Gimballed attachment for multiple heat exchangers
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
H05K-007/20
F28F-007/00
H01L-023/34
출원번호
UP-0800101
(2007-05-03)
등록번호
US-7616444
(2009-11-23)
발명자
/ 주소
Munch, Mark
Werner, Douglas E.
출원인 / 주소
Cooligy Inc.
대리인 / 주소
Haverstock & Owens LLP
인용정보
피인용 횟수 :
9인용 특허 :
287
초록▼
One or more heat exchangers are coupled to one or more heat sources using a single gimballed joining mechanism. The joining mechanism includes a gimbal plate and a gimbal joint. The gimbal joint enables independent application of a retention force to the heat exchanger as a single-point load. This r
One or more heat exchangers are coupled to one or more heat sources using a single gimballed joining mechanism. The joining mechanism includes a gimbal plate and a gimbal joint. The gimbal joint enables independent application of a retention force to the heat exchanger as a single-point load. This results in a balanced and centered application of the retaining force over the thermal interface area. The gimbal plate is mounted directly to a circuit board using spring means. The spring means regulate the amount of retention force directed through the gimbal joint to each heat exchanger. Because the gimbal joint is rotation-compliant, the two mating faces making up the thermal interface are forced into a parallel mate. In this manner, a high performance TIM interface is generated.
대표청구항▼
What is claimed is: 1. A joining system comprising: a. a plurality of heat generating devices mounted to a mounting apparatus; b. a plurality of heat exchangers, each heat exchanger coupled to a corresponding heat generating device; and c. a gimbal retention mechanism including a plurality of gimba
What is claimed is: 1. A joining system comprising: a. a plurality of heat generating devices mounted to a mounting apparatus; b. a plurality of heat exchangers, each heat exchanger coupled to a corresponding heat generating device; and c. a gimbal retention mechanism including a plurality of gimbal joints and one or more spring means, wherein the one or more spring means couple the gimbal retention mechanism to the mounting apparatus, and the plurality of gimbal joints couple the gimbal retention mechanism to the plurality of heat exchangers thereby coupling each heat exchanger to the corresponding heat generating device. 2. The joining system of claim 1 wherein the gimbal retention mechanism and each gimbal joint are configured such that each heat exchanger is independently planarized to the corresponding heat generating device. 3. The joining system of claim 1 wherein the plurality of heat exchangers are comprised of the group consisting of heat sinks, extruded fin heat sinks, crimped fin heat sinks, heat pipe assemblies, fluid-based heat exchangers, cold plates, injection molded heat sinks, forged heat sinks, vapor chambers, thermal siphons, or any combination of one or more thereof. 4. The joining system of claim 1 wherein each gimbal joint comprises a single-point contact element directed outward from the gimbal retention mechanism, and each heat exchanger includes a receiving point to mate to the single-point contact element. 5. The joining system of claim 4 wherein the gimbal retention mechanism further comprises a post coupled to the single-point contact element. 6. The joining system of claim 5 wherein a position of the post is configured to be adjusted. 7. The joining system of claim 4 wherein the single-point contact element is selected from a group consisting of a ball, a hemispherical surface, a point, and an ellipsoid. 8. The joining system of claim 4 wherein the receiving point comprises a depression in a mating surface of the heat exchanger. 9. The joining system of claim 4 wherein the receiving point comprises an opening in a mating surface of the heat exchanger, wherein a width of the opening is smaller than a width of the single-point contact element. 10. The joining system of claim 1 further comprising a plurality of adapter plates, each adapter plate is coupled to a corresponding heat exchanger, wherein each gimbal joint is coupled to the adapter plate of the corresponding heat exchanger. 11. The joining system of claim 10 wherein each gimbal joint comprises a single-point contact element directed outward from the gimbal retention mechanism, and each adapter plate includes a receiving point to mate to the single-point contact element. 12. The joining system of claim 11 wherein a position of the receiving point on each adapter plate coincides to a center position on a thermal contact surface of each corresponding heat exchanger with the corresponding heat generating device. 13. The joining system of claim 1 wherein each heat exchanger is coupled to the corresponding heat generating device via a thermal interface. 14. The joining system of claim 13 wherein the one or more spring means are configured to apply a retaining force, which is directed through each gimbal joint to the corresponding heat exchanger, thereby forcing each heat exchanger toward the corresponding heat generating device to form the thermal interface. 15. The joining system of claim 14 wherein the one or more spring means are configured to regulate the retaining force applied to each heat exchanger. 