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특허 상세정보

Assembly having a component enclosed by a housing, and device and method used in its manufacture

국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판) B29C-070/68    B29C-070/00    B29C-045/14    B29C-045/22    B29C-045/20   
미국특허분류(USC) 425/129.1; 425/110; 425/120
출원번호 UP-0361405 (2006-02-23)
등록번호 US-7635258 (2010-01-08)
우선권정보 DE-101 33 151(2001-07-07)
발명자 / 주소
출원인 / 주소
대리인 / 주소
    Kenyon & Kenyon LLP
인용정보 피인용 횟수 : 0  인용 특허 : 13
초록

To provide an assembly which is as small as possible which contains a well-protected component and effectively dissipates heat, and to provide a device and a method for use in the rapid manufacture of such an assembly, an assembly includes a component and a housing from which the component is partially separated by narrow casting gaps filled with a casting compound containing a relatively large amount of filler. For the manufacture of such an assembly, a device is used for filling with casting compound and which includes a mounting for securing the assem...

대표
청구항

What is claimed is: 1. A device for filling casting gaps during manufacture of an assembly, comprising: a mounting to securely hold the assembly in a position that, while the casting gaps are filled with a crosslinkable casting compound that contains a filler, permits air to escape from the casting gaps, in dependence upon a filling rate, through an opening in an assembly housing during filling; at least one supply line, for the crosslinkable casting compound, that opens into the casting gaps; at least one supply container for the crosslinkable casting ...

이 특허에 인용된 특허 (13)

  1. Lay Kurt (Rottenburg DEX) Sailer Erwin (Altdorf DEX). Arrangement for repairing stone impact damages at windshields made of multi-layer safety glass. USP1989064840551.
  2. Dam Chuong Q. (Peoria IL) Kelley Kurtis C. (Washington IL). Coating surrounding a piezoelectric solid state motor stack. USP1993065218259.
  3. Kaida, Hiroaki. Electronic component and method for forming substrate electrode of the same. USP2004086784598.
  4. Dreyer Volker,DEX ; Werner Thomas,DEX. Electronics enclosure. USP2000046051783.
  5. Gotoh Masashi,JPX ; Kanazawa Jitsuo,JPX ; Yamamoto Shuichiro,JPX. Encapsulated surface mounting electronic part. USP2001086281436.
  6. Nguyen Tan ; Mitchell Craig S. ; Distefano Thomas H.. Encapsulation of microelectronic assemblies. USP2001126329224.
  7. Amador Gonzalo ; Hotchkiss Gregory B.. Low stress method and apparatus of underfilling flip-chip electronic devices. USP2001066245583.
  8. Daidai Muneyuki (Toyama JPX) Sumita Manabu (Toyama JPX). Method for manufacturing a piezoelectric resonant component. USP1997015593721.
  9. Karavakis Konstantine (Coram NY) Distefano Thomas H. (Monte Sereno CA) Smith ; Jr. John W. (Austin TX) Mitchell Craig (San Jose CA). Method of encapsulating die and chip carrier. USP1997095663106.
  10. Koji Morita JP; Masanobu Sugimori JP; Muneyuki Daidai JP. Piezoelectric component and method of manufacturing same. USP2002026344706.
  11. Wang Kuo K. ; Han Sejin. Pressurized underfill encapsulation of integrated circuits. USP1998105817545.
  12. Squitieri Vincent (Billerica MA). Thermally conductive materials. USP1989094869954.
  13. Boyaud,Marie France; Dufort,Catherine; Paquet,Marie Claude; Tetreault,Real. Transfer molding of integrated circuit packages. USP2006016988882.