초록 ▼

In a method for producing an electronic component, a first doped connection region and a second doped connection region are formed on or above a substrate; a body region is formed between the first doped connection region and the second doped connection region; at least two gate regions separate fro

In a method for producing an electronic component, a first doped connection region and a second doped connection region are formed on or above a substrate; a body region is formed between the first doped connection region and the second doped connection region; at least two gate regions separate from one another are formed on or above the body region; at least one partial region of the body region is doped by means of introducing dopant atoms, wherein the dopant atoms are introduced into the at least one partial region of the body region through at least one intermediate region formed between the at least two separate gate regions.

대표청구항 ▼

What is claimed is: 1. A method for producing an electronic component, the method comprising: forming a first doped connection region and a second doped connection region on or above a substrate; forming a body region between the first doped connection region and the second doped connection region;

What is claimed is: 1. A method for producing an electronic component, the method comprising: forming a first doped connection region and a second doped connection region on or above a substrate; forming a body region between the first doped connection region and the second doped connection region; forming at least two gate regions separate from one another on or above the body region; and doping at least one partial region of the body region by means of introducing dopant atoms, wherein the dopant atoms are introduced into the at least one partial region of the body region through at least one intermediate region formed between the at least two separate gate regions. 2. The method of claim 1, wherein the electronic component comprises a fin structure. 3. The method of claim 1, wherein the electronic component comprises a fully depleted silicon-on-insulator structure. 4. The method of claim 1, wherein the body region is formed as a region with intrinsic conductivity. 5. The method of claim 1, wherein the dopant atoms are introduced into the at least one partial region of the body region using an ion implantation method. 6. The method of claim 5, wherein one or more of the following ion implantation methods is or are used for introducing the dopant atoms: a halo implantation method; a Vt implantation method; an HDD implantation method; and an LDD implantation method. 7. The method of claim 1, wherein at least one of the at least two gate regions has a length of approximately 5 nm to 200 nm. 8. The method of claim 1, wherein at least two of the at least two gate regions are separate from one another by a distance of approximately 5 nm to 500 nm. 9. The method of claim 1, wherein electrical contact is made with at least one of the at least two gate regions. 10. The method of claim 1, wherein the first connection region has a first conductivity type; the second connection region has a second conductivity type, which is opposite to the first conductivity type; at least one first doped partial region and at least one second doped partial region are formed in the body region, wherein the at least one first doped partial region comprises the second conductivity type, and wherein the at least one second doped partial region comprises the first conductivity type; and the at least one first doped partial region is formed between the first connection region and the at least one second doped partial region and the at least one second doped partial region is formed between the at least one first doped partial region and the second connection region in such a way that a thyristor is formed. 11. The method of claim 10, wherein the first connection region is p-doped; the second connection region is n-doped; a plurality of n-doped first partial regions and a plurality of p-doped second partial regions are formed in the body region. 12. The method of claim 11, wherein, with the aid of the plurality of n-doped first partial regions, a diluted n-doped first body partial region is formed in the body region, and wherein, with the aid of the plurality of p-doped second partial regions, a diluted p-doped second body partial region is formed in the body region. 13. The method of claim 12, wherein the at least two gate regions are formed separate from one another such that at least one first gate region is formed on or above the first body partial region has a length of approximately 5 nm to 200 nm, and at least one second gate region is formed on or above the second body partial region has a length of approximately 5 nm to 200 nm. 14. The method of claim 10, wherein two adjacent gate regions comprise a distance of approximately 5 nm to 500 nm. 15. The method of claim 1, wherein the first connection region, the second connection region and the at least one doped partial region have the same conductivity type; with the aid of the at least one doped partial region, a diluted doped first body partial region is formed in the body region, wherein the first body partial region serves as an extended drain region; and the first body partial region is formed such that a second body partial region is formed between the first body partial region and the second connection region, wherein the second body partial region serves as a channel region, such that a drain-extended MOS field-effect transistor is formed. 16. The method of claim 15, wherein the at least two gate regions formed separate from one another are formed such that at least one gate region formed on or above the first body partial region has a length of approximately 5 nm to 200 nm.