16. A joining system comprising: a. a heat generating device mounted to a mounting apparatus; b. a heat rejector coupled to the heat generating device, wherein the heat rejector includes a plurality of fins; c. an adapter plate coupled to a first end of one or more of the plurality of fins; and d. a gimbal retention mechanism including a gimbal joint and one or more spring means, wherein the gimbal joint is coupled to the adapter plate and the one or more spring means are coupled to the mounting apparatus, thereby coupling the heat rejector to the heat generating device. 17. The joining system of claim 16 wherein the heat rejector comprises a heat sink. 18. The joining system of claim 16 wherein the gimbal joint comprises a single-point contact element directed outward from the gimbal retention mechanism, and the adapter plate includes a receiving point to mate to the single-point contact element. 19. The joining system of claim 18 wherein a position of the receiving point on the adapter plate coincides to a center position on a thermal contact surface of the heat rejector with the heat generating device. 20. The joining system of claim 16 wherein the adapter plate includes two or more extensions, each extension is configured to mate with the first end of one of the plurality of fins thereby laterally stabilizing the adapter plate relative to the heat rejector. 21. The joining system of claim 16 the gimbal joint is configured such that the heat rejector self-planarizes to the heat generating device. 22. The joining system of claim 16 wherein the heat rejector is coupled to the heat generating device via a thermal interface. 23. The joining system of claim 22 wherein the one or more spring means are configured to apply a retaining force, which is directed through the gimbal joint to the heat rejector, thereby forcing the heat rejector toward the heat generating device to form the thermal interface. 24. The joining system of claim 23 wherein the one or more spring means are configured to regulate the retaining force applied to the heat rejector. 25. A joining system comprising: a. a heat generating device mounted to a mounting apparatus; b. a heat pipe assembly coupled to the heat generating device, wherein the heat pipe assembly includes one or more heat pipes, and a plurality of fins coupled to the one or more heat pipes; and c. a gimbal retention mechanism including a gimbal joint and one or more spring means, wherein the gimbal joint is coupled to the heat pipe assembly and the one or more spring means are coupled to the mounting apparatus, thereby coupling the heat pipe assembly to the heat generating device. 26. The joining system of claim 25 wherein the heat pipe assembly further comprises a heat spreader coupled to the one or more heat pipes, wherein the heat spreader is coupled to the heat generating device. 27. The joining system of claim 25 wherein the gimbal joint comprises a single-point contact element directed outward from the gimbal retention mechanism, and the heat rejector includes a receiving point to mate to the single-point contact element. 28. The joining system of claim 27 wherein a position of the receiving point on the heat pipe assembly coincides to a center position on a thermal contact surface of the heat pipe assembly with the heat generating device. 29. The joining system of claim 25 further comprising an adapter plate coupled to a first end of each of the one or more heat pipes, wherein the gimbal joint is coupled to the adapter plate. 30. The joining system of claim 29 wherein the gimbal joint comprises a single-point contact element directed outward from the gimbal retention mechanism, and the adapter plate includes a receiving point to mate to the single-point contact element. 31. The joining system of claim 30 wherein a position of the receiving point on the adapter plate coincides to a center position on a thermal contact surface of the heat pipe assembly with the heat generating device. 32. The joining system of claim 29 wherein the adapter plate includes one or more mating features, one mating feature for each one of the one or more heat pipes, and each mating feature is configured to mate with the first end of one of the one or more heat pipes thereby laterally stabilizing the adapter plate relative to the heat pipe assembly. 33. The joining system of claim 26 wherein the gimbal joint comprises a single-point contact element directed outward from the gimbal retention mechanism, and heat spreader includes a receiving point to mate to the single-point contact element. 34. The joining system of claim 33 wherein a position of the receiving point on the heat spreader coincides to a center position on a thermal contact surface of the heat spreader. 35. The joining system of claim 33 wherein the gimbal retention mechanism further comprises a post coupled to the single-point contact element. 36. The joining system of claim 35 wherein a position of the post is configured to be adjusted. 37. The joining system of claim 33 wherein the single-point contact element is selected from a group consisting of a ball, a hemispherical surface, a point, and an ellipsoid. 