IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
UP-0125225
(2005-05-10)
|
등록번호 |
US-7567599
(2009-08-05)
|
우선권정보 |
KR-10-2005-0000247(2005-01-03) |
발명자
/ 주소 |
|
출원인 / 주소 |
- Samsung Electro Mechanics Co., Ltd.
|
대리인 / 주소 |
Lowe Hauptman Ham & Berner
|
인용정보 |
피인용 횟수 :
0 인용 특허 :
7 |
초록
▼
A semiconductor laser diode device comprises a semiconductor laser diode, a primary lead having a sub-mount for mounting the semiconductor laser diode, at least one secondary lead electrically insulated from the primary lead, a first resin member for integrally fixing the primary lead and the second
A semiconductor laser diode device comprises a semiconductor laser diode, a primary lead having a sub-mount for mounting the semiconductor laser diode, at least one secondary lead electrically insulated from the primary lead, a first resin member for integrally fixing the primary lead and the secondary lead while insulating the primary lead from the secondary lead, and a second resin member having an emitting opening through which laser beams generated by the semiconductor laser diode are emitted to the outside, and surrounding the primary lead and the first resin member so as to dissipate heat transferred to the primary lead and the first resin member to the outside.
대표청구항
▼
What is claimed is: 1. A semiconductor laser diode device, comprising: a semiconductor laser diode; a primary lead having a diode-disposing portion on which a sub-mount is provided for mounting the semiconductor laser diode; at least one secondary lead electrically insulated from the primary lead;
What is claimed is: 1. A semiconductor laser diode device, comprising: a semiconductor laser diode; a primary lead having a diode-disposing portion on which a sub-mount is provided for mounting the semiconductor laser diode; at least one secondary lead electrically insulated from the primary lead; a first resin member formed of an insulation resin molded onto the primary lead and the secondary lead to integrally fix the primary lead to the secondary lead and insulate the primary lead from the secondary lead; and a second resin member formed of a thermally conductive resin molded onto the primary lead and the first resin member to surround the primary lead and the first resin member so as to dissipate, in use, heat transferred to the primary lead and the first resin member to an outside of the device, said thermally conductive resin extending around and defining an emitting opening through which laser beams generated by the semiconductor laser diode are emittable to the outside of said device. 2. The device as set forth in claim 1, wherein the secondary lead comprises at least one connecting portion electrically connected to the semiconductor laser diode or to the sub-mount via a wire, a leg extending a predetermined length downward below the connecting portion, and a latch formed at the middle of the leg. 3. The device as set forth in claim 1, wherein the primary lead further comprises a leg extending a predetermined length downward from the diode-disposing portion, and a protruded portion formed at the middle of the leg. 4. The device as set forth in claim 2, wherein the first resin member is provided with an aperture exposing the connecting portion of the secondary lead to the outside. 5. The device as set forth in claim 1, wherein the first resin member is provided with flanges on an outer surface of the first resin member corresponding to the second resin member for enhancing an engaging force between the first resin member and the second resin member. 6. The device as set forth in claim 1, wherein the thermally conductive resin is a resinous material having a thermal conductivity of 1˜40 W/mK. 7. The device as set forth in claim 1, wherein the thermally conductive resin comprises metallic fillers. 8. The device as set forth in claim 1, wherein the thermally conductive resin comprises graphite fillers. 9. The device as set forth in claim 3, wherein the thermally conductive resin extending around the emitting opening defines a slant surface which extends obliquely from the diode-disposing portion of the primary lead upwardly away from the leg and rearwardly away from the semiconductor laser diode so as to prevent the laser beam emitted by the semiconductor laser diode from returning thereto. 10. The device as set forth in claim 1, further comprising: a light receiving diode for monitoring rear side emitted light. 11. The device as set forth in claim 10, wherein the light receiving diode is integrally provided to the sub-mount. 12. The device as set forth in claim 10, wherein the light receiving diode is provided to the primary lead so as to be separate from the sub-mount. 13. The device as set forth in claim 10, wherein the light receiving diode is provided to an inner wall of the second resin member. 14. A method of manufacturing a semiconductor laser diode device comprising a sub-mount for mounting a semiconductor laser diode; a primary lead having a diode-disposing portion on which the sub-mount is provided; and at least one secondary lead electrically insulated from the primary lead, the method comprising: forming a first resin member by either injection molding or transfer molding of an insulation resin directly onto the primary lead and the secondary lead, wherein the insulation resin surrounds the primary lead and the secondary lead and insulates the primary lead and the secondary lead from each other while fixing the primary lead to the secondary lead and exposing the diode-disposing portion of the primary lead; and forming a second thermally conductive resin member by either injection molding or transfer molding of a thermally conductive resin directly onto the primary lead and the first resin member, wherein the thermally conductive resin surrounds the primary lead and the first resin member so as to dissipate, in use, heat transferred to the primary lead and the first resin member to an outside of the device, said thermally conductive resin extending around and defining an emitting opening through which laser beams generated by the semiconductor laser diode are emittable to the outside. 15. The method as set forth in claim 14, wherein the first resin member is formed with an aperture exposing at least one connecting portion formed on an upper end of the secondary lead to the outside. 16. The method as set forth in claim 14, wherein flanges are formed on an outer surface of the first resin member corresponding to the second resin member for enhancing an engaging force with the second resin member. 