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Showerhead electrode assembly for plasma processing apparatuses 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C23C-016/00
  • C23C-016/455
  • C23C-016/50
  • H01L-021/3065
출원번호 UP-0743062 (2003-12-23)
등록번호 US-7645341 (2010-02-22)
발명자 / 주소
  • Kennedy, William S.
  • Jacob, David E.
출원인 / 주소
  • Lam Research Corporation
대리인 / 주소
    Buchanan Ingersoll & Rooney PC
인용정보 피인용 횟수 : 43  인용 특허 : 39

초록

A showerhead electrode assembly of a plasma processing apparatus includes a thermal control plate attached to a showerhead electrode, and a top plate attached to the thermal control plate. At least one thermal bridge is provided between opposed surfaces of the thermal control plate and the top plate

대표청구항

What is claimed is: 1. A showerhead electrode assembly of a semiconductor substrate processing apparatus, comprising: a top plate; a showerhead electrode comprising a plate; a backing plate including a bottom surface attached to an upper surface of the plate; a thermal control plate including a cen

이 특허에 인용된 특허 (39)

  1. Lily L. Pang ; Thomas K. Cho ; Tetsuya Ishikawa, Apparatus for cleaning a semiconductor process chamber.
  2. Foad Majeed A.,GBX, Boron ion sources for ion implantation apparatus.
  3. Schoepp Alan M. ; Denty ; Jr. William M. ; Barnes Michael, Chamber liner for semiconductor process chambers.
  4. Kumar Ananda H. ; Narendrnath Kadthala R. ; Shamouilian Shamouil, Compliant bond structure for joining ceramic to metal.
  5. Tushar Mandrekar ; Anish Tolia ; Nitin Khurana, Direct temperature control for a component of a substrate processing chamber.
  6. Ishikawa Tetsuya ; Staryuk Pavel ; Hanawa Hiroji, Dome: shape and temperature controlled surfaces.
  7. Kennedy, William S.; Jacob, David E., Electrode assembly for plasma processing apparatus.
  8. Lenz Eric H. (San Jose CA) Calvisi Michael L. (Union City CA) Miller Ivo A. (San Jose CA) Frazier Robert A. (Fremont CA), Electrode clamping assembly and method for assembly and use thereof.
  9. Lilleland John ; Hubacek Jerome S. ; Kennedy William S., Electrode for plasma processes and method for a manufacture and use thereof.
  10. Lilleland John ; Hubacek Jerome S. ; Kennedy William S., Electrode for plasma processes and method for manufacture and use thereof.
  11. Zhao Jun ; Schreiber Alex, Faceplate thermal choke in a CVD plasma reactor.
  12. Mercuri Robert Angelo, Flexible graphite sheet with decreased anisotropy.
  13. John M. White ; Ernst Keller ; Wendell T. Blonigan, Flexibly suspended gas distribution manifold for plasma chamber.
  14. Dhindsa Rajinder ; Hao Fangli ; Lenz Eric, Gas distribution apparatus for semiconductor processing.
  15. Fangli Hao ; Rajinder Dhindsa, Gas distribution apparatus for semiconductor processing.
  16. Jerome Hubacek, Gas distribution apparatus for semiconductor processing.
  17. Rajinder Dhindsa ; Fangli Hao ; Eric Lenz, Gas distribution apparatus for semiconductor processing.
  18. MacLeish Joseph H. (2529 Wild Horse Dr. San Ramon CA 94523) Mailho Robert D. (14338 Kirk Alan La. Sonora CA 95370) Sanganeria Mahesh K. (1035 Astez Ave. ; #1145 Sunnyvale CA 94086), Gas injection system for CVD reactors.