38. The joining system of claim 33 wherein the receiving point comprises a depression in a mating surface of the heat spreader. 39. The joining system of claim 33 wherein the receiving point comprises an opening in a mating surface of the heat spreader, wherein a width of the opening is smaller than a width of the single-point contact element. 40. The joining system of claim 26 further comprising an adapter plate coupled to the heat spreader, wherein the gimbal joint is coupled to the adapter plate. 41. The joining system of claim 40 wherein the gimbal joint comprises a single-point contact element directed outward from the gimbal retention mechanism, and the adapter plate includes a receiving point to mate to the single-point contact element. 42. The joining system of claim 41 wherein a position of the receiving point on the adapter plate coincides to a center position on a thermal contact surface of the heat spreader. 43. The joining system of claim 40 wherein the adapter plate includes one or more mating features configured to mate with the heat spreader thereby laterally stabilizing the adapter plate relative to the heat spreader. 44. The joining system of claim 26 the gimbal joint is configured such that the heat spreader self-planarizes to the heat generating device. 45. The joining system of claim 26 wherein the heat spreader is coupled to the heat generating device via a thermal interface. 46. The joining system of claim 45 wherein the one or more spring means are configured to apply a retaining force, which is directed through the gimbal joint to the heat spreader, thereby forcing the heat spreader toward the heat generating device to form the thermal interface. 47. The joining system of claim 46 wherein the one or more spring means are configured to regulate the retaining force applied to the heat spreader. 48. A joining system comprising: a. a heat generating device mounted to a mounting apparatus; b. a heat exchanger coupled to the heat generating device, wherein the heat exchanger includes a plurality of fins; and c. a gimbal retention mechanism including a gimbal joint and a plurality of mounting stands, each mounting stand includes a spring means, wherein the gimbal joint is coupled to the heat exchanger and each mounting stand is coupled to the mounting apparatus, thereby coupling the heat exchanger to the heat generating device. 49. The joining system of claim 48 wherein the gimbal joint comprises a single-point contact element directed outward from the gimbal retention mechanism, and the heat exchanger includes a receiving point to mate to the single-point contact element. 50. The joining system of claim 49 wherein the gimbal retention mechanism further comprises a post coupled to the single-point contact element. 51. The joining system of claim 50 wherein a position of the post is configured to be adjusted. 52. The joining system of claim 49 wherein the single-point contact element is selected from a group consisting of a ball, a hemispherical surface, a point, and an ellipsoid. 53. The joining system of claim 49 wherein the receiving point comprises a depression in a mating surface of the heat exchanger. 54. The joining system of claim 49 wherein the receiving point comprises an opening in a mating surface of the heat exchanger, wherein a width of the opening is smaller than a width of the single-point contact element. 55. The joining system of claim 48 further comprising an adapter plate coupled to a first end of one or more of the plurality of fins, wherein the gimbal joint is coupled to the adapter plate. 56. The joining system of claim 55 wherein the gimbal joint comprises a single-point contact element directed outward from the gimbal retention mechanism, and the adapter plate includes a receiving point to mate to the single-point contact element. 57. The joining system of claim 56 wherein a position of the receiving point on the adapter plate coincides to a center position on a thermal contact surface of the heat exchanger with the heat generating device. 58. The joining system of claim 55 wherein the adapter plate includes two or more extensions, each extension is configured to mate with the first end of one of the plurality of fins thereby laterally stabilizing the adapter plate relative to the heat exchanger. 59. The joining system of claim 48 the gimbal joint is configured such that the heat exchanger self-planarizes to the heat generating device. 60. The joining system of claim 48 wherein the heat exchanger is coupled to the heat generating device via a thermal interface. 61. The joining system of claim 60 wherein each spring means is configured to apply a retaining force, which is directed through the gimbal joint to the heat exchanger, thereby forcing the heat exchanger toward the heat generating device to form the thermal interface. 62. The joining system of claim 61 wherein each spring means is configured to regulate the retaining force applied to the heat exchanger.
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Corman Ned E. (Harrisburg PA) Kandybowski Steven J. (Tower City PA) Scheingold William S. (Palmyra PA) Youngfleish Frank C. (Harrisburg PA), Active device substrate connector having a heat sink.
