[특허]Electronic circuit component

[미국특허] Electronic circuit component 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	H05K-007/00
출원번호	UP-0834452 (2007-08-06)
등록번호	US-7586755 (2009-09-22)
우선권정보	JP-2001-211539(2001-07-12); JP-2001-211540(2001-07-12)
발명자 / 주소	Satoh, Toshiya Ogino, Masahiko Miwa, Takao Naitou, Takashi Namekawa, Takashi Nabatame, Toshihide Motowaki, Shigehisa
출원인 / 주소	Hitachi, Ltd.
대리인 / 주소	Crowell & Moring LLP
인용정보	피인용 횟수 : 8 인용 특허 : 20

초록 ▼

Through an improvement of module size increase due to mounting a single passive element on a substrate and an increase in the mounting cost, to provide a highly reliable, high performance and small sized electronic circuit component which permits to integrate a variety of electronic parts such as capacitors, inductors and resistors in a high density with low cost. The electronic circuit component comprises an insulator substrate, a plurality of electrodes having different areas provided on the insulator substrate, one or more elements selected from a capacitor element of dielectric material sandwiched between the electrodes, an inductor element and resistor element, a metal wiring connecting the elements, a metal terminal part of a part of the metal wiring and an organic insulator material covering the elements and the circumference of the metal wiring portion excluding the metal terminal portion.

대표청구항 ▼

The invention claimed is: 1. An electronic circuit component comprising: an insulator substrate having at least one through hole at a predetermined position therein; a capacitor comprising a plurality of electrodes having different areas provided on the insulator substrate and dielectric material sandwiched between the electrodes; at least one element selected from the group consisting of an inductor element and a resistor element; a metal wiring connecting the elements; a metal terminal part of a part of the metal wiring; and an organic insulator material covering the elements and the circumference of the metal wiring portion, excluding the metal terminal portion; wherein, the area of an upper electrode of said capacitor is smaller than the area of a lower electrode of said capacitor; said upper electrode is connected to the metal wiring by a lead-out wiring via the at least one through hole, through the organic insulator material; and the lead-out wiring does not contact the dielectric material. 2. An electronic circuit component according to claim 1, wherein the insulator substrate is a glass substrate. 3. An electronic circuit component according to claim 1, wherein the organic insulator material is a photosensitive organic insulator material. 4. An electronic circuit component according to claim 1, wherein the organic insulator material is a low dielectric loss tangent resin composition which includes a bridging component having a plurality of styrene groups as expressed by the following general chemical formula and contains polymers having average molecular weight of more than 5000, (Wherein, R represents a hydrocarbon skeleton, which may include a substituent, R1 represents one of hydrogen, methyl and ethyl, m represents 1 from 4 and n represents an integer more than 1). 5. An electronic circuit component according to claim 1, wherein the organic insulator material is polyimide. 6. An electronic circuit component according to claim 1, wherein the organic insulator material is BCB (Benzo Cyclo Butene). 7. An electronic circuit component according to claim 1, wherein the dielectric material is an organic insulator material or an oxide of any one of Ta, Mg and Sr.

