초록 ▼

A conventional inspection probe has posed such problems that, when a pitch is as fine as up to 40 μm, a positional accuracy is difficult to ensure depending on constituting materials and a production method, pin breaking occurs when fine-diameter pins contact, a good contact cannot be obtained

A conventional inspection probe has posed such problems that, when a pitch is as fine as up to 40 μm, a positional accuracy is difficult to ensure depending on constituting materials and a production method, pin breaking occurs when fine-diameter pins contact, a good contact cannot be obtained due to an insufficient contact, an durability is insufficient. An inspection probe having a probe structure comprising an elastic probe pin, a wiring layer carrying substrate, a backup plate to install a substrate thereon, an inspection substrate and a flexible substrate, characterized in that a good-contact material layer according to the electrode material of a semiconductor device is formed at the tip end of a probe pin and a wiring layer has a structure formed of a low-resistance metal layer, with the good-contact material layer being separated from the low-resistance metal layer. Such a structure can provide very high contact reliability and mechanical durability at a pitch as very fine as up to 40 μm.

대표청구항 ▼

The invention claimed is: 1. An inspection probe for inspecting electrical properties of a semiconductor device, comprising: a base member; wiring layers mounted on the base member; probe pins having tips, electrically connected to the wiring layers, protruding from the base member; first metal lay

The invention claimed is: 1. An inspection probe for inspecting electrical properties of a semiconductor device, comprising: a base member; wiring layers mounted on the base member; probe pins having tips, electrically connected to the wiring layers, protruding from the base member; first metal layers provided to the tips of the probe pins; second metal layers formed on the wiring layers, the second metal layers being made of a material different from that of the probe pins, the second metal layers physically separated from the first metal layers by the probe pins; a flexible, electrically connectable wiring substrate placed between the base member and a inspection substrate and a backup plate mounted on the inspection substrate, for mounting the base member thereon if the electrodes of the semiconductor device are arranged at sides thereof, correspond to multiple pins, and must be connected to the inspection substrate; and a support substrate which is integrated with peripheral portions of the base member with an adhesive member placed therebetween and which is made of the same material as a material of the base member, said support substrate being mounted on the inspection substrate, wherein the backup plate has a protrusive portion at a center area thereof such that the probe pins form a predetermined angle with respect to the electrodes of the semiconductor device. 2. The inspection probe according to claim 1, wherein the backup plate and the inspection substrate each has a perforations partly. 3. The inspection probe according to claim 1, wherein the base member has warpage-reducing means for reducing the warpage thereof. 4. The inspection probe according to claim 3, wherein the warpage-reducing means include a warpage-correcting plate attached to the rear face of the base member. 5. The inspection probe according to claim 3, wherein the warpage-reducing means include notches formed at end faces of the base member. 6. The inspection probe according to claim 3, wherein the warpage-reducing means include notches formed at edges of the base member at which bending occurs. 7. The inspection probe according to claim 3, wherein the warpage-reducing means include a plurality of notches, formed in the rear face of the base member, having a depth insufficient to cause negative effects on the main surface of the base member and wires. 8. The inspection probe according to claim 7, wherein the plurality of notches extend laterally. 9. The inspection probe according to claim 7, wherein the plurality of notches extend longitudinally. 10. The inspection probe according to claim 7, wherein the plurality of notches extend laterally and longitudinally.