17. The method as set forth in claim 14, wherein the thermally conductive resin is a resinous material having a thermal conductivity of 1˜40 W/mK. 18. The method as set forth in claim 14, wherein the thermally conductive resin comprises metallic fillers. 19. The method as set forth in claim 14, wherein the thermally conductive resin comprises graphite fillers. 20. The method as set forth in claim 14, wherein the primary lead further comprises a leg extending a predetermined length downward from the diode-disposing portion, and the thermally conductive resin extending around the emitting opening defines a slant surface which extends obliquely from the diode-disposing portion of the primary lead upwardly away from the leg and rearwardly away from the semiconductor laser diode so as to prevent the laser beam emitted by the semiconductor laser diode from returning thereto. 21. A method of manufacturing a semiconductor laser diode device, said method comprising: forming at least one primary lead and secondary lead on a lead frame; forming a first resin member by either injection molding or transfer molding of an insulation resin directly onto the primary lead and the secondary lead, wherein the insulation resin surrounds the primary lead and the secondary lead and insulates the primary lead and the secondary lead from each other while fixing the primary lead to the secondary lead and exposing a diode-disposing portion of the primary lead; forming a second thermally conductive resin member by either injection molding or transfer molding of a thermally conductive resin directly onto the primary lead and the first resin member, wherein the thermally conductive resin surrounds the primary lead and the first resin member so as to dissipate, in use, heat transferred to the primary lead and the first resin member to an outside of the device, said thermally conductive resin extending around and defining an emitting opening through which laser beams generated by the semiconductor laser diode are emittable to the outside; mounting a laser diode on the diode-disposing portion of the primary lead; electrically connecting the laser diode to the secondary lead; and cutting the primary and secondary leads from the lead frame. 22. The method as set forth in claim 21, wherein the primary lead is formed with the diode-disposing portion and a leg, the secondary lead is formed with at least one connecting portion and at least one leg, and said leads are formed by etching or punching the lead frame. 23. The method as set forth in claim 22, wherein latches are formed to the legs of the primary and secondary leads, respectively. 24. The method as set forth in claim 21, wherein the first resin member is formed with at least one aperture corresponding to an upper end of the secondary lead. 25. The method as set forth in claim 21, wherein the first resin member is formed with flanges for enhancing an engaging force with the second resin member. 26. The method as set forth in claim 21, wherein the thermally conductive resin is a resinous material having a thermal conductivity of 1˜40 W/mK. 27. The method as set forth in claim 21, wherein the thermally conductive resin comprises metallic fillers. 28. The method as set forth in claim 21, wherein the thermally conductive resin comprises graphite fillers. 29. The method as set forth in claim 22, wherein the thermally conductive resin extending around the emitting opening defines a slant surface which extends obliquely from the diode-disposing portion of the primary lead upwardly away from the leg and rearwardly away from the semiconductor laser diode for preventing the laser beam emitted from the laser diode from returning thereto. 30. The method as set forth in claim 21, wherein the mounting comprises bonding the laser diode to a sub-mount after mounting the sub-mount on the diode-disposing portion of the primary lead. 31. The method as set forth in claim 21, wherein the mounting comprises mounting a sub-mount on the diode-disposing portion of the primary lead after bonding the laser diode to the sub-mount. 32. The method as set forth in claim 14, wherein said diode and the sub-mount are both exposed from, without being embedded in, both said first and second resin members. 33. The method as set forth in claim 32, wherein the second resin member is formed to be in direct thermal and physical contact with portions of the first resin member and the diode-disposing portion of the primary lead which are surrounded by and embedded within said second resin member. 34. The device as set forth in claim 1, wherein said diode and the sub-mount are both exposed from, without being embedded in, both said first and second resin members. 35. The device as set forth in claim 34, wherein the second resin member is in direct thermal and physical contact with portions of the first resin member and the diode-disposing portion of the primary lead which are surrounded by and embedded within said second resin member. 36. The device as set forth in claim 35, wherein the second resin member is free of direct contact with wires that electrically connect the secondary lead to the semiconductor laser diode and to the sub-mount, said wire being exposed in said emitting opening of the second resin member. 37. The device as set forth in claim 35, wherein the thermally conductive resin defines a lower portion that extends for full 360 degrees around the first resin member and has an inner surface in direct thermal and physical contact with an outer surface of the first resin member; and an upper portion that extends for less than full 360 degrees but more than 180 degrees around the first resin member and the diode-disposing portion of the primary lead to define said emitting opening and has an inner surface in direct thermal and physical contact with an outer surface of the first resin member and the diode-disposing portion of the primary lead. 38. The method as set forth in claim 21, wherein said diode is exposed from, without being embedded in, both said first and second resin members. 39. The method as set forth in claim 38, wherein the second resin member is formed to be in direct thermal and physical contact with portions of the first resin member and the diode-disposing portion of the primary lead which are surrounded by and embedded within said second resin member. 40. The method of claim 39, wherein the steps of mounting the laser diode on the diode-disposing portion of the primary lead and electrically connecting the laser diode to the secondary lead are both performed (i) after the step of forming the second thermally conductive resin member and (ii) through the emitting opening of the second thermally conductive resin member.
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