  19. Kenneth Collins ; Michael Rice ; Douglas Buchberger ; Craig Roderick ; Eric Askarinam ; Gerhard Schneider ; John Trow ; Joshua Tsui ; Dennis Grimard ; Gerald Yin ; Robert Wu, Inductively coupled RF Plasma reactor having an overhead solenoidal antenna and modular confinement magnet liners.
  20. Wicker Thomas E. ; Maraschin Robert A. ; Kennedy William S., Low contamination high density plasma etch chambers and methods for making the same.
  21. Wicker, Thomas E.; Maraschin, Robert A.; Kennedy, William S., Low contamination high density plasma etch chambers and methods for making the same.
  22. Golovato Stephen N. ; Milgate ; III Robert W. ; Consoli Paul Louis, Method and apparatus for insulating a high power RF electrode through which plasma discharge gases are injected into a processing chamber.
  23. John Lilleland ; Jerome S. Hubacek ; William S. Kennedy, Method of manufacturing assembly for plasma reaction chamber and use thereof.
  24. Terasaki Masato,JPX ; Tsutsuguchi Kazunori,JPX, Method of plasma processing a substrate placed on a substrate table.
  25. Lenz Eric H. (San Jose CA) Dible Robert D. (Fremont CA), Plasma etching apparatus utilizing plasma confinement.
  26. Ishida Toshimichi,JPX ; Yamada Yuichiro,JPX ; Takisawa Takahiro,JPX ; Tanabe Hiroshi,JPX, Plasma processing apparatus.
  27. Barnes, Michael; Palagashvili, David, Plasma reactor electrode.
  28. Fukunaga Yukio,JPX ; Shinozaki Hiroyuki,JPX ; Tsukamoto Kiwamu,JPX ; Saitoh Masao,JPX, Reactant gas ejector head.
  29. Hao Fangli ; Dhindsa Rajinder ; Pourhashemi Javad, Reaction chamber component having improved temperature uniformity.
  30. Umotoy Salvador ; Nguyen Anh N. ; Tran Truc T. ; Chung-Lei Lawrence ; Chang Mei, Reactor optimized for chemical vapor deposition of titanium.
  31. Zhao Jun ; Sinha Ashok ; Tepman Avi ; Chang Mei ; Luo Lee ; Schreiber Alex ; Sajoto Talex ; Wolff Stefan ; Dornfest Charles ; Danek Michal, Removable pumping channel liners within a chemical vapor deposition chamber.
  32. William S. Kennedy ; Robert A. Maraschin ; Jerome S. Hubacek, Semiconductor processing equipment having tiled ceramic liner.
  33. Tanaka Sumi,JPX ; Nakatsuka Sakae,JPX ; Tachibana Mitsuhiro,JPX, Shower head.
  34. Szapucki Matthew P. ; Kulkaski Richard ; Hadley Trevor J. ; Santorelli Mark Anthony, Showerhead electrode assembly for plasma processing.
  35. Dhindsa, Rajinder; Lenz, Eric, Showerhead electrode design for semiconductor processing reactor.
  36. Szapucki Matthew Peter ; Kulkaski Richard ; Hadley Trevor J. ; Santorelli Mark Anthony ; Stoever Robert H., Showerhead electrode for plasma processing.
  37. Rajinder Dhindsa ; Mukund Srinivasan ; Aaron Eppler ; Eric Lenz, Stepped upper electrode for plasma processing uniformity.
  38. Yasushi Yagi JP; Takeshi Sakuma JP; Wataru Okase JP; Masayuki Kitamura JP; Hironori Yagi JP; Eisuke Morisaki JP, Thermal treatment method and apparatus.
  39. Rice Michael ; Askarinam Eric ; Schneider Gerhard ; Collins Kenneth S., Vacuum processing chamber having multi-mode access.