McDunn Kevin J. (Lake in the Hills IL) Limper-Brenner Linda (Glenview IL) Press Minoo D. (Schaumburg IL), Apparatus and method for shielding an electronic module from electromagnetic radiation.
Kenny, Jr., Thomas William; Goodson, Kenneth E.; Santiago, Juan G.; Everett, Jr., George Carl, Apparatus for conditioning power and managing thermal energy in an electronic device.
Kenny, Jr.,Thomas William; Goodson,Kenneth E.; Santiago,Juan G.; Everett, Jr.,George Carl, Apparatus for conditioning power and managing thermal energy in an electronic device.
Sanwo Ikuo J. (San Marcos CA) Flavin John (San Diego CA), Apparatus for containing and cooling an integrated circuit device having a thermally insulative positioning member.
Messina Gaetano P. (Hopewell Junction NY) Brewster Robert A. (Poughkeepsie NY) Kara Theodore J. (Poughkeepsie NY) Song Seaho (Highland NY), Apparatus for cooling integrated circuit chips.
Love David G. (Pleasanton CA) Moresco Larry L. (San Carlos CA) Horine David A. (Los Altos CA) Wang Wen-chou V. (Cupertino CA) Wheeler Richard L. (San Jose CA) Boucher Patricia R. (Mountain View CA) M, Apparatus for cooling semiconductor chips in multichip modules.
Wright David Q. ; Walker Mike ; Robinson Karl M., Apparatus for separating wafers from polishing pads used in chemical-mechanical planarization of semiconductor wafers.
Fahey Albert J. (Pleasant Valley NY) Messina Gaetano P. (Hopewell Junction NY) Pavelka John B. (Beacon NY) Sherif Raed A. (Pleasant Valley NY), Blind hole cold plate cooling system.
Dereje Agonafer ; Richard C. Chu ; Michael J. Ellsworth, Jr. ; Robert E. Simons, Cavity plate and jet nozzle assemblies for use in cooling an electronic module, and methods of fabrication thereof.
Faneuf, Barrett M.; De Lorenzo, David S., Chassis-level thermal interface component for transfer of heat from an electronic component of a computer system.
Blyablin, Alexandr Alexandrovich; Kandidov, Anton Valerievich; Timofeev, Mikhail Arkadievich; Seleznev, Boris Vadimovich; Pilevsky, Andrei Alexandrovich; Rakhimov, Alexandr Tursunovich; Suetin, Nikol, Cold-emission film-type cathode and method for producing the same.
Berry, William E.; De Lorenzo, David S.; Montgomery, Stephen W.; Faneuf, Barrett M., Computer system which locks a server unit subassembly in a selected position in a support frame.
Chu, Richard C.; Ellsworth, Jr., Michael J.; Simons, Robert E., Conic-sectioned plate and jet nozzle assembly for use in cooling an electronic module, and methods of fabrication thereof.
Schulz-Harder Jurgen,DEX ; Exel Karl,DEX ; Medick Bernd,DEX ; Bauer-Schulz-Harder Veronika,DEX, Cooler or heat sink for electrical components or circuits and an electrical circuit with this heat sink.
Chu Richard C. (Poughkeepsie NY) Goth Gary F. (Pleasant Valley NY) Messina Gaetano P. (Hopewell Junction NY) Moran Kevin P. (Wappingers Falls NY) Zumbrunnen Michael L. (Poughkeepsie NY), Cooling by use of multiple parallel convective surfaces.
Jackson, Timothy E.; Nie, Tao; Obbish, Steve; Schloemp, II, John F.; Church, William Robert; Boles, Michael W.; Klinger, Gary O.; Terry, Christopher R., Corrosion resistant powder coated metal tube and process for making the same.
Galyon George T. (Fishkill NY) Jordhamo George M. (Wappingers Falls NY) Moran Kevin P. (Wappingers Falls NY) Zumbrunnen Michael L. (Poughkeepsie NY), Cross-hatch flow distribution and applications thereof.
Paul Phillip H. ; Rakestraw David J. ; Arnold Don W. ; Hencken Kenneth R. ; Schoeniger Joseph S. ; Neyer David W., Electrokinetic high pressure hydraulic system.
Paul, Phillip H.; Rakestraw, David J.; Arnold, Don W.; Hencken, Kenneth R.; Schoeniger, Joseph S.; Neyer, David W., Electrokinetic high pressure hydraulic system.
