초록 ▼

Planarizing workpieces, e.g., microelectronic workpieces, can employ a process indicator which is adapted to change an optical property in response to a planarizing condition. This process indicator may, for example, change color in response to reaching a particular temperature or in response to a p

Planarizing workpieces, e.g., microelectronic workpieces, can employ a process indicator which is adapted to change an optical property in response to a planarizing condition. This process indicator may, for example, change color in response to reaching a particular temperature or in response to a particular shear force. In this example, the change in color of the process indicator may be correlated with an ongoing operating condition of the planarizing machine, such as excessive downforce, or correlated with an endpoint of the planarizing operation. Incorporating the process indicator in the planarizing medium, as proposed for select applications, can enable relatively simple, real-time collection of information which can be used to control a planarizing operation.

대표청구항 ▼

I claim: 1. A CMP planarizing pad adapted to planarize a microelectronic workpiece, comprising: a matrix adapted to support an abrasive, the matrix having a planar planarizing surface; a thermally responsive fluid in the matrix, the thermally responsive fluid being adapted to change color in respon

I claim: 1. A CMP planarizing pad adapted to planarize a microelectronic workpiece, comprising: a matrix adapted to support an abrasive, the matrix having a planar planarizing surface; a thermally responsive fluid in the matrix, the thermally responsive fluid being adapted to change color in response to a first temperature; and a second thermally responsive fluid in the matrix, the second thermally responsive fluid being adapted to generate a visible color change upon reaching a second temperature, the first temperature being correlated to a first planarizing condition and the second temperature being correlated to a different second planarizing condition. 2. The CMP planarizing pad of claim 1 wherein the first temperature is correlated to a planarizing endpoint. 3. The CMP planarizing pad of claim 1 wherein the fluid comprises a microencapsulated dye. 4. The CMP planarizing pad of claim 1 wherein the fluid is selected from a group consisting of leuco dyes, thermochromic liquid crystals, shear-sensitive liquid crystals, and luminophors. 5. A method of planarizing a workpiece, comprising: delivering a planarizing solution to a planarizing surface of a planarizing pad, the planarizing solution and the planarizing pad comprising a planarizing medium, the planarizing solution comprising a first thermally responsive fluid adapted to change color in response to a first temperature and a second thermally responsive fluid adapted to change color in response to a second temperature that is different from the first temperature, the planarizing medium including an abrasive; rubbing the workpiece against the planarizing medium; changing rubbing the workpiece against the planarizing medium in response to detecting the color change of the first thermally responsive fluid; and ceasing rubbing the workpiece against the planarizing medium in response to detecting the color change of the second thermally responsive fluid.