이 특허를 인용한 특허 (43)

  1. Shih, Hong; Peng, G. Grant; Ren, Daxing, Actively heated aluminum baffle component having improved particle performance and methods of use and manufacture thereof.
  2. Zhou, Xiaoping; Dietz, Jeffrey William, Apparatus for etching high aspect ratio features.
  3. de la Llera, Anthony; Mankidy, Pratik; Dhindsa, Rajlnder; Kellogg, Michael C.; Bettencourt, Gregory R.; Patrick, Roger, Cam-locked showerhead electrode and assembly.
  4. den Hartog Besselink, Edwin; Garssen, Adriaan; Dirkmaat, Marco, Cassette holder assembly for a substrate cassette and holding member for use in such assembly.
  5. Patrick, Roger; Bettencourt, Gregory R.; Kellogg, Michael C., Clamped monolithic showerhead electrode.
  6. Patrick, Roger; Bettencourt, Gregory R.; Kellogg, Michael C., Clamped monolithic showerhead electrode.
  7. Kadkhodayan, Babak; Dhindsa, Rajinder; de la Llera, Anthony; Kellogg, Michael C., Clamped showerhead electrode assembly.
  8. Kadkhodayan, Babak; Dhindsa, Rajinder; de la Llera, Anthony; Kellogg, Michael C., Clamped showerhead electrode assembly.
  9. Larson, Dean Jay; Stevenson, Tom; Wang, Victor, Composite showerhead electrode assembly for a plasma processing apparatus.
  10. Larson, Dean Jay; Stevenson, Tom; Wang, Victor, Composite showerhead electrode assembly for a plasma processing apparatus.
  11. Ehrlich, Darrell; Brown, Daniel Arthur; Kenworthy, Ian, Compression member for use in showerhead electrode assembly.
  12. Ehrlich, Darrell; Brown, Daniel Arthur; Kenworthy, Ian, Compression member for use in showerhead electrode assembly.
  13. Larson, Dean J.; Stevenson, Tom; Wang, Victor, Film adhesive for semiconductor vacuum processing apparatus.
  14. Larson, Dean J.; Stevenson, Tom; Wang, Victor, Film adhesive for semiconductor vacuum processing apparatus.
  15. Milligan, Robert Brennan, Formation of boron-doped titanium metal films with high work function.
  16. Bettencourt, Gregory R.; Bhattacharyya, Gautam; Gosselin, Simon; Chao, Sandy, Gasket with positioning feature for clamped monolithic showerhead electrode.
  17. Nam, Sang Ki; Dhindsa, Rajinder; Bise, Ryan, Heat transfer plate for a showerhead electrode assembly of a capacitively coupled plasma processing apparatus.
  18. Gomm, Troy Alan; Thomas, Timothy, High temperature substrate pedestal module and components thereof.
  19. McMillin, Brian; Tong, Jose V.; Wang, Yen-Kun Victor, Method for reduction of voltage potential spike during dechucking.
  20. Shih, Hong; Daugherty, John; Larson, Dean J.; Huang, Tuochuan; Avoyan, Armen; Chang, Jeremy; Ramanathan, Sivakami; Anderson, Robert; Fang, Yan; Outka, Duane; Mulgrew, Paul, Method of cleaning aluminum plasma chamber parts.
  21. Lee, Choong Man; Yoo, Yong Min; Kim, Young Jae; Chun, Seung Ju; Kim, Sun Ja, Method of forming metal interconnection and method of fabricating semiconductor apparatus using the method.
  22. Dhindsa, Rajinder, Method of joining components for a composite showerhead electrode assembly for a plasma processing apparatus.
  23. Dhindsa, Rajinder, Method of processing a semiconductor substrate in a plasma processing apparatus.
  24. Chun, Seung Ju; Yoo, Yong Min; Choi, Jong Wan; Kim, Young Jae; Kim, Sun Ja; Lim, Wan Gyu; Min, Yoon Ki; Lee, Hae Jin; Yoo, Tae Hee, Method of processing a substrate and a device manufactured by using the method.
  25. Kohen, David; Profijt, Harald Benjamin, Methods for depositing a doped germanium tin semiconductor and related semiconductor device structures.
  26. Raisanen, Petri; Givens, Michael Eugene, Methods for forming a transition metal nitride film on a substrate by atomic layer deposition and related semiconductor device structures.
  27. Dhindsa, Rajinder; Kozakevich, Felix; Rogers, James H.; Trussell, David, Plasma confinement rings having reduced polymer deposition characteristics.
  28. Stevenson, Tom; Dickens, Michael, Plasma processing chamber component having adaptive thermal conductor.
  29. Margetis, Joe; Tolle, John; Bartlett, Gregory; Bhargava, Nupur, Process for forming a film on a substrate using multi-port injection assemblies.
  30. Alokozai, Fred; Milligan, Robert Brennan, Process gas management for an inductively-coupled plasma deposition reactor.
  31. Mikhaylichenko, Katrina; deLarios, John, Proximity head heating method and apparatus.
  32. Larson, Dean J.; Brown, Daniel; Comendant, Keith; Wang, Victor, Quartz guard ring centering features.
  33. Stevenson, Thomas R.; de la Llera, Anthony; Ullal, Saurabh, Showerhead electrode assemblies for plasma processing apparatuses.
  34. Stevenson, Tom; Dhindsa, Rajinder, Showerhead electrode assemblies for plasma processing apparatuses.
  35. Stevenson, Tom; Dhindsa, Rajinder, Showerhead electrode assemblies for plasma processing apparatuses.
  36. Nam, Sang Ki; Dhindsa, Rajinder; Bise, Ryan, Showerhead electrode assembly in a capacitively coupled plasma processing apparatus.
  37. Augustino, Jason; De La Llera, Anthony; Ronne, Allan K.; Kim, Jaehyun; Dhindsa, Rajinder; Wang, Yen-Kun; Ullal, Saurabh J.; Norell, Anthony J.; Comendant, Keith; Denty, Jr., William M., Showerhead electrode assembly with gas flow modification for extended electrode life.
  38. Augustino, Jason; de la Llera, Anthony; Ronne, Allan K.; Kim, Jaehyun; Dhindsa, Rajinder; Wang, Yen-Kun; Ullal, Saurabh J.; Norell, Anthony J.; Comendant, Keith; Denty, Jr., William M., Showerhead electrode assembly with gas flow modification for extended electrode life.
  39. Fischer, Andreas; Dhindsa, Rajinder, Showerhead electrodes and showerhead electrode assemblies having low-particle performance for semiconductor material processing apparatuses.
  40. Gomm, Troy Alan; Linebarger, Jr., Nick Ray, Substrate pedestal module including backside gas delivery tube and method of making.
  41. Qin, Wenjun, Systems and methods for distributing gas in a chemical vapor deposition reactor.
  42. Dhindsa, Rajinder; Povolny, Henry; Antolik, Jerry K., Temperature control module using gas pressure to control thermal conductance between liquid coolant and component body.
  43. De La Llera, Anthony; Ronne, Allan K.; Kim, Jaehyun; Augustino, Jason; Dhindsa, Rajinder; Wang, Yen-Kun; Ullal, Saurabh J.; Norell, Anthony J.; Comendant, Keith; Denty, Jr., William M., Upper electrode backing member with particle reducing features.
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