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[미국특허] Surface mount right angle connector including strain relief and associated methods 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01R-009/05
출원번호 UP-0136295 (2008-06-10)
등록번호 US-7575474 (2009-08-31)
발명자 / 주소
  • Dodson, James Bradley
  • Rivers, Norman
  • Harrison, George Albert
출원인 / 주소
  • Harris Corporation
대리인 / 주소
    Allen, Dyer, Doppelt, Milbrath & Gilchrist, P.A.
인용정보 피인용 횟수 : 31  인용 특허 : 16

초록

An electronic device includes a printed circuit board (PCB) including a planar surface conductor, e.g. such as a microstrip transmission line or coplanar transmission waveguide. A surface mount connector portion is mounted to the PCB and includes an electrically conductive header having a cylindrica

대표청구항

That which is claimed is: 1. An electronic device comprising: a printed circuit board (PCB) comprising a dielectric layer and an electrically conductive layer thereon defining a planar surface conductor; and a surface mount connector portion mounted to the PCB and comprising an electrically conduct

이 특허에 인용된 특허 (16) 인용/피인용 타임라인 분석

  1. James O. Handley ; Jeffrey C. Murphy, Assembly including an electrical connector and a pair of printed circuit boards.
  2. Hosler ; Sr. Robert Craig, Board mountable coaxial connector.
  3. Koegel Keith S. (Plainfield PA) Nikoloff Christo S. (Lititz PA), Board-mounting rack for plurality of electrical connectors.
  4. Wang Tsan-Chi,TWX, Coaxial cable connector.
  5. Briones Francisco R. (Markham CAX) Boutros Kamal S. (Richmond Hill CAX), Coaxial connector with integral decoupling unit.
  6. Dodart Andr (Eragny S/oise FRX), Connection device to provide a connection, by coaxial cable, to a printed circuit.
  7. Henry Randall R. (Harrisburg PA) Sneed Michael R. (Harrisburg PA), Connector assembly and method of manufacture.
  8. Nesbit Gerald H. (Voorhees Township ; Camden County NJ) Afrashteh Alireza (Colts-Neck NJ), Connector for joining microstrip transmission lines.
  9. Kosugi Yuhei (both c/o NEC Corporation ; 33-1 ; Shiba 5-chome Minato-ku ; Tokyo JPX) Ogawa Shigeo (both c/o NEC Corporation ; 33-1 ; Shiba 5-chome Minato-ku ; Tokyo JPX), High frequency connector.
  10. Stursa Lloyd C. (Owatonna MN), Printed circuit board coaxial connector interface.
  11. Birch Norman R. (Jacobus PA), RF convertor and switch.
  12. Gabany Andrew J. (Mechanicsburg PA), Right angle coaxial jack connector.
  13. Nagashima Masayuki (Tokyo JPX), Surface-mounted high-frequency coaxial connector.
  14. Fleury, Michel; Martin, Steven Jeffrey; Papillon, Jean-Marc; Guindon, Francois, System and method for interfacing a coaxial connector to a coplanar waveguide substrate.
  15. Herstein, Dov, Transition from a coaxial transmission line to a printed circuit transmission line.
  16. Riddle Robert G. (Escondido CA) Douglass Jeffrey A. (Poway CA) Voss John D. (Cumming GA) Ellis Stephen C. (Murrieta CA), Wideband solderless right-angle RF interconnect.

이 특허를 인용한 특허 (31) 인용/피인용 타임라인 분석

  1. Sherrer, David W.; Rollin, Jean-Marc, Batch fabricated microconnectors.
  2. Sherrer, David W.; Rollin, Jean-Marc, Batch fabricated microconnectors.
  3. Holland, Michael, Coaxial connector with ingress reduction shield.
  4. Holland, Michael; Goebel, George; Gibson, Reed, Coaxial connector with ingress reduction shielding.
  5. Holland, Michael; Goebel, George; Gibson, Reed, Coaxial connector with ingress reduction shielding.
  6. Holland, Michael; Goebel, George; Gibson, Reed, Coaxial connector with ingress reduction shielding.
  7. Sherrer, David, Coaxial transmission line microstructure with a portion of increased transverse dimension and method of formation thereof.
  8. Sherrer, David W.; Fisher, John J., Coaxial waveguide microstructure having center and outer conductors configured in a rectangular cross-section.
  9. Sherrer, David W.; Fisher, John J., Coaxial waveguide microstructures having an active device and methods of formation thereof.
  10. Sherrer, David W.; Fisher, John J., Coaxial waveguide microstructures having conductors formed by plural conductive layers.
  11. Sherrer, David W.; Reid, James R., Devices and methods for solder flow control in three-dimensional microstructures.
  12. Sherrer, David W.; Reid, Jr., James R., Devices and methods for solder flow control in three-dimensional microstructures.
  13. Myer, John Mark; Moll, Hurley Chester, Harness connector.
  14. Rollin, Jean-Marc; Sherrer, David W., Integrated electronic components and methods of formation thereof.
  15. Rollin, Jean-Marc; Sherrer, David W., Integrated electronic components and methods of formation thereof.
  16. Sherrer, David W.; Cardwell, Dara L., Methods of fabricating electronic and mechanical structures.
  17. Rollin, Jean-Marc; Reid, J. Robert; Sherrer, David; Stacy, Will; Vanhille, Ken; Oliver, J. Marcus; Smith, Tim, Microstructure including microstructural waveguide elements and/or IC chips that are mechanically interconnected to each other.
  18. Reid, James Robert, Multi-layer digital elliptic filter and method.
  19. Reid, James Robert, Multi-layer digital elliptic filter and method.
  20. Suzuki, Hisashi; Hirako, Ryoichi, Relay connector.
  21. Biddle, Gary Ellsworth; Shelly, Christopher Warren, Right-angle board-mounted connectors.
  22. Rollin, Jean-Marc; Reid, J. Robert; Sherrer, David; Stacy, Will; Vanhille, Ken; Oliver, J. Marcus; Smith, Tim, Structures and methods for interconnects and associated alignment and assembly mechanisms for and between chips, components, and 3D systems.
  23. Hovey, Ian; Reid, J. Robert; Sherrer, David; Stacy, Will; Vanhille, Ken, Substrate-free interconnected electronic mechanical structural systems.
  24. Hovey, Ian; Reid, J. Robert; Sherrer, David; Stacy, Will; Vanhille, Ken, Substrate-free interconnected electronic mechanical structural systems.
  25. Hovey, Ian; Reid, J. Robert; Sherrer, David; Stacy, Will; Vanhille, Ken, Substrate-free mechanical interconnection of electronic sub-systems using a spring configuration.
  26. Behziz, Arash, System and method for mounting shielded cables to printed circuit board assemblies.
  27. Vanhille, Kenneth; Sherrer, David, Thermal management.
  28. Houck, William D.; Sherrer, David W., Three-dimensional microstructure having a first dielectric element and a second multi-layer metal element configured to define a non-solid volume.
  29. Houck, William D.; Sherrer, David W., Three-dimensional microstructures having a re-entrant shape aperture and methods of formation.
  30. Sherrer, David, Transition structure between a rectangular coaxial microstructure and a cylindrical coaxial cable using step changes in center conductors thereof.
  31. Vanhille, Kenneth; Sherrer, David, Waveguide balun having waveguide structures disposed over a ground plane and having probes located in channels.

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