 :
64 |
초록
▼
Improved lithographic type microelectronic spring structures and methods are disclosed, for providing improved tip height over a substrate, an improved elastic range, increased strength and reliability, and increased spring rates. The improved structures are suitable for being formed from a single i
Improved lithographic type microelectronic spring structures and methods are disclosed, for providing improved tip height over a substrate, an improved elastic range, increased strength and reliability, and increased spring rates. The improved structures are suitable for being formed from a single integrated layer (or series of layers) deposited over a molded sacrificial substrate, thus avoiding multiple stepped lithographic layers and reducing manufacturing costs. In particular, lithographic structures that are contoured in the z-direction are disclosed, for achieving the foregoing improvements. For example, structures having a U-shaped cross-section, a V-shaped cross-section, and/or one or more ribs running along a length of the spring are disclosed. The present invention additionally provides a lithographic type spring contact that is corrugated to increase its effective length and elastic range and to reduce its footprint over a substrate, and springs which are contoured in plan view. The present invention further provides combination (both series and parallel) electrical contacts tips for lithographic type microelectronic spring structures. The microelectronic spring structures according to the present invention are particularly useful for making very fine pitch arrays of electrical connectors for use with integrated circuits and other substrate-mounted electronic devices, because their performance characteristics are enhanced, while at the same time, they may be manufactured at greatly reduced costs compared to other lithographic type microelectronic spring structures.
대표청구항
▼
What is claimed is: 1. A method of forming a contact structure on a terminal of an electronic component, said method comprising: forming a patterned sacrificial material on said electronic component, said sacrificial material patterned to include an opening over said terminal defining a base of sai
What is claimed is: 1. A method of forming a contact structure on a terminal of an electronic component, said method comprising: forming a patterned sacrificial material on said electronic component, said sacrificial material patterned to include an opening over said terminal defining a base of said contact structure and a molded surface defining a beam of said contact structure, said molded surface contoured to define a cross-sectional-width contour for said beam to increase an area moment of inertia of said beam relative to a beam having an equivalent mass per unit length but lacking said contour; forming said contact structure in said opening and on said molded surface; and removing said sacrificial material from said electronic component, wherein said cross-sectional-width contour of said beam perpendicular to a length of said beam is not rectangular, and wherein the patterned sacrificial material consists of a single layer of material, and said forming said contact structure in said opening comprises forming said contact structure in a single opening in said single layer of material. 2. The method of claim 1, wherein said step of forming said contact structure comprises: depositing a seed material; and depositing a contact structure material on said seed material. 3. The method of claim 2, wherein said step of depositing a contact structure material comprises electroplating said contact structure material on said seed material. 4. The method of claim 1, wherein said step of forming said contact structure comprises: depositing a seed material over said sacrificial material; forming a patterned masking material over said seed material, said masking material patterned to have an opening corresponding to said opening in said sacrificial material and said molded surface of said sacrificial material; and depositing a contact structure material on said seed material exposed through said opening in said masking material. 5. The method of claim 4, wherein said step of depositing a contact structure material comprises electroplating said contact structure material on said seed material. 6. The method of claim 1, wherein said electronic component is a semiconductor die. 7. The method of claim 6, wherein said semiconductor die is one of a plurality of semiconductor dice composing an unsingulated semiconductor wafer. 8. The method of claim 1 further comprising forming a plurality of said contact structures on a plurality of terminals of said electronic component, wherein said step of forming a patterned sacrificial material on said electronic component comprises: patterning said sacrificial material to include a plurality of openings over said plurality of terminals, each opening defining a base of one of said plurality of said contact structures, and forming a plurality of molded surfaces, each defining a beam of one of said contact structures, each said molded surface contoured to define a cross-sectional width for said beam to increase an area moment of inertia of said beam; said method further comprising forming said plurality of contact structures each in one of said openings and on one of said molded surfaces. 9. The method of claim 1, wherein said molded surface is further contoured to define lengthwise contour for said beam. 10. The method of claim 9, wherein said lengthwise contour comprises a compound curve. 11. The method of claim 1, wherein said cross-sectional-width contour is generally "V" shaped. 12. The method of claim 1, wherein said cross-sectional-width contour is generally "U" shaped. 13. The method of claim 1, wherein said beam, viewed in a direction normal to a surface of said electronic component, is generally triangular shaped. 14. The method of claim 1, wherein said beam, viewed in a direction normal to a surface of said electronic component, comprises a serpentine shape. 15. The method of claim 1, wherein said beam, viewed in a direction normal to a surface of said electronic component, comprises a "C" shape. 16. The method of claim 1, wherein said beam, viewed in a direction normal to a surface of said electronic component, comprises a "U" shape. 17. The method of claim 1, wherein said beam, viewed in a direction normal to a surface of said electronic component, comprises an "S" shape. 18. The method of claim 1 further comprising forming a plurality of contact structures, wherein each contact structure is formed in corresponding different single opening in said single layer of material. 19. A method of forming a contact structure on a terminal of an electronic component, said method comprising: forming a patterned sacrificial material on said electronic component, said sacrificial material patterned to include an opening over said terminal defining a base of said contact structure and a molded surface defining a beam of said contact structure, said molded surface contoured to define a cross-sectional-width contour for said beam to increase an area moment of inertia of said beam relative to a beam having an equivalent mass per unit length but lacking said contour; forming said contact structure in said opening and on said molded surface; and removing said sacrificial material from said electronic component, wherein said cross-sectional-width contour of said beam perpendicular to a length of said beam is not rectangular, wherein said step of forming a patterned sacrificial material comprises: depositing a layer of sacrificial material on said electronic component; and stamping said sacrificial material to form said opening and said molded surface. 20. A method of forming a contact structure on a terminal of an electronic component, said method comprising: forming a patterned sacrificial material on said electronic component, said sacrificial material patterned to include an opening over said terminal defining a base of said contact structure and a molded surface defining a beam of said contact structure, said molded surface contoured to define a cross-sectional-width contour for said beam to increase an area moment of inertia of said beam relative to a beam having an equivalent mass per unit length but lacking said contour; forming said contact structure in said opening and on said molded surface; and removing said sacrificial material from said electronic component, wherein said molded surface is further contoured to define lengthwise contour for said beam, wherein said lengthwise contour comprises corrugations. 21. A method of forming a contact structure on a terminal of an electronic component, said method comprising: forming a patterned sacrificial material on said electronic component, said sacrificial material patterned to include an opening over said terminal defining a base of said contact structure and a molded surface defining a beam of said contact structure, said molded surface contoured to define a cross-sectional-width contour for said beam to increase an area moment of inertia of said beam relative to a beam having an equivalent mass per unit length but lacking said contour; forming said contact structure in said opening and on said molded surface; and removing said sacrificial material from said electronic component, wherein said cross-sectional-width contour comprises a rib. 22. The method of claim 21, wherein said cross-sectional-width contour comprises a plurality of ribs.
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