Richard C. Chu ; Michael J. Ellsworth, Jr. ; Robert E. Simons, Electronic module with integral refrigerant evaporator assembly and control system therefore.
Chu Richard C. (Poughkeepsie NY) Ellsworth ; Jr. Michael J. (Poughkeepsie NY) Goth Gary F. (Pleasant Valley NY) Simons Robert E. (Poughkeepsie NY) Zumbrunnen Michael L. (Poughkeepsie NY), Enhanced multichip module cooling with thermally optimized pistons and closely coupled convective cooling channels, and.
Cannell, Michael J.; Cooley, Roger; Garman, Richard W.; Green, Geoffrey; Harrison, Peter N.; Walters, Joseph D., Fluid-cooled heat sink with turbulence-enhancing support pins.
Phillips Richard J. (Billerica MA) Glicksman Leon R. (Lynnfield MA) Larson Ralph (Bolton MA), Forced-convection, liquid-cooled, microchannel heat sinks.
Matzke Carolyn M. ; Ashby Carol I. H. ; Bridges Monica M. ; Manginell Ronald P., Formation of microchannels from low-temperature plasma-deposited silicon oxynitride.
John Lee Colbert ; John Saunders Corbin, Jr. ; Roger Duane Hamilton ; Danny E. Massey ; Arvind Kumar Sinha, Heat pipe heat sink assembly for cooling semiconductor chips.
Pease Roger F. (Stanford CA) Tuckerman David B. (Stanford CA) Swanson Richard M. (Los Altos CA), Heat sink and method of attaching heat sink to a semiconductor integrated circuit and the like.
Rio Pascal (Bois Colombes FRX) Magnenet Patrick (Thorigny-sur-Marne FRX), Heatsink for contact with multiple electronic components mounted on a circuit board.
Chu Richard C. (Poughkeepsie NY) Ellsworth ; Jr. Michael J. (Poughkeepsie NY) Simons Robert E. (Poughkeepsie NY) Vader David T. (New Paltz NY), Intersecting flow network for a cold plate cooling system.
Braun Robert E. (Norristown PA) Jones Richard H. (Wayne PA) Sprenkle George J. (Phoenixville PA) Stopper Herbert (Orchard Lake MI), Island assembly employing cooling means for high density integrated circuit packaging.
Mehta, Tammy Burd; Kopf-Sill, Anne R.; Parce, J. Wallace; Chow, Andrea W.; Bousse, Luc J.; Knapp, Michael R.; Nikiforov, Theo T.; Gallagher, Steve, Manipulation of microparticles in microfluidic systems.
Tustaniwskyi,Jerry Ihor; Babcock,James Wittman; Kuo,Henry Jen, Mechanical assembly for regulating the temperature of an electronic device, having a spring with one slideable end.
Lomolino ; Sr. Paul A. (Danville CA) Lomolino ; Jr. Paul A. (Tracy CA) Lean Grace A. (Livermore CA) Burns Patricia L. (San Jose CA), Method and apparatus for a self contained heat exchanger.
Kenny,Thomas W.; Munch,Mark; Zhou,Peng; Shook,James Gill; Upadhya,Girish; Goodson,Kenneth; Corbin,David, Method and apparatus for flexible fluid delivery for cooling desired hot spots in a heat producing device.
Charlton Richard Gordon (Essex Junction VT) Correia George Charles (Essex Junction VT) Couture Mark Andrew (Milton VT) Hill Gary Ray (Jericho VT) Horsford Kibby Barth (Charlotte VT) Ingraham Anthony , Method and apparatus for testing integrated circuit chips.
Tuckerman David B. (Stanford CA) Pease Roger F. W. (Stanford CA), Method and means for improved heat removal in compact semiconductor integrated circuits.
Tuckerman David B. (Stanford CA) Pease Roger F. W. (Stanford CA), Method and means for improved heat removal in compact semiconductor integrated circuits and similar devices utilizing co.
Buller Marvin L. (Austin TX) McNelis Barbara J. (Austin TX) Snyder Campbell H. (Austin TX), Method for attaching heat sink to plastic packaged electronic component.
Tonkovich, Anna Lee Y.; Wang, Yong; Fitzgerald, Sean P.; Marco, Jennifer L.; Roberts, Gary L.; VanderWiel, David P.; Wegeng, Robert S., Method for gas phase reactant catalytic reactions.
