IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
UP-0233772
(2008-09-19)
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등록번호 |
US-7641516
(2010-02-11)
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발명자
/ 주소 |
- Scott, Jason
- Rountree, Timothy D.
- Gannon, Joshua Storm
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출원인 / 주소 |
|
대리인 / 주소 |
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인용정보 |
피인용 횟수 :
5 인용 특허 :
15 |
초록
▼
A connector (200) is provided that comprises a dielectric body (DB), pins (302), and a plate (800). Each pin is captured within DB (404) so as to extend therethrough. Each pin is defined by a pair of nubs (410, 510) extending from DB's opposing faces (408, 604), respectively. Each nub is movable alo
A connector (200) is provided that comprises a dielectric body (DB), pins (302), and a plate (800). Each pin is captured within DB (404) so as to extend therethrough. Each pin is defined by a pair of nubs (410, 510) extending from DB's opposing faces (408, 604), respectively. Each nub is movable along an axis aligned with an elongated length of the pin. The plate is formed of a planar conductive material secured to DB adjacent to a first opposing face. The plate comprises apertures through which the pins extend in a first direction. At least one aperture is sized and shaped to form an electrical connection between the plate and selected pins. Resilient spring fingers (RSF) are formed on a periphery of the plate. Each RSF (1006) extends away from DB in a direction between a plane defined by the first opposing face and first direction of the pins.
대표청구항
▼
We claim: 1. A low impedance, low-profile connector, comprising: a dielectric body comprising two opposing faces; a plurality of pins formed of a conductive material captured within said dielectric body, each of said plurality of pins extending through said dielectric body and each defining a pair
We claim: 1. A low impedance, low-profile connector, comprising: a dielectric body comprising two opposing faces; a plurality of pins formed of a conductive material captured within said dielectric body, each of said plurality of pins extending through said dielectric body and each defining a pair of nubs, each said nub extending from a respective one of said two opposing faces, each said nub movable along an axis aligned with an elongated length of said pins and resiliently biased in a direction away from said two opposing faces; a plate formed of a planar conductive material secured to said dielectric body adjacent to a first face of said two opposing faces, said plate comprising one or more apertures through which said pins extend in a first direction, said apertures sized and shaped for establishing an electrical connection between said plate and selected ones of said pins; and a plurality of resilient spring fingers comprising projections formed on a periphery of said plate, each of said resilient spring fingers extending away from said dielectric body in a direction between a plane defined by said first face and said first direction of said pins. 2. The low-impedance, low-profile connector according to claim 1, wherein said plate is further comprised of a plurality of retention fingers formed as projections on a periphery of said plate, each of said retention fingers shaped to define a resilient clip configured for engaging a portion of said dielectric body. 3. The low-impedance, low-profile connector according to claim 2, wherein said portion of said dielectric body is a ridge defined on a peripheral portion of said dielectric body adjacent to said first face. 4. The low-impedance, low-profile connector according to claim 1, wherein said plate is further comprised of a plurality of retainers formed of tab-like projections defined on a periphery of said plate, each of said retainers extending beyond a peripheral edge of said dielectric body and configured for securing said connector to a chassis. 5. The low-impedance, low-profile connector according to claim 1, wherein said dielectric body is comprised of at least one sidewall extending from said first face to a second opposing face, and at least one gasket is provided on said at least one sidewall configured for forming a seal, which prevents the intrusion of environmental contaminants around a periphery of said connector when said connector is installed in a chassis. 6. The low-impedance, low-profile connector according to claim 1, wherein said dielectric body has a cylindrical form. 7. The low-impedance, low-profile connector according to claim 1, wherein said dielectric body is further comprised of an alignment key structure configured for selectively limiting an installed position of said connector within a chassis in which it is to be installed. 8. The low-impedance, low-profile connector according to claim 1, wherein said resilient spring fingers have an S-shaped profile. 