초록 ▼

The present invention is directed to phosphorus containing (or "halogen free") flame retardant photoimagable compositions useful as a coverlay material in a flexible electronic circuitry package. These compositions are generally photosensitive and comprise phosphorus containing acrylates and phospho

The present invention is directed to phosphorus containing (or "halogen free") flame retardant photoimagable compositions useful as a coverlay material in a flexible electronic circuitry package. These compositions are generally photosensitive and comprise phosphorus containing acrylates and phosphorus-containing photo-initiators mixed with a polymer binder. The compositions of the present invention typically comprise elemental phosphorus in an amount between, and including, any two of the following numbers 2.0, 2.2, 2.4, 2.6, 2.8, 3.0, 3.2, 3.4, 3.6, 3.8, 4.0, 4.2, 4.4, 4.6, 4.8, 5.0, 5.2, 5.4, 5.6, 5.8 and 6.0 weight percent.

대표청구항 ▼

What is claimed is: 1. A photosensitive circuit coverlay composition consisting essentially of: a. an unsaturated phosphorus-containing monomer said monomer being a mono-functional or multi-functional methacrylate or acrylate being present in an amount between and including 20 and 70 weight percent

What is claimed is: 1. A photosensitive circuit coverlay composition consisting essentially of: a. an unsaturated phosphorus-containing monomer said monomer being a mono-functional or multi-functional methacrylate or acrylate being present in an amount between and including 20 and 70 weight percent of the total composition, b. a phosphorus containing photo-initiator present in an amount between and including 2 and 18 weight percent of the total composition, c. a polymer binder having an unsaturated bond, a carboxylic acid group, or a hydroxyl group, and d. a blocked isocyanate or blocked polyisocyanate thermal crossliniking agent, wherein the total composition has a halogen content of less than 100 parts per million based upon weight and has a phosphorus content in an amount between, and including 2.0, and 6.0 weight percent. 2. A composition in accordance with claim 1 wherein the polymer binder is an acrylic, or epoxy modified acrylic polymer. 3. A composition in accordance with claim 1 wherein the phosphorus containing monomer is an acrylate that, under radical polymerization, forms a three-dimensional polymer network. 4. A composition in accordance with claim 1, wherein the phosphorus containing monomer is present in an amount between and including 30 and 60 weight percent of the total composition. 5. A composition in accordance with claim 1 wherein the phosphorus containing photo-initiator comprises a phosphine oxide or acrylphosphine oxide. 6. A composition in accordance with claim 1 wherein the phosphorus containing photo-initiator has the chemical structure, 7. A composition in accordance with claim 1 wherein the phosphorus containing photo-initiator has the chemical structure, 8. A composition in accordance with claim 1 wherein the phosphorus containing photo-initiator is present in an amount between and including the following numbers 4.0 and 8.0 weight percent of the total composition. 9. A composition in accordance with claim 1 wherein the thermal crosslinking agent (d) is a blocked polyisocyanate that upon heating forms a polyisocyanate selected from the group consisting of toluene diisocyanate, isophorone diisocyanate, 1,4-naphthalene diisocyanate, 1,6-hexamethylene diisocyanate, tetramethyl xylene diisocyanate, bis (4-isocyanatocyclohexyl) methane. 10. A composition in accordance with claim 1 further consisting essentially of a phosphorus containing material prepared from a phosphorus containing material further comprising a hydroxyl group. 11. A composition in accordance with claim 10 wherein the phosphorus containing material, under thermal reaction or crossliniking, can polymerize with the phosphorus containing acrylate and polymer binder. 12. A composition in accordance with claim 1 further consisting essentially of a filler selected from the group consisting of aluminum hydroxide, magnesium hydroxide, zinc borate, micro crystalline cellulose, micro crystalline silicas, clays, alumina, bentonite, kalonites, attapultites, montmorillonites, silicon oxide, titanium oxide, carbon black, zinc oxide, melamine polyphosphate, melamine cyanurate, and ammonium polyphosphate, wherein the filler has a particle size from 5 nanometers to 10,000 nanometers. 13. A composition in accordance with claim 1 further consisting essentially of a photo-active component wherein the photo active component is selected from the group consisting of photo-sensitizers, photosolubilizers, photodesensitizer, photoinhibitor, phototackifier, photodetackifier, a component that is photodegradable, photochromic, photoreducible, photo-oxidizable, photoadhesive, photoreleaseable, photomagnetic, photodemagnetic, photoconductive, photoinsulative, combinations thereof, and materials that change refractive index upon exposure to actinic radiation. 14. A composition in accordance with claim 1 further consisting essentially of an adhesion promoter. 15. A composition in accordance with claim 14 wherein the adhesion promoter is selected from the group consisting of 2-amino-5-mercaptothiophene, 5-amino-1,3,4-thiodiazole-2-thiol, benzotriazole, 5-chloro-benzotriazole, 1-chloro-benzotriazole, 1-carboxy-benzotriazole, 1-hydroxy-benzotriazole, 2-mercaptobenzoxazole, 1H-1,2,4-triazole-3-thiol and mercaptobenzimidazole. 16. A composition in accordance with claim 1 wherein the composition is flame retardant according to UL 94 Thin Material Vertical Burning Test 94VTM-0, UL 94 Thin Material Vertical Burning Test 94VTM-1 or UL 94 Thin Material Vertical Burning Test 94VTM-2. 17. A composition in accordance with claim 1 wherein the polymer binder is an oligomer.