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An electronic equipment enclosure comprises a frame structure formed from a plurality of support posts and at least partially enclosed by a plurality of panels. The panels include at least side, top and back panels defining an enclosure having a top, a bottom and a rear thereof. The top panel includ

An electronic equipment enclosure comprises a frame structure formed from a plurality of support posts and at least partially enclosed by a plurality of panels. The panels include at least side, top and back panels defining an enclosure having a top, a bottom and a rear thereof. The top panel includes an opening there through that is rectangular in shape. The equipment enclosure further comprises an exhaust air duct extending upward from the top panel of the enclosure. The exhaust air duct is rectangular in cross-section and is disposed in surrounding relation to, and in fluid communication with, the top panel opening. The exhaust air duct is adapted to segregate hot air being exhausted from the enclosure from cool air entering the enclosure, thereby improving thermal management of the enclosure.

대표청구항 ▼

What is claimed is: 1. An electronic equipment enclosure, comprising: (a) a frame structure formed from a plurality of support posts and at least partially enclosed by a plurality of panels, the panels including at least side, top and back panels defining an enclosure having a top, a bottom and a r

What is claimed is: 1. An electronic equipment enclosure, comprising: (a) a frame structure formed from a plurality of support posts and at least partially enclosed by a plurality of panels, the panels including at least side, top and back panels defining an enclosure having a top, a bottom and a rear thereof, wherein the top panel includes an opening therethrough; and (b) an air diverter, disposed near the rear of the enclosure and angled upward from the bottom of the enclosure to redirect, toward the top of the enclosure, heated air moving rearward through the enclosure; (c) wherein the air diverter directs hot return air in the enclosure upward in the direction of a primary flow of hot return air thereby reducing eddies in the hot air return such that thermal management of the enclosure is improved; and (d) wherein the air diverter comprises a flat planar panel extending diagonally upward from the bottom of the enclosure toward the rear of the enclosure. 2. The electronic equipment enclosure of claim 1, wherein the air diverter comprises a planar panel having a series of creases or bends therein so as to create a generally scoop-shaped structure, a flange at a bottom edge of the panel for connecting the air diverter to an enclosure, and a pair of connection tabs disposed at side edges of the panel for further connecting the air diverter to the enclosure. 3. The electronic equipment enclosure of claim 1, wherein the frame structure includes a plurality of horizontal mounting rails, and wherein the air diverter includes a pair of connection tabs disposed at side edges thereof attached to the horizontal mounting rails. 4. The electronic equipment enclosure of claim 1, wherein the air diverter includes a wing element disposed along each side thereof. 5. The electronic equipment enclosure of claim 4, further including a connection tab extending perpendicularly from each wing element. 6. The electronic equipment enclosure of claim 4, wherein each wing element defines at least one inset area for accommodating cables within the enclosure. 7. The electronic equipment enclosure of claim 4, further including a protuberance, extending from each wing element, adapted to contact a horizontal mounting rail within the enclosure. 8. The electronic equipment enclosure of claim 1, wherein the air diverter comprises a bottom edge having a flange for connecting the air diverter to the bottom panel of the enclosure. 9. The electronic equipment enclosure of claim 1, wherein the air diverter comprises a "U"-shaped channel member disposed at a top edge thereof. 10. The electronic equipment enclosure of claim 1, wherein the air diverter comprises a curved structure, creating a generally scoop-shaped structure, extending gradually upward from the bottom of the enclosure toward the rear of the enclosure. 11. The electronic equipment enclosure of claim 10, wherein the curvature of the curved structure is generally uniform. 12. An electronic equipment enclosure, comprising: (a) a frame structure formed from a plurality of support posts and at least partially enclosed by a plurality of panels, the panels including at least side, top and back panels defining an enclosure having a top, a bottom and a rear thereof, wherein the top panel includes an opening therethrough; and (b) an air diverter, disposed near the rear of the enclosure and angled upward from the bottom of the enclosure to redirect, toward the top of the enclosure, heated air moving rearward through the enclosure; (c) wherein the air diverter directs hot return air in the enclosure upward in the direction of a primary flow of hot return air thereby reducing eddies in the hot air return such that thermal management of the enclosure is improved; and (d) wherein the air diverter comprises a planar panel having a series of creases or bends therein, creating a generally scoop-shaped structure, extending gradually upward from the bottom of the enclosure toward the rear of the enclosure. 13. An electronic equipment enclosure, comprising: (a) a frame structure formed from a plurality of support posts and at least partially enclosed by a plurality of panels, the panels including at least side, top and back panels defining an enclosure having a top, a bottom and a rear thereof, wherein the top panel includes an opening therethrough; and (b) a generally scoop-shaped air diverter disposed near the rear of the enclosure and angled upward to redirect, toward the top of the enclosure, heated air moving rearward through the enclosure; (c) wherein the air diverter directs hot return air in the enclosure upward in the direction of a primary flow of hot return air thereby reducing eddies in the hot air return such that thermal management of the enclosure is improved; and (d) wherein the air diverter comprises a planar panel having a radius of curvature forming an arc, a flange at a bottom edge of the panel for connecting the air diverter to an enclosure, and a pair of connection tabs disposed at side edges of the panel for further connecting the air diverter to the enclosure. 