IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
UP-0948864
(2007-11-30)
|
등록번호 |
US-7578668
(2009-09-08)
|
발명자
/ 주소 |
- Hutchinson, Gerald A.
- Lee, Robert A.
- Feichtinger, Heinrich K.
|
출원인 / 주소 |
- Advanced Plastics Technologies Luxembourg S.A.
|
대리인 / 주소 |
Knobbe Martens Olson & Bear LLP
|
인용정보 |
피인용 횟수 :
5 인용 특허 :
170 |
초록
▼
Disclosed is a preferred mold design for producing plastic, molded preforms, which may be blow-molded into a container of a final, desired shape. A preferred mold includes a temperature control system for maintaining the preform mold at a desired temperature. The temperature control system can pass
Disclosed is a preferred mold design for producing plastic, molded preforms, which may be blow-molded into a container of a final, desired shape. A preferred mold includes a temperature control system for maintaining the preform mold at a desired temperature. The temperature control system can pass fluid through channels within the preform mold to cool plastic that is injected into the preform mold. In some arrangements, a mold comprises a neck finish mold, the neck finish mold comprising high heat transfer material positioned to transfer heat away from melt within a mold cavity of the mold.
대표청구항
▼
What is claimed is: 1. A mold comprising: a core section having a core surface; a cavity section having a cavity surface, a mold cavity being defined by the core surface and the cavity surface when the mold is in a closed position; at least one fluid channel being disposed within one of the core se
What is claimed is: 1. A mold comprising: a core section having a core surface; a cavity section having a cavity surface, a mold cavity being defined by the core surface and the cavity surface when the mold is in a closed position; at least one fluid channel being disposed within one of the core section and the cavity section; and a pressure reducing device in fluid communication with the fluid channel, the pressure reducing device being configured to receive and at least partially vaporize a volume of a refrigerant. 2. The mold of claim 1, wherein the pressure reducing device comprises a valve. 3. The mold of claim 2, wherein the pressure reducing device comprises a nozzle valve or a needle valve. 4. The mold of claim 2, wherein the pressure reducing device comprises an expansion valve with a fixed diameter orifice. 5. The mold of claim 1, wherein the refrigerant comprises nitrogen or carbon dioxide. 6. The mold of claim 1, wherein the mold is a compression mold or an injection mold. 7. The mold of claim 1, wherein the fluid channel is part of an open-loop system. 8. The mold of claim 1, wherein the fluid channel is part of a closed-loop system. 9. The mold of claim 1, wherein the pressure reducing device is located at least partially within the core section or the cavity section. 10. The mold of claim 1, wherein the pressure reducing device is located outside of the core section or the cavity section. 11. The mold of claim 1, further comprising a flow regulator positioned upstream of the pressure reducing device, the flow regulator being configured to selectively control a flow rate at which the refrigerant enters the pressure reducing device. 12. The mold of claim 1, further comprising a temperature control element configured to selectively heat or cool at least a portion of the mold. 13. The mold of claim 12, wherein the temperature control element comprises a resistance heater. 14. A mold assembly comprising: a core section; a cavity section, a mold cavity being defined by the core section and the cavity section when the mold assembly is in a closed position; and a temperature control system configured to transfer heat away from the mold cavity, the temperature control system comprising: at least one fluid channel located within one of the core section and cavity section; and a pressure reducing device in fluid communication with the fluid channel, the pressure reducing device being configured to receive a volume of a refrigerant and to at least partially reduce a pressure of the refrigerant to an outlet pressure equal to or less than a vaporization pressure of the refrigerant. 15. The mold assembly of claim 14, wherein the pressure reducing device is positioned in the fluid channel. 16. The mold assembly of claim 14, wherein the temperature control system is an open loop system. 17. The mold assembly of claim 14, wherein the temperature control system is a closed loop system. 18. The mold assembly of claim 17, wherein the temperature control system further comprises a heat exchange unit comprising a compressor and a condenser, the heat exchange unit being configured to receive a volume of refrigerant exiting the fluid channel, increase a pressure of the refrigerant and return the refrigerant toward the pressure reducing device. 19. The mold assembly of claim 14, wherein the pressure reducing device comprises a valve. 20. The mold assembly of claim 19, wherein the valve comprises a fixed diameter orifice. 21. The mold assembly of claim 19, wherein the valve comprises a variable diameter orifice. 22. The mold assembly of claim 14, wherein the pressure reducing device is proximate to the mold cavity. 23. The mold assembly of claim 14, wherein the refrigerant comprises nitrogen or carbon dioxide. 24. The mold assembly of claim 14, further comprising at least one temperature control element configured to affect a temperature of the mold section or the cavity section. 25. The mold assembly of claim 14, further comprising a temperature sensor and a controller, the temperature sensor and the controller being configured to substantially maintain the mold assembly at a desired temperature. 26. The mold assembly of claim 14, wherein the temperature control system further comprises a flow regulator positioned upstream of the pressure reducing device, the flow regulator being configured to selectively control a flow rate at which the refrigerant enters the pressure reducing device.
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