이 특허에 인용된 특허 (20) 인용/피인용 타임라인 분석

Nomura Kazuo,JPX ; Nakanuma Nobutsugu,JPX ; Ishiyama Ichiro,JPX ; Higashi Koji,JPX ; Kato Masaki,JPX ; Nagare Ichiro,JPX ; Kurokawa Hiroyuki,JPX ; Ohara Yozo,JPX, Capacitor-mounted circuit board.
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Hanamura Toshihiro,JPX, Chip-type composite part.
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Okubora, Akihiko; Hirabayashi, Takayuki; Shikichi, Hideyuki, Circuit device board, semiconductor component, and method of making the same.
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Brady, Gary W.; Hampton, III, Harry L.; White, Michael T.; Kabadi, Ashok N., Component array adapter.
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Inoguchi Yoshitaka,JPX, Discharge structure of printed circuit board.
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Chakravorty, Kishore K., Electronic assemblies and systems comprising interposer with embedded capacitors.
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Chakravorty, Kishore K., Electronic assembly comprising substrate with embedded capacitors.
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Li, Yuan-Liang; Chung, Chee-Yee, Electronic assembly with laterally connected capacitors and manufacturing method.
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Figueroa, David G.; Watts, Nicholas R., Electronic circuit housing with trench vias and method of fabrication therefor.
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Aaron Dean Hale ; Michael Walk ; David G. Figueroa ; Joan K. Vrtis ; Toshimi Kohmura JP, Electronic package having embedded capacitors and method of fabrication therefor.
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Masumi Nakamichi JP, High frequency module.
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Vu, Quat T.; Li, Jian; Towle, Steven, Microelectronic substrate with integrated devices.
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Moresco, Larry L., Multichip module substrates with buried discrete capacitors and components and methods for making.
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Inagaki,Yasushi; Asai,Motoo; Wang,Dongdong; Yabashi,Hideo; Shirai,Seiji, Printed circuit board and method of manufacturing printed circuit board.
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Ehman Michael F. ; Eslinger Larry L., Printed circuit boards with integrated passive components and method for making same.
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Tosaki Hiromi (Yokohama JPX) Sugishita Nobuyuki (Yokosuka JPX) Ikegami Akira (Yokohama JPX), Process for manufacturing a multilayer circuit board.
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Satoh, Toshiya; Ogino, Masahiko; Miwa, Takao; Naitou, Takashi; Namekawa, Takashi, Semiconductor connection substrate.
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Kawamoto Atsunobu,JPX, Semiconductor device.
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Kaneko Tsuneo (Yokohama JPX) Ezaki Shiro (Yokohama JPX), Substrate coated with multiple thick films.
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Richard W. Carpenter, Thin integral resistor/capacitor/inductor package, method of manufacture.
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이 특허를 인용한 특허 (8) 인용/피인용 타임라인 분석

Lan, Je-Hsiung; Zuo, Chengjie; Yun, Changhan; Berdy, David F.; Kim, Daeik D.; Mikulka, Robert P.; Velez, Mario Francisco; Kim, Jonghae, Capacitor with a dielectric between a via and a plate of the capacitor.
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Zuo, Chengjie; Kim, Jonghae; Velez, Mario Francisco; Lan, Je-Hsiung; Kim, Daeik D.; Yun, Changhan; Berdy, David F.; Mikulka, Robert P.; Nowak, Matthew M.; Zhang, Xiangdong; See, Puay H., Diplexer design using through glass via technology.
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Standing, Martin; Roberts, Andrew, Systems and methods for embedding devices in printed circuit board structures.
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Zuo, Chengjie; Kim, Jonghae; Kim, Daeik Daniel; Velez, Mario Francisco; Yun, Changhan Hobie; Lan, Je-Hsiung Jeffrey; Mikulka, Robert Paul; Nowak, Matthew Michael, Systems for reducing magnetic coupling in integrated circuits (ICS), and related components and methods.
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Zuo, Chengjie; Kim, Daeik D.; Lan, Je-Hsiung; Kim, Jonghae; Velez, Mario Francisco; Yun, Changhan; Berdy, David F.; Mikulka, Robert P.; Nowak, Matthew M.; Zhang, Xiangdong; See, Puay H., Tunable diplexers in three-dimensional (3D) integrated circuits (IC) (3DIC) and related components and methods.
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Zuo, Chengjie; Kim, Daeik D.; Lan, Je-Hsiung; Kim, Jonghae; Velez, Mario Francisco; Yun, Changhan; Berdy, David F.; Mikulka, Robert P.; Nowak, Matthew M.; Zhang, Xiangdong; See, Puay H., Tunable diplexers in three-dimensional (3D) integrated circuits (IC) (3DIC) and related components and methods.
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Zuo, Chengjie; Kim, Daeik D.; Lan, Je-Hsiung; Kim, Jonghae; Velez, Mario Francisco; Yun, Changhan; Berdy, David F.; Mikulka, Robert P.; Nowak, Matthew M.; Zhang, Xiangdong; See, Puay H., Tunable diplexers in three-dimensional (3D) integrated circuits (IC) (3DIC) and related components and methods.
상세보기
Zuo, Chengjie; Kim, Daeik D.; Lan, Je-Hsiung; Kim, Jonghae; Velez, Mario Francisco; Yun, Changhan; Berdy, David F.; Mikulka, Robert P.; Nowak, Matthew M.; Zhang, Xiangdong; See, Puay H., Tunable diplexers in three-dimensional (3D) integrated circuits (IC) (3DIC) and related components and methods.
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IPC	Description
A	생활필수품
A62	인명구조; 소방(사다리 E06C)
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A62B-1/08	.. 윈치 또는 풀리에 제동기구가 있는 것

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[미국특허] Electronic circuit component 원문보기