14. An electronic equipment enclosure for mounting an electronic component, comprising: (a) a frame structure formed from a plurality of support posts and at least partially enclosed by a plurality of panels, the panels including at least side, top and back panels defining an enclosure having a top, a bottom and a rear thereof, the enclosure defining a single compartment in which the electronic component is mounted, wherein the top panel includes an opening therethrough; and (b) an air diverter, disposed near the rear of the enclosure and angled upward from the bottom of the enclosure to redirect, toward the top of the enclosure, heated air moving rearward through the enclosure; (c) wherein the air diverter directs hot return air in the enclosure upward in the direction of a primary flow of hot return air thereby reducing eddies in the hot air return such that thermal management of the enclosure is improved. 15. The electronic equipment enclosure of claim 14, wherein the air diverter comprises a planar panel having a series of creases or bends therein so as to create a generally scoop-shaped structure, a flange at a bottom edge of the panel for connecting the air diverter to an enclosure, and a pair of connection tabs disposed at side edges of the panel for further connecting the air diverter to the enclosure. 16. The electronic equipment enclosure of claim 14, wherein the air diverter comprises a flat planar panel extending diagonally upward from the bottom of the enclosure toward the rear of the enclosure. 17. The electronic equipment enclosure of claim 14, wherein the frame structure includes a plurality of horizontal mounting rails, and wherein the air diverter includes a pair of connection tabs disposed at side edges thereof attached to the horizontal mounting rails. 18. The electronic equipment enclosure of claim 14, wherein the air diverter includes a wing element disposed along each side thereof. 19. The electronic equipment enclosure of claim 18, further including a connection tab extending perpendicularly from each wing element. 20. The electronic equipment enclosure of claim 18, wherein each wing element defines at least one inset area for accommodating cables within the enclosure. 21. The electronic equipment enclosure of claim 18, further including a protuberance, extending from each wing element, adapted to contact a horizontal mounting rail within the enclosure. 22. The electronic equipment enclosure of claim 14, wherein the air diverter comprises a bottom edge having a flange for connecting the air diverter to the bottom panel of the enclosure. 23. The electronic equipment enclosure of claim 14, wherein the air diverter comprises a "U"-shaped channel member disposed at a top edge thereof. 24. The electronic equipment enclosure of claim 14, wherein the air diverter comprises a curved structure, creating a generally scoop-shaped structure, extending gradually upward from the bottom of the enclosure toward the rear of the enclosure. 25. The electronic equipment enclosure of claim 24, wherein the curvature of the curved structure is generally uniform. 26. The electronic equipment enclosure of claim 14, wherein the air diverter comprises a planar panel having a series of creases or bends therein, creating a generally scoop-shaped structure, extending gradually upward from the bottom of the enclosure toward the rear of the enclosure. 27. The electronic equipment enclosure of claim 14, wherein the air diverter comprises a planar panel having a radius of curvature forming an arc, a flange at a bottom edge of the panel for connecting the air diverter to an enclosure, and a pair of connection tabs disposed at side edges of the panel for further connecting the air diverter to the enclosure. 28. An electronic equipment enclosure for mounting an electronic component, comprising: (a) a frame structure formed from a plurality of support posts and at least partially enclosed by a plurality of panels, the panels including at least side, top and back panels defining an enclosure having a top, a bottom and a rear thereof, the enclosure defining a single compartment in which the electronic component is mounted, wherein the top panel includes an opening therethrough, and wherein the frame structure includes a plurality of horizontal mounting rails; (b) an air diverter, disposed near the rear of the enclosure and angled upward to redirect, toward the top of the enclosure, heated air moving rearward through the enclosure, wherein the air diverter includes a pair of connection tabs disposed at side edges thereof attached to the horizontal mounting rails; (c) wherein the air diverter directs hot return air in the enclosure upward in the direction of a primary flow of hot return air thereby reducing eddies in the hot air return such that thermal management of the enclosure is improved. 29. An electronic equipment enclosure for mounting an electronic component, comprising: (a) a frame structure formed from a plurality of support posts and at least partially enclosed by a plurality of panels, the panels including at least side, top and back panels defining an enclosure having a top, a bottom and a rear thereof, the enclosure defining a single compartment in which the electronic component is mounted, wherein the top panel includes an opening therethrough; (b) an air diverter, disposed near the rear of the enclosure and angled upward to redirect, toward the top of the enclosure, heated air moving rearward through the enclosure, wherein the air diverter includes a wing element disposed along each side thereof; (c) wherein the air diverter directs hot return air in the enclosure upward in the direction of a primary flow of hot return air thereby reducing eddies in the hot air return such that thermal management of the enclosure is improved.