초록 ▼

A bonding apparatus is provided which includes a device handler for handling electronic devices, the bonding apparatus including a bonding tool at which the electronic devices are locatable for bonding. A storage assembly is provided for storing multiple electronic devices and a conveying track is f

A bonding apparatus is provided which includes a device handler for handling electronic devices, the bonding apparatus including a bonding tool at which the electronic devices are locatable for bonding. A storage assembly is provided for storing multiple electronic devices and a conveying track is further provided for conveying electronic devices towards and away from the bonding tool. The device handler includes a rotary platform for holding an electronic device, and which is operable between an orientation wherein the rotary platform is aligned with the conveying track for transferring an electronic device between the rotary platform and the conveying track, and another orientation wherein the rotary platform is aligned with the storage assembly for transferring an electronic device between the rotary platform and the storage assembly.

대표청구항 ▼

The invention claimed is: 1. A bonding apparatus for electronic devices, comprising: a bonding tool at which the electronic devices are locatable for bonding; a storage assembly for storing multiple electronic devices; a conveying track for conveying electronic devices towards and away from the bon

The invention claimed is: 1. A bonding apparatus for electronic devices, comprising: a bonding tool at which the electronic devices are locatable for bonding; a storage assembly for storing multiple electronic devices; a conveying track for conveying electronic devices towards and away from the bonding tool; and a rotary platform for holding an electronic device and which is operable between an orientation wherein the rotary platform is aligned with the conveying track for transferring an electronic device between the rotary platform and the conveying track, and another orientation wherein the rotary platform is aligned with the storage assembly for transferring an electronic device between the rotary platform and the storage assembly. 2. The bonding apparatus as claimed in claim 1, wherein the storage assembly comprises an input container for storing unbonded electronic devices and an output container for storing bonded electronic devices. 3. The bonding apparatus as claimed in claim 2, wherein both the input and output containers are located at one end of the conveying track. 4. The bonding apparatus as claimed in claim 2, wherein the input and output containers comprise feeding passages that are oriented at an angle to a conveying direction of the conveying track. 5. The bonding apparatus as claimed in claim 4, wherein the feeding passages are oriented perpendicular to the conveying direction of the conveying track. 6. The bonding apparatus as claimed in claim 2, wherein the rotary platform is configured for relative motion with respect to the input and output containers for aligning the rotary platform with the feeding passages of the input and output containers respectively. 7. The bonding apparatus as claimed in claim 1, wherein the rotary platform is configured to rotate along a substantially horizontal plane. 8. The bonding apparatus as claimed in claim 1, further comprising a processing station at a position of the rotary platform that is operative to process electronic devices that are transferred onto the rotary platform. 9. The bonding apparatus as claimed in claim 8, wherein the processing station is selected from the group consisting of: line scanner, visual lead location device, cleaning device and curing device. 10. The bonding apparatus as claimed in claim 1, wherein the bonding tool is configured to access only a portion of a whole surface of the electronic device located at the position of the bonding tool for bonding. 11. The bonding apparatus as claimed in claim 10, wherein the rotary platform is operative to rotate an electronic device that has been partially bonded such that an unbonded portion of the electronic device is positioned to be accessible by the bonding tool. 12. The bonding apparatus as claimed in claim 1, wherein the bonding tool comprises a wire bonding tool. 13. A bonding apparatus for electronic devices, comprising: first and second bonding tools at which the electronic devices are locatable for bonding; storage assemblies for storing multiple electronic devices; first and second conveying tracks for conveying electronic devices towards and away from the first and second bonding tools respectively; and first and second rotary platforms for holding electronic devices, each of which is operable between an orientation wherein the rotary platform is aligned with a conveying track for transferring an electronic device between the rotary platform and the conveying track, and another orientation wherein the rotary platform is aligned with a storage assembly for transferring an electronic device between the rotary platform and the storage assembly. 14. The bonding apparatus as claimed in claim 13, further comprising a third rotary platform positioned between the first and second bonding tools that is operative to change an orientation of an electronic device when transferring the electronic device from the first conveying track to the second conveying track. 15. The bonding apparatus as claimed in claim 14, wherein the third rotary platform is configured to rotate along a substantially horizontal plane.