[특허]Deformable duct guides that accommodate electronic connection lines

[미국특허] Deformable duct guides that accommodate electronic connection lines 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	H05K-007/20
출원번호	UP-0221945 (2008-08-07)
등록번호	US-7660117 (2010-04-02)
발명자 / 주소	Werner, Douglas E. Hom, James Choi, Hae-won Lin, Tien Chih (Eric) Brewer, Richard Grant
출원인 / 주소	Cooligy Inc.
대리인 / 주소	Haverstock & Owens LLP
인용정보	피인용 횟수 : 26 인용 특허 : 31

초록 ▼

A duct work assembly is coupled to an end of an electronics enclosure that houses one or more heat generating devices, such as electronics servers. The duct work assembly includes individual duct guides that each have a deformable end, which is configured to locally deform around the electrical connection lines extending from the rear of one or more electronics servers. The deformable end can be made of bristles, as in a brush, or foam that includes slits and/or holes.

대표청구항 ▼

What is claimed is: 1. A cooling assembly comprising: a. an electronics enclosure including a first side and an exposed second side, wherein the electronics enclosure includes one or more heat generating devices, each heat generating device having one or more electrical connection lines extending from a rear side, further wherein the one or more heat generating devices are aligned such the rear side of each heat generating device is facing the second side of the electronics enclosure; and b. a plurality of duct guides, each duct guide includes a deformable first end configured to locally deform about electrical connection lines coincident with the first end. 2. The cooling assembly of claim 1 wherein at least one of the plurality of duct guides comprises foam. 3. The cooling assembly of claim 1 wherein at least one of the plurality of duct guides includes a plurality of slits, each slit extends through an entire thickness of the duct guide and extends a partial length into the duct guide starting from the first end, wherein each slit is configured to accommodate one or more electrical connection lines. 4. The cooling assembly of claim 3 wherein the at least one of the plurality of duct guides further includes a plurality of holes, each hole extends through an entire thickness of the duct guide, and one hole is positioned at an end of each slit. 5. The cooling assembly of claim 1 wherein at least one of the plurality of duct guides includes a plurality of holes, each hole extends through an entire thickness of the duct guide, wherein each hole is configured to accommodate one or more electrical connection lines. 6. The cooling assembly of claim 1 wherein at least one of the plurality of duct guides comprises bristles. 7. The cooling assembly of claim 1 wherein at least one or the plurality of duct guides comprises a second end comprising a rigid structure. 8. The cooling assembly of claim 1 further comprising a cooling panel including a plurality of heat exchangers, wherein the plurality of duct guides are coupled between the cooling panel and the second side of the electronics enclosure. 9. The cooling assembly of claim 1 wherein at least one of the plurality of duct guides is compressible. 10. The cooling assembly of claim 9 wherein the duct guide in an uncompressed state is wider than the electronics enclosure such that when the duct guide is in a compressed state and positioned within the electronics enclosure, an outward decompression force is exerted on the electronics enclosure thereby holding the compressed duct guide in place. 11. The cooling assembly of claim 1 wherein the deformable first end of one or more duct guides is positioned proximate to the rear side of the one or more heat generating devices. 12. The cooling assembly of claim 1 wherein the deformable first end of one or more duct guides is positioned distal from the rear side of the one or more heat generating devices.

이 특허에 인용된 특허 (31) 인용/피인용 타임라인 분석

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Chu,Richard C.; Ellsworth, Jr.,Michael J.; Porter,Donald W.; Schmidt,Roger R.; Simons,Robert E., Apparatus and method for facilitating cooling of an electronics rack employing a heat exchange assembly mounted to an outlet door cover of the electronics rack.
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Heitzig Claus-Peter (Germering DEX), Apparatus for the cooling of electronic assemblies or components.
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Wang,David G., Delivering chilled air to components in a hardware cabinet.
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DiFrancesco Lawrence (Hayward CA) Helber ; Jr. Carlyle L. (Fountain Valley CA), Electroformed high efficiency heat exchanger and method for making.
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Clark William E. (401 Hyder St. ; N.E. Palm Bay FL 32907), Liquid-cooled, flat plate heat exchanger.
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Chu, Richard C.; Ellsworth, Jr., Michael J.; Furey, Edward; Schmidt, Roger R.; Simons, Robert E., Method and apparatus for combined air and liquid cooling of stacked electronics components.
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Baer,Daniel B., Method and apparatus for cooling electronic enclosures.
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Chu, Richard C.; Ellsworth, Jr., Michael J.; Schmidt, Roger R.; Simons, Robert E., Method and system for cooling electronics racks using pre-cooled air.
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Buller Marvin L. (Austin TX) McNelis Barbara J. (Austin TX) Snyder Campbell H. (Austin TX), Method for attaching heat sink to plastic packaged electronic component.
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Chu, Richard C.; Ellsworth, Jr., Michael J.; Furey, Edward; Schmidt, Roger R.; Simons, Robert E., Method for combined air and liquid cooling of stacked electronics components.
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Little William A. (Palo Alto CA), Micro miniature refrigerators.
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Rasmussen,Neil; Germagian,Mark H.; Avelar,Victor P.; Donovan,James Edward, Rack enclosure.
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Pace Salvatore J. (Wilmington DE), Silicon semiconductor wafer for analyzing micronic biological samples.
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Lecke, Markus; Wagner, Steffen, Switch cabinet or cover with an air-conditioning unit.
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Baldwin, Jr.,Richard G., Vented and ducted sub-rack support member.
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[미국특허] Deformable duct guides that accommodate electronic connection lines 원문보기