초록

A radiation-curable resin composition comprising an inorganic component containing a silica particle composed of a hydrolyzate of an oligomer of an alkoxysilane and a monomer and/or an oligomer thereof, wherein viscosity at 25° C. is from 1,000 to 10,000 centipoises.

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The invention claimed is: 1. A radiation-curable resin composition, comprising: (i) an inorganic component comprising silica particles obtained by hydrolyzing a mixture consisting of an oligomer of an alkoxysilane and a solvent, and (ii) a monomer having a radiation-curable functional group, an oli

The invention claimed is: 1. A radiation-curable resin composition, comprising: (i) an inorganic component comprising silica particles obtained by hydrolyzing a mixture consisting of an oligomer of an alkoxysilane and a solvent, and (ii) a monomer having a radiation-curable functional group, an oligomer having a radiation-curable functional group, or both said monomer and said oligomer, wherein the solvent is present in an amount of 5% by weight or less based on the total weight of the radiation-curable resin composition, wherein the viscosity of the radiation curable composition at 25° C. is from 1,000 to 10,000 centipoises, and wherein the silica particle has a number average particle size of 50 nm or less, and wherein a cured product of the composition has a light transmittance of 80% or more at an optical path length of 0.1 mm at 550 nm. 2. The radiation-curable resin composition according to claim 1, wherein surface tension of the composition at 25° C. is 40 mN/m or less. 3. The radiation-curable resin composition according to claim 1, which comprises a silica particle composed of a hydrolyzate of an oligomer of an alkoxysilane as the inorganic component, the silica particle being surface-treated with a compound selected from the group consisting of a silane coupling agent, a hydrolyzate of a silane coupling agent, and a condensate thereof. 4. The radiation-curable resin composition according to claim 1, wherein at least one and the oligomer of the monomer has a group capable of forming an intramolecular hydrogen bond or an intermolecular hydrogen bond. 5. The radiation-curable resin composition according to claim 1, wherein at least one of the monomer and the oligomer contains a urethane bond or a hydroxyalkylene group. 6. The radiation-curable resin composition according to claim 5, wherein at least one of the monomer and the oligomer having a radiation-curable group and containing a urethane bond or a hydroxyalkylene group, has an acid group. 7. The radiation-curable resin composition according to claim 6, wherein the content of the acid group is from 0.1×10-4 eq/g to 13×10-4 eq/g. 8. The radiation-curable resin composition according to claim 6, wherein the acid group is a carboxyl group. 9. The radiation-curable resin composition according to claim 5, wherein the radiation-curable group is a (meth)acryloyl group. 10. The radiation-curable resin composition according to claim 1, wherein at least one of the monomer and the oligomer is a compound having no aromatic ring. 11. The radiation-curable resin composition according to claim 1, wherein the composition does not contain any solvent. 12. The radiation-curable resin composition according to claim 1, wherein the silica particle is treated with a silane coupling agent having a radiation-curable group. 13. The radiation-curable resin composition according to claim 12, wherein the silane coupling agent is at least one selected from the group consisting of epoxy cyclohexylethyltrimethoxysilane, glycidoxypropyltrimethoxysilane, vinyltrimethoxysilane, vinyltriethoxysilane, acryloxypropyltrimethoxysilane, methacryloxypropyltrimethoxysilane, mercaptopropyltrimethoxysilane, and mercaptopropyltriethoxysilane. 14. The radiation-curable resin composition according to claim 12, wherein the silica particle treated with the silane coupling agent includes an Si--O--Si bond between the silane coupling agent and the silica particle. 15. The radiation-curable resin composition according to claim 1, wherein the monomer and/or the oligomer has a (meth)acryloyl group and a urethane bond. 16. The radiation-curable resin composition of claim 1, wherein the inorganic component is present in an amount of 5% by weight or more. 17. The radiation-curable resin composition of claim 1, wherein the silica particles have a number average particle size of 40 nm or less. 18. The radiation-curable resin composition of claim 1, wherein the silica particles have a number average particle size of 30 nm or less. 19. The radiation-curable resin composition of claim 1, wherein the silica particles have a number average particle size of 15 nm or less. 20. The radiation-curable resin composition of claim 1, wherein the silica particles have a number average particle size of 12 nm or less. 21. A radiation-cured resin composition obtained by radiation-curing the radiation-curable resin composition according to claim 1. 22. The radiation-cured resin composition according to claim 21, in the form of a film having a thickness of from 20 to 500 μm. 23. The radiation-curable resin composition of claim 1, wherein a radiation cured film of the radiation-curable resin composition having a thickness of 1 mm has a minimum transparency of 83% at 550 nm. 24. The radiation-curable resin composition of claim 1, wherein a radiation cured film of the radiation-curable resin composition having a thickness of 1 mm has a minimum transparency of 85% at 550 nm. 25. The radiation-curable resin composition of claim 1, wherein the solvent is at least one selected from the group consisting of an alcohol, a glycol, a hydrocarbon, an ester, a ketone, and an ether. 26. The radiation-curable resin composition according to claim 1, wherein the solvent is at least one of an alcohol and a ketone. 27. The radiation-curable resin composition according to claim 1, wherein the alcohol is at least one selected from the group consisting of methanol, ethanol, isopropyl alcohol, n-butyl alcohol, isobutyl alcohol, octanol, n-propyl alcohol, and acetylacetone alcohol. 28. The radiation-curable resin composition according to claim 1, wherein the silica particles are obtained by hydrolyzing the oligomer of an alkoxysilane with from 0.3 to 1 equivalents of water based on the mol number of alkoxy groups of the oligomer of an alkoxysilane. 29. A radiation-cured resin film having a thickness of 85 μm or greater obtained by radiation-curing the radiation-curable resin composition according to claim 1. 30. A radiation-cured resin film having a thickness of 100±15 μm obtained by radiation-curing the radiation-curable resin composition according to claim 1.