초록 ▼

A heat dissipation system for digital electronic signboard includes a first heat dissipation subsystem disposed in a main circuit board area of a digital electronic signboard, and a second heat dissipation subsystem disposed in a computer mainboard area of the digital electronic signboard. The main

A heat dissipation system for digital electronic signboard includes a first heat dissipation subsystem disposed in a main circuit board area of a digital electronic signboard, and a second heat dissipation subsystem disposed in a computer mainboard area of the digital electronic signboard. The main circuit board area has a plurality of heat dissipation fans disposed therein, wherein one heat dissipation fan is disposed at a side of the main circuit board area, while another heat dissipation fan is disposed at a side of a power supply and can be externally connected to an air guide pipe. The computer mainboard area can also have a plurality of heat dissipation fans disposed therein, wherein one heat dissipation fan is disposed at a side of the computer mainboard, while another heat dissipation fan is disposed on the top of a microprocessor of the computer mainboard.

대표청구항 ▼

What is claimed is: 1. A heat dissipation system for a digital electronic signboard having a first heat dissipation subsystem and a second heat dissipation subsystem, comprising: the first heat dissipation subsystem being disposed in a main circuit board area of a digital electronic signboard, the

What is claimed is: 1. A heat dissipation system for a digital electronic signboard having a first heat dissipation subsystem and a second heat dissipation subsystem, comprising: the first heat dissipation subsystem being disposed in a main circuit board area of a digital electronic signboard, the main circuit board area having at least two heat dissipation fans disposed therein, wherein one heat dissipation fan is appropriately disposed at a side of the main circuit board area, while another heat dissipation fan is disposed at a side of a power supply, and the heat dissipation fan disposed at the side of the power supply can be externally connected to an air guide pipe; the second heat dissipation subsystem being disposed in a computer mainboard area of the digital electronic signboard; the computer mainboard area having at least two heat dissipation fans disposed therein, wherein one heat dissipation fans is appropriately disposed at a side of the computer mainboard, while another heat dissipation fan is disposed on the top of a microprocessor of the computer mainboard, the heat dissipation system for the digital electronic signboard is thus formed by the above mentioned heat dissipation subsystems. 2. The heat dissipation system for the digital electronic signboard of claim 1, wherein the first heat dissipation subsystem and the second heat dissipation subsystem are separated by a partition board. 3. The heat dissipation system for the digital electronic signboard of claim 1, wherein the first heat dissipation subsystem and the second heat dissipation subsystem are covered by a back cover, and the back cover comprises multiple rows of heat dissipation holes disposed thereon. 4. The heat dissipation system for the digital electronic signboard of claim 3, wherein some of the rows of heat dissipation holes on the back cover are disposed with respect to places where the heat dissipation subsystems and the air guide pipe exhaust air.