Schwiebert Matthew K. ; Campbell Donald T. ; Heydinger Matthew ; Kraft Robert E. ; Vander Plas Hubert A., Method of bumping substrates by contained paste deposition.
Hamilton Robin E. ; Kennedy Paul G. ; Ostop John ; Baker Martin L. ; Arlow Gregory A. ; Golombeck John C. ; Fagan ; Jr. Thomas J., Method of extracting heat from a semiconductor body and forming microchannels therein.
Layton Wilber Terry (San Diego CA) Morange Blanquita Ortega (San Diego CA) Torres Angela Marie (Vista CA) Roecker James Andrew (Escondido CA), Method of fabricating an integrated circuit package having a liquid metal-aluminum/copper joint.
Bezama Raschid J. ; Casey Jon A. ; Pavelka John B. ; Pomerantz Glenn A., Method of forming a multilayer electronic packaging substrate with integral cooling channels.
Hofmann, Jim; Sabde, Gundu M.; Kramer, Stephen J.; Moore, Scott E., Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies.
Hamilton Robin E. ; Kennedy Paul G. ; Ostop John ; Baker Martin L. ; Arlow Gregory A. ; Golombeck John C. ; Fagan ; Jr. Thomas J, Microchannel cooling of high power semiconductor devices.
Swift Gregory W. (Los Alamos NM) Migliori Albert (Santa Fe NM) Wheatley John C. (Los Alamos NM), Microchannel crossflow fluid heat exchanger and method for its fabrication.
Drost Monte K. ; Wegeng Robert S. ; Friedrich Michele ; Hanna William T. ; Call Charles J. ; Kurath Dean E., Microcomponent assembly for efficient contacting of fluid.
Wegeng Robert S. ; Drost M. Kevin ; Call Charles J. ; Birmingham Joseph G. ; McDonald Carolyn Evans ; Kurath Dean E. ; Friedrich Michele, Microcomponent chemical process sheet architecture.
Frieser Rudolf G. (Poughkeepsie NY) Reeber Morton D. (Shrub Oak NY), Nucleate boiling surface for increasing the heat transfer from a silicon device to a liquid coolant.
Zanzucchi Peter J. (Lawrenceville NJ) Cherukuri Satyam C. (Cranbury NJ) McBride Sterling E. (Lawrenceville NJ), Partitioned microelectronic and fluidic device array for clinical diagnostics and chemical synthesis.
Diggelmann Hans (Neuenegg CHX) Ulrich Bohdan (Kehrsatz CHX), Process and apparatus for dissipating the heat loss of at least one assembly of electrical elements.
Galambos, Paul C.; Okandan, Murat; Montague, Stephen; Smith, James H.; Paul, Phillip H.; Krygowski, Thomas W.; Allen, James J.; Nichols, Christopher A.; Jakubczak, II, Jerome F., Surface-micromachined microfluidic devices.
Zare Richard N. (Stanford CA) Huang Xiaohua (Mountain View CA) Ohms Jack I. (Palo Alto CA), System for measuring electrokinetic properties and for characterizing electrokinetic separations by monitoring current i.
Kenny, Jr., Thomas William; Goodson, Kenneth E.; Santiago, Juan G.; Kim, John J.; Chaplinsky, Robert C.; Everett, Jr., George Carl, System including power conditioning modules.
Felps Jimmie D. (Colorado Springs CO) Leri Frank P. (Pueblo CO) Schott Donald E. (Colorado Springs CO) Figge Timothy A. (Colorado Springs CO), Universal hybrid mounting system.
Kaltenbach Patrick (Bischweier DEX) Swedberg Sally A. (Los Altos CA) Witt Klaus E. (Keltern DEX) Bek Fritz (Waldbronn DEX) Mittelstadt Laurie S. (Belmont CA), Use of temperature control devices in miniaturized planar column devices and miniaturized total analysis systems.
Chow Calvin Y. H. ; Parce J. Wallace, Variable control of electroosmotic and/or electrophoretic forces within a fluid-containing structure via electrical forc.
Chow Calvin Y. H. ; Parce J. Wallace, Variable control of electroosmotic and/or electrophoretic forces within a fluid-containing structure via electrical forc.
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