초록 ▼

Provided are a heat sink and a memory module using the heat sink. In one embodiment, the heat sink includes a first and second guide pin respectively disposed in first and second heat spreaders placed around an object to be cooled. The first and second guide pins help prevent misalignment problems

Provided are a heat sink and a memory module using the heat sink. In one embodiment, the heat sink includes a first and second guide pin respectively disposed in first and second heat spreaders placed around an object to be cooled. The first and second guide pins help prevent misalignment problems from occurring between the first and second heat spreaders, as well, as helping prevent the first and second heat spreaders from contacting each other when the first and second heat spreaders are pressed by pressure applied from the outside.

대표청구항 ▼

What is claimed is: 1. A heat sink comprising: a first heat spreader facing and contacting a first component disposed on an upper surface of an object to be cooled and emitting heat from the first component; a second heat spreader disposed on a rear surface of the object to be cooled and facing and

What is claimed is: 1. A heat sink comprising: a first heat spreader facing and contacting a first component disposed on an upper surface of an object to be cooled and emitting heat from the first component; a second heat spreader disposed on a rear surface of the object to be cooled and facing and contacting a second component to emit heat from the second component; a first guide pin disposed in a first extension portion near both edges of the first heat spreader, inserted and fixed in an insertion hole corresponding to the first extension portion, and installed in the object to be cooled; a second guide pin facing the first guide pin, disposed in a second extension portion near both edges of the second heat spreader, inserted and fixed in the insertion hole corresponding to the second extension portion, and installed in the object to be cooled; and a coupling unit closely adhering and coupling the first and second heat spreaders to the object to be cooled, wherein the first and second guide pins are bending pins that are formed integrally with the first and second heat spreaders. 2. The heat sink of claim 1, wherein the first and second guide pins are separated a predetermined distance from each other in the insertion hole of the object to be cooled, and are forcibly inserted and fixed in the insertion hole of the object to be cooled. 3. The heat sink of claim 1, wherein the first and second extension portions do not face and contact the first and second components of the object to be cooled and correspond to the insertion hole of the object to be cooled. 4. The heat sink of claim 1, further comprising first and second guide pin supporting portions when the first and second guide pins are bending pins. 5. The heat sink of claim 1, wherein supporting bars are installed to face one another on a rear surface or at a side surface of the first and second heat spreaders to prevent the first and second heat spreaders from contacting the object to be cooled. 6. The heat sink of claim 1, wherein the coupling unit is a clip installed on a rear surface of the first and second heat spreaders. 7. The heat sink of claim 1, wherein thermal interface layers are interposed between the first component and the first heat spreader, and between the second component and the second heat spreader. 8. The heat sink of claim 1, wherein a third heat spreader is further installed on a center portion of the first heat spreader, facing and contacting a third component which generates heat at a higher temperature than the first component. 9. The heat sink of claim 8, wherein the third heat spreader has a higher heat transfer coefficient than the first heat spreader. 10. The heat sink of claim 8, wherein the first and second heat spreaders are formed of aluminum, and the third heat spreader is formed of copper. 11. A memory module comprising: a printed circuit board (PCB); a plurality of first semiconductor packages mounted on an upper surface of the PCB; a plurality of second semiconductor packages mounted on a rear surface of the PCB; a first heat spreader facing and contacting the plurality of first semiconductor packages and emitting heat from the first semiconductor packages; a second heat spreader contacting the second semiconductor packages and emitting heat from the second semiconductor packages; a first guide pin disposed in a first extension portion near both edges of the first heat spreader, inserted and fixed in an insertion hole corresponding to the first extension portion, and installed on the PCB; a second guide pin disposed in a second extension portion near both edges of the second heat spreader, facing the first guide pin and inserted and fixed in an insertion hole which corresponds to the second extension portion, and installed on the PCB; and a coupling unit closely adhering and coupling the first and second heat spreaders with the PCB, wherein the first and second guide pins are each bending pins formed integrally with the first and second heat spreaders. 12. The memory module of claim 11, wherein the first and second guide pins are separated from each other by a predetermined distance on the PCB and are forcibly inserted in the insertion hole of the PCB. 13. The memory module of claim 11, wherein the first and second extension portions do not face and contact the first and second semiconductor packages and correspond to the insertion hole of the PCB. 14. The memory module of claim 11, further comprising first and second guide pin supporting portions supporting the bending pins acting as the first and second guide pins. 15. The memory module of claim 11, wherein supporting bars are installed to face each other on a rear surface or at a side surface of the first and second heat spreaders such that the first and second heat spreaders do not contact the PCB. 16. The memory module of claim 11, wherein the coupling unit is a clip installed on a rear surface of the first and second heat spreaders. 17. The memory module of claim 11, wherein an advanced memory buffer (AMB) is mounted on a center portion of the surface of the PCB to transmit signals from the outside to the first and second semiconductor packages and to generate heat at a higher temperature than the first and second semiconductor packages. 18. The memory module of claim 17, wherein a third heat spreader is further installed on a center portion of the first heat spreader, facing and contacting the AMB, where the third heat spreader has a higher heat transfer coefficient than the second heat spreader. 19. A heat sink comprising: a first heat spreader disposed on a first surface of an object to be cooled, the object to be cooled including an insertion hole; a second heat spreader disposed on a second surface of the object to be cooled; a first spacer pin fixed in the first heat spreader and disposed in the insertion hole of the object to be cooled; and a second spacer pin fixed in the second heat spreader and disposed in the insertion hole of the object to be cooled, wherein the first and second spacer pins are configured to prevent the first heat spreader and the second heat spreader from contacting circuit structures mounted on the object to be cooled, wherein the first and second spacer pins are bending pins integrally formed with the first and second heat spreaders, respectively. 20. The heat sink of claim 19, further comprising a coupling unit configured to couple the first and second heat spreaders to the object to be cooled. 21. The heat sink of claim 19, further comprising first and second spacer pin supporting portions. 22. The heat sink of claim 19, wherein the first and second spacer pins are further configured to prevent the first heat spreader from contacting the second heat spreader. 23. The heat sink of claim 19, wherein the first and second spacer pins each comprise a first portion fixed to the respective heat spreader, a second portion extending toward the object to be cooled, and a third portion inserted into the insertion hole of the object to be cooled, where a cross-sectional area of the third portion is smaller than a cross-sectional area of the second portion to prevent the respective heat spreader from contacting circuit structures mounted on the object to be cooled.