Assembled structure of power semiconductor device and heat sink
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
H05K-007/20
H01L-023/36
H01L-023/34
출원번호
UP-0627089
(2007-01-25)
등록번호
US-7589970
(2009-09-24)
우선권정보
TW-95136415 A(2006-09-29)
발명자
/ 주소
Hsieh, Hung Chang
출원인 / 주소
Delta Electronics, Inc.
대리인 / 주소
Kirton & McConkie
인용정보
피인용 횟수 :
4인용 특허 :
16
초록▼
An assembled structure includes a power semiconductor device, a first insulating member, a heat sink and a fastening element. The power semiconductor device has a first perforation. The first insulating member includes a first opening and a second opening corresponding to the first perforation and
An assembled structure includes a power semiconductor device, a first insulating member, a heat sink and a fastening element. The power semiconductor device has a first perforation. The first insulating member includes a first opening and a second opening corresponding to the first perforation and a receiving portion between the first opening and a second opening. The fastening element includes a head portion and a body portion. The body portion is penetrated through the first opening, the receiving portion, the second opening and the first perforation such that the power semiconductor device is fastened onto the heat sink. The head portion is received in the receiving portion so as to isolate the head portion of the fastening element from adjacent electronic components.
대표청구항▼
What is claimed is: 1. An assembled structure of a power semiconductor device and a heat sink, said assembled structure comprising: the power semiconductor device having a first perforation, a first side and a second side adjacent to said first side; a first insulating member including a first open
What is claimed is: 1. An assembled structure of a power semiconductor device and a heat sink, said assembled structure comprising: the power semiconductor device having a first perforation, a first side and a second side adjacent to said first side; a first insulating member including a first opening and a second opening corresponding to said first perforation and a sidewall defining a receiving portion between said first opening and said second opening, said receiving portion including an inner bottom surface, wherein said sidewall of said first insulating member is substantially in contact with said first side of said power semiconductor device and protruded relative to said second side of said power semiconductor device; a heat sink; and a fastening element including a head portion and a body portion, the distance from said first opening to the inner bottom surface of said receiving portion of said first insulating member substantially being not less than the height of said head portion of said fastening element, wherein said body portion is penetrated through said first opening, said receiving portion, said second opening and said first perforation such that said power semiconductor device is fastened onto said heat sink, and said head portion is received in said receiving portion so as to isolate said head portion of said fastening element from adjacent electronic components. 2. The assembled structure according to claim 1 wherein said fastening element is a screw. 3. The assembled structure according to claim 2 wherein said fastening element further includes a nut to be engaged with said body portion of said screw such that said power semiconductor device is fastened onto said heat sink. 4. The assembled structure according to claim 1 further including an insulating piece between said power semiconductor device and said heat sink for isolating said power semiconductor device from said heat sink, wherein said insulating piece includes a second perforation corresponding to said first perforation of said power semiconductor device. 5. The assembled structure according to claim 4 wherein said heat sink has a through-hole corresponding to said second perforation of said insulating piece and said body portion of said screw is penetrated through said through-hole. 6. The assembled structure according to claim 5 further including a second insulating member between said nut and said heat sink for isolating said heat sink from said nut. 7. The assembled structure according to claim 6 wherein said power semiconductor device is a power transistor. 8. The assembled structure according to claim 7 wherein said power semiconductor device includes a metallic plate. 9. The assembled structure according to claim 8 wherein said first insulating member includes a first sleeve and a second sleeve communicated with each other, said first sleeve includes said first opening and said receiving portion, said second sleeve includes said second opening and a channel, said channel is communicated with said receiving portion and said second opening, and the diameter of said first opening is larger than that of said second opening. 10. The assembled structure according to claim 9 wherein said second sleeve of said first insulating member is received in said first perforation of said power semiconductor device, said second perforation of said insulating piece and said through-hole of said heat sink such that said body portion of said screw is isolated from said power semiconductor device and said heat sink. 11. The assembled structure according to claim 10 wherein said second insulating member include a third opening and a fourth opening corresponding to said heat sink and said nut, respectively, and the diameter of said third opening is smaller than that of said fourth opening. 12. The assembled structure according to claim 11 wherein said second insulating member further include a receptacle between said third opening and said fourth opening, wherein said body portion of said screw is successively penetrated through said first opening, said receiving portion, said channel and said second opening of said first insulating member, said first perforation of said power semiconductor device, said second perforation of said insulating piece, said through-hole of said heat sink and said third opening of said second insulating member, and said body portion of said screw is screwed in said nut, wherein said nut is accommodated within said receptacle of said second insulating member so as to isolate said nut from adjacent electronic components. 13. An insulating member for isolating a power semiconductor device from a fastening element, said fastening element includes a head portion and a body portion, said power semiconductor device including a first perforation, a first side and a second side adjacent to said first side, said insulating member comprising a first opening and a second opening corresponding to said first perforation of said power semiconductor device and a sidewall defining a receiving portion between said first opening and said second opening, said receiving portion including an inner bottom surface, the distance from said first opening to the inner bottom surface of said receiving portion of said insulating member substantially being not less than the height of said head portion of said fastening element, wherein said sidewall of said insulating member is substantially in contact with said first side of said power semiconductor device and protruded relative to said second side of said power semiconductor device, and said body portion of said fastening element is penetrated through said first opening, said receiving portion, said second opening and said first perforation such that said power semiconductor device is fastened onto a heat sink, and said head portion is received in said receiving portion so as to isolate said head portion of said fastening element from adjacent electronic components. 14. The insulating member according to claim 13 wherein said insulating member includes a first sleeve and a second sleeve communicated with each other, said first sleeve includes said first opening and said receiving portion, said second sleeve includes said second opening and a channel, said channel is communicated with said receiving portion and said second opening, and the diameter of said first opening is larger than that of said second opening. 15. The insulating member according to claim 14 wherein said second sleeve of said first insulating member is received in said first perforation of said power semiconductor device and a through-hole of said heat sink such that said body portion of said screw is isolated from said power semiconductor device and said heat sink.
연구과제 타임라인
LOADING...
LOADING...
LOADING...
LOADING...
LOADING...
이 특허에 인용된 특허 (16)
Kaufman Lance R. (8001 N. Mohave Paradise Valley AZ 85253), Bolted circuit assembly with isolating washer.
Matsukura, Toyotsugu; Sakai, Shinichi; Morikawa, Hisashi, Power source unit for driving magnetron and heatsink to be mounted on printed circuit board thereof.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.