초록 ▼

Plating baths containing a mixture of leveling agents, where the mixture includes a first level agent having a first diffusion coefficient and a second leveling agent having a second diffusion coefficient, are provided. Such plating baths deposit a metal layer, particularly a copper layer, that is s

Plating baths containing a mixture of leveling agents, where the mixture includes a first level agent having a first diffusion coefficient and a second leveling agent having a second diffusion coefficient, are provided. Such plating baths deposit a metal layer, particularly a copper layer, that is substantially planar across a range of electrolyte concentrations. Methods of depositing metal layers using such plating baths are also disclosed. These baths and methods are useful for providing a planar layer of copper on a substrate having small apertures, such as an electronic device.

대표청구항 ▼

What is claimed is: 1. A reaction product of an amine with a polyepoxide having a formula: wherein R is (C1-C10)alkyl; and R2 and R3 are independently chosen from H and R, wherein n=1-20. 2. The compound of claim 1, wherein the amine is chosen from dialkylamines, trialkylamines, diarylamines,

What is claimed is: 1. A reaction product of an amine with a polyepoxide having a formula: wherein R is (C1-C10)alkyl; and R2 and R3 are independently chosen from H and R, wherein n=1-20. 2. The compound of claim 1, wherein the amine is chosen from dialkylamines, trialkylamines, diarylamines, imidazole, triazole, tetrazole, benzimidazole, benzotriazole, piperidine, morpholine, piperazine, pyridine, oxazole, benzoxazole, pyrimidine, quonoline and isoquinoline. 3. The compound of claim 1, wherein the polyepoxide is chosen from 1,4-butanediol, digylcidyl ether, ethylene glycol diglycidyl ether, diethylene glycol diglycidyl ether, triethylene glycol diglycidyl ether, glycerol diglycidyl ether, neopentyl glycol diglycidyl ether, propylene glycol diglycidyl ether, dipropylene glycol diglycidyl ether, and poly(propylene glycol) diglycidyl ether. 4. A metal plating bath containing the reaction product of claim 1.