9. The low-impedance, low-profile connector according to claim 1, wherein said selected ones of said pins that form a connection with said plate are ground pins, and said ground pins are longer in length as compared to a remainder of said plurality of pins. 10. The low-impedance, low-profile connector according to claim 1, where an end of said resilient spring fingers distal from said dielectric body is approximately aligned with an end of said nubs distal from said dielectric body. 11. A low impedance, low-profile connector, comprising: a dielectric body comprising two opposing faces; a plurality of pins formed of a conductive material captured within said dielectric body, each of said plurality of pins extending through said dielectric body and each defining a pair of nubs, each said nub extending from a respective one of said two opposing faces, each said nub movable along an axis aligned with an elongated length of said pins and resiliently biased in a direction away from said two opposing faces; a plate formed of a planar conductive material secured to said dielectric body adjacent to a first face of said two opposing faces, said plate comprising one or more apertures through which said pins extend in a first direction, said apertures sized and shaped for establishing an electrical connection between said plate and selected ones of said pins; and a plurality of resilient spring fingers comprising projections formed on a periphery of said plate, each of said resilient spring fingers extending away from said dielectric body in a direction between a plane defined by said first face and said first direction of said pins; wherein said plate is further comprised of a plurality of retention fingers formed as projections on a periphery of said plate, each of said retention fingers shaped to define a resilient clip configured for engaging a portion of said dielectric body. 12. The low-impedance, low-profile connector according to claim 11, wherein said plate is further comprised of a plurality of retainers formed of tab-like projections defined on a periphery of said plate, said retainers extending beyond a peripheral edge of said dielectric body and configured for securing said connector to a chassis. 13. The low-impedance, low-profile connector according to claim 11, wherein said dielectric body is comprised of at least one sidewall extending from said first face to a second opposing face, and at least one gasket is provided on said at least one sidewall configured for forming a seal, which prevents the intrusion of environmental contaminants around a periphery of said connector when said connector is installed in a chassis. 14. The low-impedance, low-profile connector according to claim 11, wherein said dielectric body has a cylindrical form. 15. The low-impedance, low-profile connector according to claim 11, wherein said dielectric body is further comprised of an alignment key structure configured for selectively limiting an installed position of said connector within a chassis in which it is to be installed. 16. The low-impedance, low-profile connector according to claim 11, wherein said resilient spring fingers have an S-shaped profile. 17. The low-impedance, low-profile connector according to claim 11, wherein said selected ones of said pins that form a connection with said plate are ground pins, and said ground pins are longer in length as compared to a remainder of said plurality of pins. 18. The low-impedance, low-profile connector according to claim 11, where an end of said resilient spring fingers distal from said dielectric body is approximately aligned with an end of said nubs distal from said dielectric body. 19. A low impedance, low-profile connector, comprising: a cylindrically shaped dielectric body comprising two opposing faces; a plurality of pins formed of a conductive material captured within said dielectric body, each of said plurality of pins extending through said dielectric body and each defining a pair of nubs, each said nub extending from a respective one of said two opposing faces, each said nub movable along an axis aligned with an elongated length of said pins and resiliently biased in a direction away from said two opposing faces; a plate formed of a planar conductive material secured to said dielectric body adjacent to a first face of said two opposing faces, said plate comprising one or more apertures through which said pins extend in a first direction, said apertures sized and shaped for establishing an electrical connection between said plate and selected ones of said pins; a plurality of S-shaped resilient spring fingers comprising projections formed on a periphery of said plate, each of said resilient spring fingers extending away from said dielectric body in a direction between a plane defined by said first face and said first direction of said pins; a plurality of retention fingers formed as projections on a periphery of said plate, each of said retention fingers shaped to define a resilient clip configured for engaging a portion of said dielectric body; and a plurality of retainers formed of tab-like projections defined on a periphery of said plate, said retainers extending beyond a peripheral edge of dielectric body and configured for securing said connector to a chassis; wherein said dielectric body is comprised of at least one sidewall extending from said first face to a second opposing face, and at least one gasket is provided on said at least one sidewall configured for forming a seal, which prevents the intrusion of environmental contaminants around a periphery of said connector when said connector is installed in a chassis. 20. A low impedance, low-profile connector, comprising: a dielectric body comprising two opposing surfaces; a plurality of electrically conductive pins integrated within said dielectric body so as to have a first end extending away from a first one of said opposing surfaces and a second end extending away from a second one of said opposing surfaces; and a plate formed of an electrically conductive material and comprising a plurality of retention fingers defining resilient clips configured for engaging an engagement surface of a slot formed in said dielectric body so as to have at least one surface of said plate adjacent to said first one of said opposing surfaces.
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