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A package for a semiconductor chip or other heat producing device has a supporting substrate to which the devices mount and electrically connect. An enclosure is formed over the heat producing devices and filled with a supercritical fluid that transports heat from the devices to a heat sink in therm

A package for a semiconductor chip or other heat producing device has a supporting substrate to which the devices mount and electrically connect. An enclosure is formed over the heat producing devices and filled with a supercritical fluid that transports heat from the devices to a heat sink in thermal contact with the enclosure.

대표청구항 ▼

The invention claimed is: 1. A package for an electronic device which produces heat during its operation, which comprises: a substrate containing electrical conductors; means for mounting the electronic device to the substrate and electrically connecting the electronic device to the conductors ther

The invention claimed is: 1. A package for an electronic device which produces heat during its operation, which comprises: a substrate containing electrical conductors; means for mounting the electronic device to the substrate and electrically connecting the electronic device to the conductors therein; an enclosure disposed over the top surface of the substrate to form an enclosed space; means for cooling a wall of the enclosure; and a working fluid disposed in the enclosure; wherein the electronic device is operated to bring the working fluid above a critical temperature and critical pressure such that the working fluid is in a supercritical fluid state. 2. The package as recited in claim 1 in which the working fluid is electrically insulating and is in direct contact with the electronic device. 3. The package as recited in claim 2 in which the electronic device is an integrated circuit chip. 4. The package as recited in claim 3 in which the integrated circuit chip is mounted with an active surface having exposed wire bonds face up. 5. The package as recited in claim 3 in which the integrated circuit chip is mounted with an active surface face down. 6. The package as recited in claim 1 in which the working fluid is sulfur hexafluoride. 7. The package as recited in claim 1 in which the working fluid is a fluorocarbon. 8. The package as recited in claim 1 which includes baffles disposed in the enclosure to direct a convective flow of the working fluid therein. 9. The package as recited in claim 1 which includes a pump disposed in the enclosure to increase the flow of working fluid around the electronic device. 10. The package as recited in claim 9 in which a space is formed between the electronic device and the substrate and the pump is positioned to increase the flow of working fluid in this space. 11. The package as recited in claim 1 in which heat conductive vias are formed through the substrate and positioned beneath the electronic device.