[미국특허]
Assembly for extracting heat from a housing for electronic equipment
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
H05K-005/00
F25D-023/12
H05K-007/20
출원번호
UP-0412430
(2006-04-27)
등록번호
US-7604535
(2009-11-10)
발명자
/ 주소
Germagian, Mark
Prunier, John
Olsen, Martin
출원인 / 주소
Wright Line, LLC
대리인 / 주소
Dingman, Brian M.
인용정보
피인용 횟수 :
52인용 특허 :
21
초록▼
An assembly for extracting heat from a housing for electronic equipment, the housing having a front, a back, two sides and a top. The assembly is defined by a back for the housing that defines an open area proximate the top, and an air passageway in fluid communication with the open area in the back
An assembly for extracting heat from a housing for electronic equipment, the housing having a front, a back, two sides and a top. The assembly is defined by a back for the housing that defines an open area proximate the top, and an air passageway in fluid communication with the open area in the back, to conduct heated air exiting the housing through the open area away from the housing.
대표청구항▼
What is claimed is: 1. An assembly comprising: a housing with an interior that is adapted to hold heat-generating electronic equipment, the housing comprising a generally rectangular vertical front portion, two generally rectangular vertical side portions coupled to the front portion, an essentiall
What is claimed is: 1. An assembly comprising: a housing with an interior that is adapted to hold heat-generating electronic equipment, the housing comprising a generally rectangular vertical front portion, two generally rectangular vertical side portions coupled to the front portion, an essentially solid, generally rectangular top portion coupled to the side portions and to the front portion, and an essentially solid, generally rectangular back portion coupled to the side portions; where the top portion defines a first opening leading to the housing interior, the first opening located at the back of the top portion, proximate the back portion; where the back portion defines a second opening leading to the housing interior, the second opening located at the top of the back portion, proximate the top portion; where the first opening is contiguous with the second opening; and a chimney external to the housing and comprising a bottom wall coupled to the back portion of the housing proximate the second opening, a front wall coupled to the top portion of the housing proximate the first opening, a back wall opposite the front wall, and two opposing side walls; where the chimney defines an air passageway that encompasses and is in fluid communication with the first and second openings, the air passageway comprising an inlet for taking in air leaving the housing through the first and second openings and an outlet for conducting the air out of the air passageway. 2. The assembly of claim 1 in which the second opening extends across at least a majority of the width of the back portion of the housing. 3. The assembly of claim 2 in which the second opening extends across substantially all of the width of the back portion of the housing. 4. The assembly of claim 1 further comprising an air-moving device in fluid communication with the air passageway. 5. The assembly of claim 4 in which the air-moving device is located in the air passageway. 6. The assembly of claim 4 in which the air-moving device is located at the intersection of the back portion of the housing and the air passageway. 7. The assembly of claim 1 in which the front portion of the housing is perforated. 8. The assembly of claim 7 in which the side portions of the housing are essentially solid. 9. The assembly of claim 8 in which at least a substantial portion of the top of the housing is available for routing of additional equipment. 10. The assembly of claim 1 in which the back portion of the housing comprises one or more doors, to provide access to the housing through the back. 11. The assembly of claim 1 further comprising an air-moving device in the chimney. 12. The assembly of claim 1 in which the chimney is located at least about eighty inches above the floor. 13. The assembly of claim 1 in which the chimney extends out from the back portion of the housing. 14. The assembly of claim 13 in which the chimney extends up after extending out from the back portion of the housing. 15. The assembly of claim 1 in which the chimney extends out at an angle of no more than about ninety degrees from the back portion of the housing. 16. A data center arrangement comprising: at least two electronic equipment racks spaced apart by at least about thirty-six inches, each rack comprising a generally rectangular vertical front portion, two generally rectangular vertical side portions coupled to the front portion, an essentially solid, generally rectangular top portion coupled to the side portions and to the front portion, and an essentially solid, generally rectangular back portion coupled to the side portions; where the top portion of each rack defines a first opening leading to the rack interior, the first opening located at the back of the top portion, proximate the back portion; where the back portion of each rack defines a second opening leading to the rack interior, the second opening located at the top of the back portion, proximate the top portion; where the first opening is contiguous with the second opening; and a chimney for each rack, each chimney external to the rack and comprising a bottom wall coupled to the back portion of the rack proximate the second opening, a front wall coupled to the top portion of the rack proximate the first opening, a back wall opposite the front wall, and two opposing side walls, where each chimney defines an air passageway that encompasses and is in fluid communication with the first and second openings, the air passageway comprising an inlet for taking in air leaving the rack through the first and second openings and an outlet for conducting the air out of the air passageway. 17. The data center arrangement of claim 16 further comprising an enclosed ceiling. 18. The data center arrangement of claim 17 in which the air passageways are in fluid communication with the enclosed ceiling. 19. The data center arrangement of claim 18 further comprising an air-cooling apparatus in fluid communication with the enclosed ceiling. 20. The data center arrangement of claim 19 further comprising means for providing cooled air from the air-cooling apparatus to the front of the racks. 21. An assembly comprising: a housing with an interior that is adapted to hold heat-generating electronic equipment, the housing comprising a generally rectangular vertical front portion, two generally rectangular vertical side portions coupled to the front portion, an essentially solid, generally rectangular top portion coupled to the side portions and to the front portion, and an essentially solid, generally rectangular back portion coupled to the side portions; where the top portion defines a first opening leading to the housing interior, the first opening located at the back of the top portion, proximate the back portion; where the back portion defines a second opening leading to the housing interior, the second opening located at the top of the back portion, proximate the top portion; where the second opening extends across substantially all of the width of the back portion of the housing; where the first opening is contiguous with the second opening; and a chimney external to the housing and comprising a bottom wall coupled to the back portion of the housing proximate the second opening, a front wall coupled to the top portion of the housing proximate the first opening, a back wall opposite the front wall, and two opposing side walls; where the chimney defines an air passageway that encompasses and is in fluid communication with the first and second openings, the air passageway comprising an inlet for taking in air leaving the housing through the first and second openings and an outlet for conducting the air out of the air passageway; and where the chimney extends out from the back portion of the housing at an angle, and extends up after extending out from the back portion of the housing.
Campbell,Levi A.; Chu,Ricahrd C.; Ellsworth, Jr.,Michael J.; Iyengar,Madhusudan K.; Schmidt,Roger R.; Simons,Robert E., Apparatus and method for facilitating cooling of an electronics rack by mixing cooler air flow with re-circulating air flow in a re-circulation region.
Belady, Christian L.; Larus, James R.; Reed, Danny A.; Borgs, Christian H.; Chayes, Jennifer Tour; Lobel, Ilan; Menache, Ishai; Nazerzadeh, Hamid; Jain, Navendu, Data center system that accommodates episodic computation.
Krietzman, William; Garza, Jr., Jose Arturo; Lewis, II, Richard Evans, Header panel assembly for preventing air circulation above electronic equipment enclosure.
Krietzman, William; Garza, Jr., Jose Arturo; Lewis, II, Richard Evans, Header panel assembly for preventing air circulation above electronic equipment enclosure.
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