IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
UP-0493228
(2006-07-26)
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등록번호 |
US-7656915
(2010-03-31)
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발명자
/ 주소 |
- Coleman, Steven M.
- Stephens, Edward F.
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출원인 / 주소 |
- Northrop Grumman Space & Missions Systems Corp.
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대리인 / 주소 |
|
인용정보 |
피인용 횟수 :
7 인용 특허 :
94 |
초록
▼
A laser diode package includes a laser diode, a cooler, and a metallization layer. The laser diode is used for converting electrical energy to optical energy. The cooler receives and routes a coolant from a cooling source via internal channels. The cooler includes a plurality of ceramic sheets and a
A laser diode package includes a laser diode, a cooler, and a metallization layer. The laser diode is used for converting electrical energy to optical energy. The cooler receives and routes a coolant from a cooling source via internal channels. The cooler includes a plurality of ceramic sheets and a highly thermally-conductive sheet. The ceramic sheets are fused together and the thermally-conductive sheet is attached to a top ceramic sheet of the plurality of ceramic sheets. The metallization layer has at least a portion on the thermally-conductive sheet. The portion is electrically coupled to the laser diode for conducting the electrical energy to the laser diode.
대표청구항
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What is claimed is: 1. A laser diode package comprising: a laser diode for converting electrical energy to optical energy; a cooler including an exposed sheet and a plurality of ceramic sheets, the exposed sheet being a material that is electrically non-conductive and having a coefficient of therma
What is claimed is: 1. A laser diode package comprising: a laser diode for converting electrical energy to optical energy; a cooler including an exposed sheet and a plurality of ceramic sheets, the exposed sheet being a material that is electrically non-conductive and having a coefficient of thermal conductivity greater than the plurality of ceramic sheets, the exposed sheet including a region for receiving the laser diode, the plurality of ceramic sheets being fused together and the exposed sheet being attached to a top ceramic sheet of the plurality of ceramic sheets, the ceramic sheets being made of a material selected from the group consisting of low temperature cofired ceramics and high temperature cofired ceramics, each of the ceramic sheets and the exposed sheet having an inlet hole for receiving a non-deionized coolant fluid from a cooling source and an outlet hole for returning the coolant fluid to the cooling source, a number of the ceramic sheets having one or more multi-directional apertures for distributing the coolant fluid within the cooler in a direction that is transverse to the direction of the flow of the coolant fluid within the inlet hole, each of the multi-directional apertures extending entirely through the thickness of the respective ceramic sheet, the multi-directional apertures including a first multi-directional aperture extending transversely away from the inlet hole of one of the ceramic sheets, the multi-directional apertures forming a thee-dimensional flow path through the plurality of ceramic sheets that directs the coolant fluid from the first multi-directional aperture to the outlet hole, one ceramic sheet including a plurality of perforations each of which is substantially smaller than the apertures, each of the plurality of perforations in the one ceramic sheet creating a corresponding individual coolant stream that flows through the one ceramic sheet and impinges on a back surface of the exposed sheet within the laser-diode receiving region, the plurality of perforations creating a turbulent flow adjacent to the back surface of the exposed sheet, the coolant fluid returning in a direction toward the one ceramic sheet after impinging on the exposed sheet; and a metallization layer on the cooler on at least the laser-diode receiving region of the the exposed sheet for conducting the electrical energy to the laser diode. 2. The laser diode package of claim 1, wherein the exposed sheet is selected from a group consisting of a BeO sheet and a diamond sheet. 3. The laser diode package of claim 1, wherein the plurality of perforations includes at least three perforations aligned in a first direction and at least six perforations aligned in a second direction to form an array of at least 18 perforations. 4. The laser diode package of claim 1, wherein the metallization layer is selected from a group of materials consisting of gold, gold alloys, platinum, platinum alloys, nickel, and nickel alloys. 5. The laser diode package of claim 1, wherein the metallization layer extends entirely around the cooler and is located on a bottom ceramic sheet that opposes the exposed sheet. 6. The laser diode package of claim 1, further comprising an electrically non-conductive substrate adjacent to the laser diode for relieving stress when coupling the laser diode package to a second laser diode package in an array of laser diode packages. 7. The laser diode package of claim 6, further comprising a spring connector connected to the laser diode and the substrate, the spring connector conducting electrical energy from the laser diode to a surface of the second laser diode package. 8. The laser diode package of claim 7, in combination with the second laser diode package to form an array of laser diode packages, the array including an alignment pin extending through openings in the laser diode packages for aligning the laser diode packages. 