초록 ▼

A target assembly including a plurality of target tiles bonded to a backing plate by adhesive, for example of indium or conductive polymer, filled into recesses in the backing plate formed beneath each of the target tiles. A sole peripheral recess formed as a rectangular close band may be formed ins

A target assembly including a plurality of target tiles bonded to a backing plate by adhesive, for example of indium or conductive polymer, filled into recesses in the backing plate formed beneath each of the target tiles. A sole peripheral recess formed as a rectangular close band may be formed inside the tile periphery. Additional recesses may be formed inside the peripheral recess, preferably symmetrically arranged about perpendicular bisectors of rectangular tiles. The depth and width of the recesses may be varied to control the amount of stress and the stress direction.

대표청구항 ▼

The invention claimed is: 1. A sputtering target assembly, comprising: a backing plate; and at least one target tile bonded to said backing plate in a respective tile area thereof and configured for sputtering from the target tile of a material of the target tile; wherein said backing plate is form

The invention claimed is: 1. A sputtering target assembly, comprising: a backing plate; and at least one target tile bonded to said backing plate in a respective tile area thereof and configured for sputtering from the target tile of a material of the target tile; wherein said backing plate is formed with at least one predetermined recess filled with said adhesive. 2. The assembly of claim 1, wherein said at least one target tile comprises a plurality of target tiles with one or more gaps therebetween. 3. The assembly of claim 1, wherein said at least one recess includes an annular recess respectively formed in said respective tile area. 4. The assembly of claim 3, wherein each of said annular recesses comprises two parallel straight first recesses and two parallel straight recesses connected to said first recesses and extending perpendicularly thereto. 5. The assembly of claim 3, wherein said at least one recess includes one or more additional recesses formed inside of and separate from said annular recess. 6. The assembly of claim 5, wherein said one or more additional recesses are substantially symmetrically formed about perpendicular bisectors of said respective tile area. 7. The assembly of claim 5, wherein said one or more additional recesses include one or more straight recesses extending along a first direction. 8. The assembly of claim 5, wherein said one or more additional recesses include a cross-shaped recess. 9. The assembly of claim 8, wherein a cross section of said cross-shaped recess differs from a cross-section of said annular recess in at least one of depth and width. 10. The assembly of claim 8, wherein said cross-shaped recess extends along perpendicular bisectors of said respective tile area. 11. The assembly of claim 8, wherein said cross-shaped recess extends along diagonals of said respective tile area. 12. The assembly of claim 1, wherein said at least one recess has a depth in a range of 0.1 to 0.5 mm. 13. The assembly of claim 1, wherein said at least one recess has an area of between 30 and 45% of said respective tile area. 14. A sputtering target assembly, comprising: a backing plate; and at least one target tile bonded to said backing plate in a respective tile area thereof and configured for sputtering from the target tile of a material of the target tile; wherein said backing plate is formed with at least one predetermined recess filled with said adhesive and wherein said at least one recess includes a first recess and a second recess differing between the in at least one of depth and width. 15. The assembly of claim 1, wherein said at least one tile is substantially rectangularly shaped. 16. The assembly of claim 1, wherein said adhesive comprises a polymer. 17. A sputtering target assembly, comprising: a backing plate configured for attachment to a vacuum chamber, at least one target tile bonded to said backing plate in a respective tile area thereof and configured for sputtering from the target tile of a material of the target tile, wherein the at least one target tile comprises a material to be sputtered in the vacuum chamber, wherein said backing plate is formed with at least one predetermined recess filled with said adhesive; wherein the at least one predetermined recess has a recess area smaller than the respective tile area of the respective tile bonded in the respective tile area, and wherein the at least one predetermined recess extends only partially through the backing plate in each of said tile areas. 18. The assembly of claim 1, wherein the at least one target tile includes a plurality of target tiles, a respective predetermined gap being formed between neighboring ones of the target tiles bonded to the backing plate.