초록 ▼

An optical metrology method is disclosed for evaluating the uniformity of characteristics within a semiconductor region having repeating features such a memory die. The method includes obtaining measurements with a probe laser beam having a spot size on the order of micron. These measurements are co

An optical metrology method is disclosed for evaluating the uniformity of characteristics within a semiconductor region having repeating features such a memory die. The method includes obtaining measurements with a probe laser beam having a spot size on the order of micron. These measurements are compared to calibration information obtained from calibration measurements. The calibration information is derived by measuring calibration samples with the probe laser beam and at least one other technology having added information content. In the preferred embodiment, the other technology includes at least one of spectroscopic reflectometry or spectroscopic ellipsometry.

대표청구항 ▼

We claim: 1. A method of evaluating the characteristics of a semiconductor wafer comprising the steps of: measuring a set of calibration samples with first and second different metrology technologies, said first technology including a first probe beam that is focused onto the wafer with a first spo

We claim: 1. A method of evaluating the characteristics of a semiconductor wafer comprising the steps of: measuring a set of calibration samples with first and second different metrology technologies, said first technology including a first probe beam that is focused onto the wafer with a first spot size and wherein the reflected first probe beam is monitored to generate first output signals, said second technology including a second probe beam that is focused onto the wafer with a second spot size and wherein the reflected second probe beam is monitored to generate second output signals and wherein the first spot size is larger than the second spot size; analyzing the first output signals to determine the characteristics of the calibration samples using a model based analysis and correlating the results with the second output signals; measuring a test sample with the second metrology technology and determining the characteristics of the test samples based on the correlation; and storing the determined characteristics. 2. A method as recited in claim 1, wherein the second spot size is on the order of one micron in diameter. 3. A method as recited in claim 1, wherein the second probe beam is generated by a laser. 4. A method as recited in claim 1, wherein the second output signals contain information corresponding to multiple angles of incidence. 5. A method as recited in claim 1, wherein during the step of measuring the test sample, the second probe beam is scanned over a region so that multiple measurements can be obtained in order to evaluate the uniformity of the characteristics of the region. 6. A method as recited in claim 1, wherein first probe beam is a broadband probe beam and the first output signals include information at multiple wavelengths. 7. A method as recited in claim 1, wherein during the step of measuring the calibration samples, the second probe beam is scanned over the region measured by first probe beam and the second output signals are averaged. 8. A method as recited in claim 1, wherein the steps of (a) correlating the results of the characteristics derived from the first output signals with the second output signals and (b) determining the characteristics of the test sample based on the correlation are performed using a neural network. 9. A method as recited in claim 1, wherein said calibration samples are measured with a third metrology technology different from the first and second metrology technologies and wherein the measurements from both the first and third metrology technologies are utilized in a model based process to characterize the calibration samples which are then correlated to the second output signals. 10. A method as recited in claim 9, wherein said first metrology technology is normal incidence broadband spectroscopy and the third metrology technology is off-axis spectroscopic ellipsometry. 11. A method of evaluating the uniformity of the characteristics within a region of a semiconductor wafer using a metrology system including first and second technologies, said first technology including a broadband light source generating a first probe beam which is focused onto the sample with a first spot size and wherein the reflected first probe beam is monitored to generate first output signals and wherein said second technology includes a laser light source generating a second probe beam which is focused onto the sample with a second spot size and wherein the reflected second probe beam is monitored to generate second output signals and wherein the first spot size is larger than the second spot size, said method comprising the steps of: measuring a set of calibration samples with the first and second technologies, wherein the second probe beam is scanned to generate multiple measurements within the region measured by the first technology to obtain an average measurement for the second technology; determining the characteristics of the calibration samples based on the first output signals using a model based analysis and correlating the results with the average measurements from the second technology; measuring a region of a test sample with the second metrology technology at multiple locations within the region and determining the uniformity of the characteristics within the region based on the correlation; and storing the results of the determination. 12. A method as recited in claim 11, wherein the second spot size is on the order of one micron in diameter. 13. A method as recited in claim 11, wherein the second output signals contain information corresponding to multiple angles of incidence. 14. A method as recited in claim 11, wherein the steps of (a) correlating the results of the characteristics derived from the first output signals with the second output signals and (b) determining the uniformity of the characteristics of the test sample based on the correlation are performed using a neural network. 15. A method as recited in claim 11, wherein said calibration samples are measured with a third technology different from the first and second technologies and wherein the measurements from both the first and third metrology technologies are utilized in a model based process to characterize the calibration samples which are then correlated with the second output signals. 16. A method as recited in claim 15, wherein said first metrology technology is normal incidence broadband spectroscopy and the third metrology technology is off-axis spectroscopic ellipsometry. 17. A method of determining the uniformity of a process within a region on a semiconductor wafer comprising the steps of: generating correlation information by measuring calibration samples with a spectroscopic metrology technology and a laser metrology technology and evaluating the parameters of the calibration samples based on the spectroscopic measurements and then creating calibration information by correlating the laser measurements with the parameters derived with the spectroscopic measurements; and obtaining multiple measurements at different locations within a region of a test wafer with the laser metrology technology and generating a map of process variations by referencing the correlation information. 18. A method as recited in claim 17, wherein the measurement spot associated with the laser metrology technology is about one micron in diameter. 19. A method as recited in claim 17, wherein during the step of measuring the calibration samples, a laser generated probe beam from the laser metrology technology is scanned over the region measured by the spectroscopic metrology technology and the results are averaged. 20. A method as recited in claim 17, wherein the step of generating calibration information is performed using a neural network. 21. A method as recited in claim 17, wherein said the step of generating correlation information is performed by measuring the calibration samples with two different spectroscopic metrology technologies as well as the laser metrology technology and wherein the measurements from the two different spectroscopic metrology technologies are utilized to evaluate the parameters of the calibration samples which are then correlated with the measurements from the laser metrology technology. 22. A method as recited in claim 21, wherein the two different spectroscopic metrology technologies are normal incidence broadband spectroscopy and off-axis spectroscopic ellipsometry.