9. A method of manufacturing a laser diode package, comprising: providing a cooler comprised of a plurality of bonded ceramic sheets and a thermally-conductive sheet, the thermally-conductive sheet being bonded to a top ceramic sheet of the plurality of ceramic sheets, the thermally-conductive sheet having a higher coefficient of thermal conductivity than the plurality of ceramic sheets, each of the bonded ceramic sheets containing an inlet hole and one or more apertures, the apertures on adjacent ceramic sheets partially overlapping to define a plurality of internal channels within the cooler, the plurality of internal channels creating a three-dimensional coolant flow path within the cooler that moves a coolant transversely away from the inlet holes, the coolant flow path including a first portion that is in a direction perpendicular to and toward the thermally-conductive sheet and a second portion that is in a direction perpendicular to and away from the thermally-conductive sheet, the first portion of the coolant flow path being defined by a plurality of individual fluid streams created by an array of perforations within one of the ceramic sheets, each of the perforations being smaller than the apertures, the array including a plurality of perforations aligned in a first direction and plurality of perforations aligned in a second direction, the plurality of individual fluid streams flowing through the plurality of perforations within the one of the ceramic sheets creating a turbulent fluid-flow adjacent to the thermally-conductive sheet; applying a metallization layer to the thermally-conductive sheet; and attaching a laser diode to the metallization layer. 10. The method of claim 9, wherein the thermally-conductive sheet is diamond. 11. The method of claim 9, wherein the plurality of ceramic sheets is selected from a group of materials consisting of a low-temperature cofired ceramic and a high-temperature cofired ceramic. 12. The method of claim 9, wherein the plurality of ceramic sheets are comprised of glass. 13. A laser diode package comprising: a laser diode for converting electrical energy to optical energy; a cooler for receiving a coolant from a cooling source, the cooler including internal channels for routing the coolant against a laser-diode mounting region within an exposed sheet, the cooler comprised of a plurality of electrically non-conductive sheets being fused together and including a first sheet having a first aperture and a second aperture, the first aperture being separate from the second aperture, each of the first aperture and the second aperture receiving the coolant from a coolant inlet hole and distributing the coolant within the cooler in a direction that is transverse to the direction of fluid flow in the coolant inlet hole, and a second sheet adjacent to the first sheet and having a third aperture for distributing the coolant in a direction that is transverse to the direction of fluid flow in the coolant inlet hole, the third aperture receiving the coolant from the first aperture and transmitting the coolant to the second aperture, a stream-forming sheet that includes an array of perforations forming a plurality of individual fluid-streams that flow through the stream-forming sheet and impinge on the laser-diode mounting region to create a turbulent flow adjacent to the laser-diode mounting region, each of the perforations being smaller than the first, second, and third apertures, and the exposed sheet having a higher thermal conductivity than the plurality of sheets and being attached to a top sheet of the plurality of sheets; and a metallization layer on the laser-diode mounting region of the exposed sheet for conducting the electrical energy to the laser diode. 14. The laser diode package of claim 13, wherein the material of the plurality of sheets has a coefficient of thermal expansion that is close to the coefficient of thermal expansion for the material of the laser diode. 15. The laser diode package of claim 13, wherein the plurality of sheets are made of a low-temperature cofired ceramic. 16. The laser diode package of claim 1, wherein the array of perforations includes at least three perforations aligned in a first direction and at least six perforations aligned in a second direction. 17. The laser diode package of claim 1, wherein at least two sheets of the plurality of ceramic sheets include a plurality of isolated multi-directional apertures, the isolated multi-directional apertures being discontinuous from each other and from the inlet hole and the outlet hole. 18. The laser diode package of claim 1, wherein each individual perforation of the array of perforations has a dimension on the order of several hundred microns. 19. A laser diode package comprising: a laser diode for converting electrical energy to optical energy; a cooler comprising a laser-diode mounting region within which the laser diode is mounted, a coolant inlet, a coolant outlet, and a plurality of ceramic sheets that are fused together, at least some of the ceramic sheets having one or more multi-directional apertures extending entirely through the thickness of the respective ceramic sheet, the multi-directional apertures on adjacent ceramic sheets overlapping for forming a three- dimensional flow path within the cooler that leads from the coolant inlet to the coolant outlet, the three-dimensional flow path routing a coolant to the laser-diode mounting region, one of the ceramic sheets being a stream- forming sheet that includes a plurality of perforations, the coolant flowing through the plurality of perforations in the stream-forming sheet to create a plurality of individual coolant streams directed toward the laser-diode mounting region, the plurality of perforations creating a turbulent flow adjacent to the laser-diode mounting region by forming the individual coolant streams impinging on the laser-diode mounting region, the coolant returning in a direction toward the stream-forming sheet after impinging on the laser-diode mounting region; and a metallic conduction path on the cooler for conducting the electrical energy to the laser diode. 20. The laser diode package of claim 19, wherein the plurality of ceramic sheets are made of a low-temperature cofired ceramic. 21. The laser diode package of claim 19, wherein a top sheet of the plurality of ceramic sheets is made of a material having a coefficient of thermal conductivity greater than the remaining ones of the ceramic sheets, the top sheet including at least a portion of the laser-diode mounting region. 22. The laser diode package of claim 19, wherein the plurality of perforations are provided in an array of perforations that includes at least three perforations aligned in a first direction and at least six perforations aligned in a second direction. 23. The laser diode package of claim 19, wherein each of the perforations has a dimension on the order of several hundred microns.
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