[미국특허]
Process and device for cooling a gas by direct heat exchange with a cooling liquid
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
F25J-003/00
F28C-001/00
F28D-003/00
F28D-005/00
A61M-016/10
F02M-015/00
출원번호
UP-0350882
(2006-02-10)
등록번호
US-7536873
(2009-07-01)
우선권정보
EP-05002984(2005-02-11)
발명자
/ 주소
Nohlen, Thomas
출원인 / 주소
Linde Aktiengesellschaft
대리인 / 주소
Millen, White, Zelano, Branigan, P.C.
인용정보
피인용 횟수 :
75인용 특허 :
4
초록▼
For cooling a gas by direct heat exchange with a cooling liquid, the gas (1) to be cooled is introduced into the lower region of a direct contact cooler (2). A first stream of cooling liquid (8) is fed into the direct contact cooler (2) above the point of introduction of the gas (1). Cooled gas (5)
For cooling a gas by direct heat exchange with a cooling liquid, the gas (1) to be cooled is introduced into the lower region of a direct contact cooler (2). A first stream of cooling liquid (8) is fed into the direct contact cooler (2) above the point of introduction of the gas (1). Cooled gas (5) is removed above the point of introduction of the gas (1) from the direct contact cooler (2). A liquid backflow (10) is drawn off from the lower region of the direct contact cooler (2). At least at times, a second stream of cooling liquid (13) with a temperature that is lower than that of the backflow (10) is fed into the liquid backflow (10) and combined with the latter to form a return flow (11).
대표청구항▼
The invention claim is: 1. A process for cooling a gas by direct heat exchange with a cooling liquid, said process comprising: introducing gas (1) into the lower region of a direct contact cooler (2), introducing a first stream of cooling liquid (8) into the direct contact cooler (2) at a point abo
The invention claim is: 1. A process for cooling a gas by direct heat exchange with a cooling liquid, said process comprising: introducing gas (1) into the lower region of a direct contact cooler (2), introducing a first stream of cooling liquid (8) into the direct contact cooler (2) at a point above the point of introduction of said gas (1), removing cooled gas (5) from the direct contact cooler (2) at a point above the point of introduction of said gas (1), and drawing off a liquid backflow (10) from the lower region of the direct contact cooler (2), wherein the temperature of said liquid backflow is adjusted by introducing a second stream of cooling liquid (13), whose temperature is lower than that of said liquid backflow (10), into said liquid backflow at least for some period(s) of time, and wherein the first stream of cooling liquid (7, 8) and the second stream of cooling liquid (12, 13) are branched off from a main stream of cooling liquid (6), and the second stream of cooling liquid (12, 13) is routed past the direct contact cooler (2). 2. A process according to claim 1, wherein said liquid backflow is delivered as return flow (11) to an integrated cooling liquid system that supplies cold cooling liquid, and from which the first stream of cooling liquid is removed, and from which the second stream of cooling liquid is removed. 3. A process according to claim 1, wherein the temperature of said liquid backflow is adjusted by setting (14, 15) the amounts of the first and second streams of cooling liquid. 4. A process according to claim 1, wherein the first stream of cooling liquid (7, 8) is routed separately from the second stream of cooling liquid through one or more cooling liquid pumps (9). 5. A device for cooling a gas by direct heat exchange with a cooling liquid, said device comprising: a direct contact cooler, conduit means for introducing gas into the lower region of the direct contact cooler, conduit means for introducing a first stream of cooling liquid into the direct contact cooler above the point of introduction of the gas, conduit means for withdrawing cooled gas from the direct contact cooler above the point of introduction of the gas, conduit means for withdrawing a liquid backflow from the lower region of the direct contact cooler, means for admixing a second stream of cooling liquid, whose temperature is lower than that of the backflow, into the liquid backflow, a return line for the mixture comprising the second stream of cooling liquid and the backflow, by a control device for controlling the temperature of the mixture by setting the amounts of the first and/or second stream(s) of cooling liquid, and means for branching said conduit means for introducing a first stream of cooling liquid and a conduit means for said second stream of cooling liquid from a main stream of cooling liquid, wherein said conduit means for said second stream of cooling liquid routs said second stream past said direct contact cooler. 6. A process for gas separation comprising: compressing a feed gas, cooling the compressed feed gas by the process according to claim 1, and supplying the cooled, compressed feed gas to a separating device. 7. A process for the low-temperature separation of air, comprising: compressing a feed air, cooling the compressed feed gas by the process according to claim 1, supplying the cooled, compressed feed gas to a cleaning device, and supplying the cleaned, cooled, compressed feed gas to a distillation column system with at least one separating column. 8. A device for gas separation comprising: a feed gas compressor, whose outlet is connected to a cooling device according to claim 5, and a separating device, whose inlet is connected to the outlet of said cooling device. 9. A device for low-temperature separation of air comprising a main air compressor having an outlet connected to a cooling device according to claim 5, and an air separating system having an inlet connected to the outlet means of said cooling device by way of a cleaning device. 10. A process according to claim 2, wherein the temperature of the return flow (11) is adjusted by setting (14, 15) the amounts of the first and second streams of cooling liquid. 11. A process according to claim 2, wherein the first stream of cooling liquid (7, 8) is routed separately from the second stream of cooling liquid through one or more cooling liquid pumps (9). 12. A process according to claim 4, wherein the first stream of cooling liquid (7, 8) is routed separately from the second stream of cooling liquid though one or more cooling liquid pumps (9). 13. A process according to claim 10, wherein the first stream of cooling liquid (7, 8) is routed separately from the second stream of cooling liquid through one or more cooling liquid pumps (9). 14. A process according to claim 1, wherein said direct contact cooler contains material exchange elements and said first stream of cooling liquid (8) is introduced into said direct contact cooler (2) at a point above said material exchange elements. 15. A device according to claim 5, wherein said control device includes a first valve for regulating the introduction of said first stream of cooling liquid into said direct contact cooler, and a second valve for regulating admixing of said second stream of cooling liquid into said liquid backflow. 16. A device according to claim 15, wherein said control device further includes a third valve for regulating the withdrawal of said liquid backflow from the lower region of the direct contact cooler. 17. A process according to claim 2, wherein said direct contact cooler contains material exchange elements and said first stream of cooling liquid (8) is introduced into said direct contact cooler (2) at a point above said material exchange elements. 18. A process according to claim 3, wherein said direct contact cooler contains material exchange elements and said first stream of cooling liquid (8) is introduced into said direct contact cooler (2) at a point above said material exchange elements. 19. A process according to claim 4, wherein said direct contact cooler contains material exchange elements and said first stream of cooling liquid (8) is introduced into said direct contact cooler (2) at a point above said material exchange elements. 20. A process according to claim 10, wherein said direct contact cooler contains material exchange elements and said first stream of cooling liquid (8) is introduced into said direct contact cooler (2) at a point above said material exchange elements.
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