초록 ▼

A capacitive interposer (caposer) is disposed inside an integrated circuit package between a die and an inside surface of the package. Conductive layers within the caposer constitute a bypass capacitor. In a through-hole caposer, micro-bumps on the die pass through through-holes in the caposer and

A capacitive interposer (caposer) is disposed inside an integrated circuit package between a die and an inside surface of the package. Conductive layers within the caposer constitute a bypass capacitor. In a through-hole caposer, micro-bumps on the die pass through through-holes in the caposer and contact corresponding landing pads on the package. As they pass through the caposer, power and ground micro-bumps make contact with the plates of the bypass capacitor. In a via caposer, power and ground micro-bumps on the die are coupled to power and ground landing pads on the package as well as to the plates of the bypass capacitor by power and ground vias that extend through the caposer. In signal redistribution caposer, conductors within the caposer redistribute signals between die micro-bumps and package landing pads. In an impedance matching caposer, termination structures within the caposer provide impedance matching to a printed circuit board trace.

대표청구항 ▼

What is claimed is: 1. An assembly, comprising: an integrated circuit die having an array of micro-bumps disposed on a surface of the integrated circuit die in a first pattern; an integrated circuit package having an array of landing pads disposed on an inside surface of the integrated circuit pack

What is claimed is: 1. An assembly, comprising: an integrated circuit die having an array of micro-bumps disposed on a surface of the integrated circuit die in a first pattern; an integrated circuit package having an array of landing pads disposed on an inside surface of the integrated circuit package in a second pattern and an array of solder balls disposed on an outside surface of the integrated circuit package, wherein the first pattern and the second pattern are substantially identical patterns; and an interposing structure disposed inside the integrated circuit package between the integrated circuit die and the inside surface of the integrated circuit package, the interposer electrically coupling a first micro-bump in a first position in the array of micro-bumps to a first landing pad located opposite to the first position and to a second landing pad in the array of landing pads. 2. The assembly of claim 1, wherein a line extending through the first micro-bump in a direction orthogonal to the surface of the integrated circuit does not extend through the second landing pad of the integrated circuit package. 3. The assembly of claim 2, wherein the surface of the integrated circuit die is a major surface of the integrated circuit die, and wherein the interposing structure has a major surface, and wherein the major surface of the integrated circuit die and the major surface of the interposing structure have roughly identical surface areas. 4. The assembly of claim 3, wherein the interposing structure includes no transistor and no PN junction. 5. The assembly of claim 4, wherein the interposing structure comprises an array of micro-bumps, wherein the array of micro-bumps of the interposing structure has a pattern that is substantially identical to the second pattern of the landing pads on the inside surface of the integrated circuit package. 6. The assembly of claim 5, wherein the interposing structure includes a layer comprising epoxy and fiberglass. 7. The assembly of claim 5, wherein the interposing structure includes a bypass capacitor. 8. The assembly of claim 5, wherein the first micro-bump is coupled to the first landing pad at least in part by a conductor disposed in the interposing structure, wherein the conductor disposed in the interposing structure extends in a direction parallel to the surface of the integrated circuit. 9. An assembly, comprising: an integrated circuit die having an array of micro-bumps disposed on a surface of the integrated circuit die in a first pattern; an integrated circuit package having an array of landing pads disposed on an inside surface of the integrated circuit package in a second pattern and an array of solder balls disposed on an outside surface of the integrated circuit package, wherein the first pattern and the second pattern are substantially identical patterns; and means for electrically coupling a first micro-bump in a first position in the array of micro-bumps to a first landing pad disposed opposite the first position and to a second landing pad located in a different position in the array of landing pads, the means being disposed inside the integrated circuit package between the integrated circuit die and the inside surface of the integrated circuit package. 10. The assembly of claim 9, wherein the means is also for providing a bypass current to the integrated circuit die. 11. The assembly of claim 9, wherein the surface of the integrated circuit die is a major surface of the integrated circuit die, and wherein the means has a major surface, and wherein the major surface of the integrated circuit die and the major surface of the means have roughly identical surface areas. 12. The assembly of claim 9, wherein the means has a planar form and is less than 500 microns thick. 13. The assembly of claim 9, wherein the integrated circuit die is an application specific integrated circuit (ASIC).