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A position measuring apparatus includes a holder having storage spaces in which a three-point support member for supporting a backside of a substrate being a mask at three points, and a vacuum chuck member for holding a backside of a substrate being a mask are prepared, a stage on which one of the t

A position measuring apparatus includes a holder having storage spaces in which a three-point support member for supporting a backside of a substrate being a mask at three points, and a vacuum chuck member for holding a backside of a substrate being a mask are prepared, a stage on which one of the three-point support member and the vacuum chuck member prepared in the storage spaces of the holder is mounted, a vacuum pump to hold and chuck the substrate through the vacuum chuck member in a state of being mounted on the stage, and a recognition unit to recognize a position of a pattern written on the substrate supported by the three-point support member mounted on the stage and a position of a pattern written on the substrate held by the vacuum chuck member on the stage.

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What is claimed is: 1. A position measuring apparatus comprising: a holder having storage spaces in which both a first set composed of a three-point support member for supporting a backside of a first substrate being itself a mask for lithography at three points and the first substrate supported on

What is claimed is: 1. A position measuring apparatus comprising: a holder having storage spaces in which both a first set composed of a three-point support member for supporting a backside of a first substrate being itself a mask for lithography at three points and the first substrate supported on the three-point support member, and a second set composed of a vacuum chuck member for holding a backside of a second substrate being itself a mask for lithography and the second substrate held by the vacuum chuck member are prepared; a stage on which one of the first set and the second set selectively loaded from the storage spaces of the holder is mounted; a vacuum pump to hold and chuck the second substrate through the vacuum chuck member in a state of being mounted on the stage; and a recognition unit to recognize a position of a pattern written on the first substrate supported by the three-point support member mounted on the stage and a position of a pattern written on the second substrate held by the vacuum chuck member on the stage. 2. The position measuring apparatus according to claim 1, wherein, when the first and second substrates are used for exposing EUV (Extreme Ultra-Violet) light in an exposing apparatus as an EUV mask, the first and second substrates are held by an electrostatic chuck member having a chucking surface with an area and a shape in the exposing apparatus, and the vacuum chuck member whose chucking backside surface of the second substrate is formed to have an area and a shape in accordance with the area and the shape of the chucking surface of the electrostatic chuck member is prepared in the storage spaces of the holder. 3. The position measuring apparatus according to claim 2, wherein the vacuum chuck member is composed of a material having stiffness harder than stiffness of a material itself used for the electrostatic chuck member. 4. The position measuring apparatus according to claim 1, further comprising a control unit to control a suction force obtained by the vacuum pump. 5. The position measuring apparatus according to claim 1, further comprising a gas supply unit to supply gas through the vacuum chuck member. 6. The position measuring apparatus according to claim 5, wherein the position measuring apparatus controls pressure of a chucking surface of the vacuum chuck member to be higher than an external pressure by using the gas, when removing the second substrate from the vacuum chuck member. 7. The position measuring apparatus according to claim 5, wherein, in a state of the second substrate not being placed on the vacuum chuck member, the position measuring apparatus controls the gas leaking through the vacuum chuck member. 8. The position measuring apparatus according to claim 1, wherein the vacuum chuck member includes a sensor to detect a position of the backside surface of the second substrate. 9. The position measuring apparatus according to claim 8, wherein the sensor is one of an electrostatic capacitance sensor and an optical sensor. 10. The position measuring apparatus according to claim 1, wherein the vacuum chuck member, when holding the backside of the second substrate by the vacuum chuck member, includes a chucking system for holding a central part of the backside firstly and a chucking system for holding a circumference area of the central part secondly. 11. The position measuring apparatus according to claim 10, wherein the primary chucking system and the secondary chucking system have different suction forces when holding the backside surface of the second substrate by the vacuum chuck member. 12. The position measuring apparatus according to claim 10, wherein the secondary chucking system adsorbs the circumference area after the primary chucking system adsorbs the central part of the backside when holding the backside of the second substrate by the vacuum chuck member. 13. The position measuring apparatus according to claim 12, wherein the vacuum chuck member includes a sensor to detect that the central part of the backside is adsorbed and attached to the chucking surface of the vacuum chuck member. 14. The position measuring apparatus according to claim 1, wherein a plurality of the vacuum chuck members are prepared in the storage spaces of the holder, and each of the plurality of vacuum chuck members has an identification mark. 15. A positional deviation measuring method comprising: measuring a first positional deviation of a pattern written on a first EUV mask being held by a vacuum chuck member mounted on a stage as a second positional deviation of a pattern printed onto a wafer using the first EUV mask, with selectively using the vacuum chuck member which is prepared in a position measuring apparatus, the vacuum chuck member and a three-point support member being prepared in the position measuring apparatus; and measuring a third positional deviation of a pattern written on a second mask being supported by the three-point support member mounted on the stage as a fourth positional deviation of the pattern on the second mask caused by conditions of a pattern writing apparatus which writes the second mask, with selectively using the three-point support member which is prepared in the position measuring apparatus. 16. The positional deviation measuring method according to claim 15, wherein the vacuum chuck member has a chucking surface whose area and shape are formed to be in accordance with an area and a shape of a chucking surface of a standardized electrostatic chuck member. 17. The positional deviation measuring method according to claim 15, wherein the vacuum chuck member is composed of a material having stiffness harder than stiffness of a low thermal expansion material itself used for an electrostatic chuck member. 18. A positional deviation measuring method comprising: measuring, in a state of a backside of a substrate being held by a vacuum chuck, a positional deviation of a primary pattern that is written after correcting a predicted positional deviation of a pattern written on a front-side surface of the substrate, in the case of the backside surface of the substrate being corrected to be flat by measurement data of the backside topography of the substrate without influence of gravity sag; and measuring, in a state of the backside of the substrate being supported at three points, a positional deviation of a secondary pattern that is written after correcting a predicted positional deviation of a pattern written on the front-side surface of the substrate, in the case of the backside surface of the substrate being not corrected to be flat. 19. The positional deviation measuring method according to claim 18, wherein the vacuum chuck member has a chucking surface whose area and shape are formed to be in accordance with an area and a shape of a chucking surface of a standardized electrostatic chuck member. 20. The positional deviation measuring method according to claim 19, wherein the vacuum chuck member is composed of a material having stiffness harder than stiffness of a low thermal expansion material itself used for an electrostatic chuck member.